Advanced Semiconductor Package & Test

Advanced Package Electrical Design for RDL Interposer

Our research in advanced semiconductor package electrical design focuses on Redistribution Layer (RDL) interposers, which play a critical role in high-density integration for heterogeneous packaging solutions. We explore innovative RDL architectures, including fine-pitch signal routing, impedance-controlled interconnects, and power delivery optimization to enhance signal integrity and power efficiency. Our work leverages electromagnetic simulation, design optimization, and experimental validation to address challenges such as crosstalk, IR drop, and thermal-electrical co-design. By developing advanced modeling techniques assisted by deep learning, we aim to push the boundaries of RDL interposer technology to support next-generation AI semiconductor.

#AISE405_Semiconductor_Package_and_Test 

Reliable Electrical Characterization Method for Advanced Package

Our research in advanced semiconductor package electrical measurement focuses on the characterization and validation of Redistribution Layer (RDL) interposers to ensure optimal signal integrity, power delivery, and overall electrical performance. We develop precise measurement methodologies using high-frequency probing eye analysis, vector network analysis (VNA), and time-domain reflectometry (TDR), and to assess key parameters such as impedance matching, insertion loss, crosstalk, and jitter. Additionally, we explore advanced de-embedding techniques and machine learning-based data analysis to enhance measurement accuracy and efficiency. 

#AISE405_Semiconductor_Package_and_Test