Equipments

RF magnetron sputtering is a kind of physical vapor deposition (PVD) where Argon ions are accelerated by RF electric field to hit a target made of the material to sputter. Under the plasma environment from the energetic ions, a high-quality thin film can be deposited.

Thin-film deposition is an essential process in the semiconductor industry. E-beam evaporation is a type of physical vapor deposition, in which a target (metal or oxide) is bombarded by an electron beam from a W filament and deposited in a smooth or rod-type on a substrate. It has the advantage of thin-film deposition with a thickness in a range from um-scale to nm-scale.

Probe stations allow a user to position electrical, optical, or RF probes onto a device and to then test the response of that device to an external stimulus (electrical, optical, or RF).

Pulsed laser deposition(PLD) is one of the physical vapor deposition (PVD) methods, which uses KrF gas as a active laser medium to deposit a target on a substrate using a high-power pulsed laser. This deposition process is performed in a ultra high vacuum state, or oxygen gas is mainly used as a background gas when deposited oxide film.

Low-pressure chemical vapor deposition (LPCVD) is a vacuum deposition method used to produce high-quality and conformal thin-film materials. Various two-dimensional materials (MoS2, WS2, and graphene) and transition metal phosphides (MoP, CoP) can be synthesized using diverse precursors. 

Mist-cvd is a kind of chemical vapor deposition where a liquid ion sources are misted by ultrasonic generator to produce a high-quality and conformal thin-film materials. Various oxide epitaxial films(including alpha gallium oxide, beta gallium oxide) could growth by using 400 - 900 celcius nitrogen atmosphere furnace 

PEC measurement system is operated through ivium potentiostats and light source. It can investigate various types of electrochemical measurements like linear sweep, transient, cyclic voltammetry, and impedance, which can aid the analysis of diverse photoelectrochemical and electrochemical reactions.

Gas Chromatography(GC) is used for analyzing gas products. A mixture of different gases can be separated individually while passing through a GC column, and their species can be identified by retention time. Not only are they specified, but also their concentrations are determined.

Probe station consisting electrical, optical probes which are specialized for taste sensing purposes. Electrical signals produced from ion, molecule stimulus are measured for evaluation of the taste sensing device.

Gas measurement system consists of sensing chamber, furnace, mass flow controller, and I-V source meter. Various target gases like NO2, NH3 and VOCs are inserted into the sensing chamber and the chemoresistive gas sensor shows the resistance variation. Furnace apply heat to sensing chamber and I-V sourcemeter recorded the resistance in real-time.

Surface Plasmon Resonance (SPR) measurement system, one of the optical measureing equipment, consists of pump, LED light source, sensorchip and camera. SPR measurement system can detects changes in optical properties due to the interaction between the sensrodhip and the substacne in the various solution 

When multiple gases are mixed, the array measurement system can measure the presence of the target gas more reliably rather than using one individual device. It can significantly increase the selectivity of the sensors. The array measurement system consists of a sensing chamber, mass flow controller, and I-V source meter. Various target gases are inserted into the sensing chamber and the electrical resistance is recorded.

The Oven can be used for drying or tempering electronic components, hardening plastic resin, or heating plasticine at a high temperature for a long time 

A centrifuge uses centrifugal force to separate various components of a fluid. This is achieved by spinning the fluid at high speed within a container, thereby separating fluids of different densities or liquids from solids.

Box Furnaces are utilized for heat-treating, calcining, curing, annealing, tempering, and other high temperature thermal processes 

Rapid thermal processing is a semiconductor manufacturing process that heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. Since the temperature is raised using the radiation heat transfer, the thermal mass is small, so the heat treatment time is reduced compared to other methods.

Probe station allows users to measure the characteristic of nonvolatile memory devices(RRAM, FeRAM, PRAM) and the synaptic characteristic of neuromorphic devices. 

The optical microscope is a type of microscope that commonly uses visible light and a system of lenses to generate magnified images of small objects.

Atomic Force Microscopy (AFM), a type of scanning probe microscopy, is a measurement system using the interaction between the sample surface and the tip. AFM not only can image the sample surface in the three-dimensional topography at the atomic-scale resolution but also can provide mechanical properties and electrical properties such as surface potential or conductivity.