Hardware Aware Edge Computing
Related Publication List
Hardware Aware Edge Computing
Related Publication List
This research has been done during Jump 2.0 CogniSense program or part of DARPA FENCE program.
Journals
Minah Lee, Sudarshan Sharma, Wei Chun Wang, and Saibal Mukhopadhyay, ”Energy-Efficient and Reliable Sensor Platform based on Analog-to-Feature Extraction,” in IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI), 2024.
Conferences
Minah Lee, Uday Kamal, Saibal Mukhopadhyay, “Learning Collective Dynamics of Multi- Agent Systems using Event-based Vision,” in Learning for Dynamics and Control Conference (L4DC), 2025.
(Invited) Minah Lee, Sudarshan Sharma, Nael Mizanur Rahman, Wei Chun Wang, Hemant Kumawat, and Saibal Mukhopadhyay, “Invited: Energy-Efficient Edge Intelligence through Cognitive Sensing,” in ACM/IEEE Design Automation Conference (DAC), July 2024.
Wei Chun Wang, Shida Zhang, Sudarshan Sharma, Minah Lee, Saibal Mukhopadhyay, ”Measurement of Aging Effect on an Analog Computing-In-Memory Macro in 28nm CMOS,” in IEEE International Reliability Physics Symposium (IRPS), April 2024.
(Invited) Minah Lee, Sudarshan Sharma, Wei Chun Wang, Hemant Kumawat, Nael Mizanur Rahman, and Saibal Mukhopadhyay, “Cognitive Sensing for Energy-Efficient Edge Intelligence,” in IEEE Design, Automation, and Test in Europe (DATE), March 2024.
Wei-Chun Wang, Rakshith Saligram, Sudarshan Sharma, Minah Lee, Amol Gaidhane, Yu Cao, Arijit Raychowdhury, Suman Datta, and Saibal Mukhopadhyay, “Cool-CIM: Cryogenic Operation of Analog Compute-In-Memory for Improved Power-efficiency,” in IEEE International Electron Devices Meeting (IEDM), December 2023.
Minah Lee, Sudarshan Sharma, Wei Chun Wang and Saibal Mukhopadhyay, “Energy-Efficient Sensor Platform using Reliable Analog-to-Feature Extraction,” in IEEE Sensors, October 2023.
Sudarshan Sharma, Wei-Chun Wang, Coleman DeLude, Minah Lee, Nael Mizanur Rahman Narasimha Vasishta Kidambi, Justin Romberg and Saibal Mukhopadhyay, “AFE-CIM: A Current-Domain Compute-In-Memory Macro for Analog-to-Feature Extraction,” in IEEE European Conference on Solid-State Circuits (ESSCIRC), September 2023.