Journals

J. Kim, and G. Murali, and H. Park, and E. Qin, and H. Kwon, and V. C. Chekuri, and N. Rahman, and N.Dasari, and A. Singh, and M. Lee, and H. M. Torun, and K. Roy, and M. Swaminathan, and S. Mukhopadhyay, and T. Krishna, and S. Lim, ”Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse,” in IEEE Transactions on Very Large Scale Integration Systems (T-VLSI), 2020

Minah Lee, Arvind Singh, Hakki M. Torun, Jinwoo Kim, Sung Kyu Lim, Madhavan Swaminathan, and Saibal Mukhopadhyay, ”Automated I/O Generation of Interposer-based System-in-Package Integration of Multiple Heterogeneous Dies,” in Transactions on Components, Packaging and Manufacturing Technology (TCPMT), 2019.

Conferences

Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki M. Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, and Sung Kyu Lim, “Architecture, Chip, and Package Co-design Flow for 2.5D Integration of Reusable IP Chiplets”, in Design Automation Conference (DAC), June 2019.

Hakki M. Torun, Nihar Dasari, Arvind Singh, Minah Lee, Jinwoo Kim, Heechun Park, Hyoukjun Kwon, Eric Qin, Tushar Krishna, Sung Kyu Lim, Saibal Mukhopadhyay and Madhavan Swaminathan, “Design Space Exploration of Power Delivery in Heterogeneous Integration,” in Government Microcircuit Applications and Critical Technology Conference (GOMACTech), March 2019.

Minah Lee, Arvind Singh, Hakki M. Torun, Jinwoo Kim, Sung Kyu Lim, Madhavan Swaminathan, and Saibal Mukhopadhyay, ”Automated Generation of All-Digital I/O Library Cells for Multiple Dies in System-in-Package Integration,” in Government Microcircuit Applications and Critical Technology Conference (GOMACTech), March 2019.

Minah Lee, Jinwoo Kim, Arvind Singh, Hakki M. Torun, Madhavan Swaminathan, Sung Kyu Lim, and Saibal Mukhopadhyay, ”On the design of energy-efficient I/O circuits for interposer-based 2.5D system-in-Package,” in SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), October 2018. (Best Student Paper Award Nominated)

Minah Lee, Arvind Singh, Hakki M. Torun, Jinwoo Kim, Sung Kyu Lim, Madhavan Swaminathan, and Saibal Mukhopadhyay, ”Automated Generation of All-Digital I/O Library Cells for System-in-Package Integration of Multiple Dies,” in Electrical Performance of Electronic Packaging and Systems (EPEPS), October 2018. (Best Student Paper Award Nominated)