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Besides the combinatorial synthesis instruments listed below, we also have several non-combinatorial physical vapor deposition chambers, to follow up on targeted synthesis of the most promising materials identified by combinatorial synthesis.
Combinatorial Chamber #1 (COM1)
RF or DC magnetron sputtering
Materials: Metals, Oxides, Carbides
Substrates: <3" diameter, <800C
Targets: 2” circular
Gasses: Ar, O, N, N2/H2
Base pressure: 10-7-10-6 Torr
Features: N/O plasma source
Restricted elements:
Publication:
Combinatorial Chamber #3 (COM3)
Pulsed Laser Deposition
Materials: Oxides
Substrates: <4" diameter, <800C
Targets: 1” or 2” circular
Gasses: Ar, O, N, N2/H2
Base pressure: 10-9-10-8 Torr
Features: load lock
Restricted elements:
Publications:
https://doi.org/10.1063/1.4841355
DOI: 10.1021/acsomega.8b03347
Combinatorial Chamber #4 (COM4)
RF magnetron sputtering
Materials: Chalcogenides, Oxychalcogenides
Substrates: <4" diameter, <800C
Targets: 2” circular
Gasses: Ar, O, Ar/H2S
Base pressure: 10-8-10-7 Torr
Features: load lock, S plasma source, vacuum transfer, programmable shutters, source-specific QCMs
Restricted elements:
Publications:
https://doi.org/10.1016/j.solmat.2014.09.041
10.1126/sciadv.aaq1442
Combinatorial Chamber #5 (COM5)
RF or DC magnetron sputtering
Materials: Nitrides
Substrates: <4" diameter, <800C
Targets: 2” circular
Gasses: Ar, N, N2/H2
Base pressure: 10-9-10-8 Torr
Features: load lock, N plasma source, cryoshroud, in-vacuo source shifts
Restricted elements:
Publications:
Combinatorial Chamber #6 (COM6)
RF or DC magnetron sputtering
Materials: Oxides, Nitrides, Oxynitrides
Substrates: <6" square, <600C
Targets: 3” circular
Gasses: Ar, O, N, N2/H2
Base pressure: 10-9-10-8 Torr
Features: load lock, N plasma source, vacuum transfer
Restricted elements:
Publications: http://doi.org/10.1021/acs.chemmater.7b02122
Combinatorial Chamber #7 (COM7)
RF or DC magnetron sputtering
Materials: Li-containing materials
Substrates: <4" diameter, <800C
Targets: 3” circular
Gasses: Ar, O, N
Base pressure: 10-9-10-8 Torr
Features: glove box, co-evaporation
Restricted elements:
Publications:
Combinatorial Chamber #8 (COM8)
RF magnetron sputtering
Materials: Phosphides
Substrates: <4" diameter, <800C
Targets: 2” circular
Gasses: Ar, Ar/PH3
Base pressure: 10-9-10-8 Torr
Features: load-lock
Publications: in progress
Combinatorial Chamber #9 (COM9)
RF or DC magnetron sputtering
Materials: Nitrides, Oxynitrides
Substrates: <4" diameter, <1000C
Targets: 2” circular
Gasses: Ar, O, N, N2/H2
Base pressure: 10-9-10-8 Torr
Features: N hollow cathode plasma source, LN2 substrate cooling, in-vacuo source angle adjustment, individual gas control for all metal sources
Publication: in progress
Combinatorial Chamber #10 (COM10)
RF or DC magnetron sputtering
Materials: Nitrides
Substrates: <4" diameter, <800C
Targets: 3” circular
Gasses: Ar, N
Base pressure: 10-9-10-8 Torr
Features: Dedicated to (Al,Sc)N and related materials
Publications:
arXiv:2101.06449
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