Publications

Chapters in Books

(*=advisee)

  • A. Yaeger*, T. Dale*, E. McClamrock*, G. Subbarayan, and C. Handwerker, “Intermetallic Compounds,” Chapter 12 in Lead-Free Soldering Process Development and Reliability, First Edition, J. Bath (ed.), John Wiley & Sons, 2020, doi: 10.1002/9781119482093.ch12.

  • S. Radhakrishnan*, G. Subbarayan, and L.Nguyen, “Probabilistic Physical Design of Fiber-Optic Structures,” Chapter 2 in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability and Packaging, Volume 2: Physical Design/Reliability and Packaging, E. Suhir, Y.C. Lee and C.P. Wong (eds.), Springer, 2007.

  • S.A. Leclerc* and G. Subbarayan, “Design for Manufacture and Assembly of Electronic Packages,” Chapter 4 in Manufacturing Challenges in Electronic Packaging, Y.C. Lee and W.T. Chen (eds.), Chapman & Hall, 1998.

  • D. L. Taylor and G. Subbarayan, “Optimization,” Chapter 6 in Computer-Aided Design by D. L. Taylor. Addison-Wesley, 1992.

Peer-Reviewed Full-Length Journal Articles

  • P. Vaitheeswaran* and G. Subbarayan, “Improved Dixon Resultant for Generating Signed Algebraic Level Sets and Algebraic Boolean Operations on Closed Parametric Surfaces,” Computer Aided Design, accepted for publication.

  • C-P. Chen*, Y. Chen* and G. Subbarayan, “Parametric Stitching for Smooth Coupling of Subdomains with Non-Matching Discretizations,” Computer Methods in Applied Mechanics and Engineering, vol. 373, pp. 113519 1-37, 2021, doi: 10.1016/j.cma.2020.113519.

  • S. Achar P. L.*, H. Liao* and G. Subbarayan, “Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Micrsotructural Models and Effective Behavior,” ASME Transactions Journal of Electronic Packaging, vol. 142, no. 4, pp. 041005 1-13, 2020, doi: 10.1115/1.4048729.

  • T. Dale*, Y. Singh*, I. Bernander, G. Subbarayan, C. Handwerker, P. Su and B. Glasauer, "Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads," ASME Transactions Journal of Electronic Packaging, vol. 142, no. 4, pp. 041001 1-11, 2020, doi:  10.1115/1.4048109.

  • S. Sadasiva*, P. Vaitheeswaran*, and G. Subbarayan, “A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy,” Computational Mechanics, vol. 66, pp. 373-390, 2020. doi: 10.1007/s00466-020-01855-9.

  • H. Liao*, P. Vaitheeswaran*, T. Song* and G. Subbarayan, “Algebraic Point Projection for Immersed Boundary Analysis on Low Degree NURBS Curves and Surfaces,” Algorithms, vol. 13, no. 82, pp. 1-25, 2020, doi: 10.3390/a13040082.

  • Y. Chen*, C. Jois* and G. Subbarayan, "Meshfree CAD-CAE Integration through Immersed B-rep Model and Enriched Isogeometric Analysis," Computer-Aided Design & Applications, vol. 17, no. 6, pp. 1193-1214, 2020, doi: 10.14733/cadaps.2020.1193-1214.

  • P. Vaitheeswaran* and G. Subbarayan, "Topological Modifications through Boolean Compositions on Algebraic Level Sets Constructed from B-rep Models," Computer-Aided Design & Applications, vol. 17, no. 6, pp. 1177-1192, 2020, doi: 10.14733/cadaps.2020.1177-1192.

  • P. Vaitheeswaran*, A. Udupa*, S. Sadasiva* and G. Subbarayan, "Interface Balance Laws, Phase Growth and Nucleation Conditions for Multiphase Solids with Inhomogeneous Surface Stress," Continuum Mechanics and Thermodynamics, 2019, doi: 10.1007/s00161-019-00804-z.

  • C. Young* and G. Subbarayan, "Maximum entropy models for fatigue damage in metals with application to low-cycle fatigue of Aluminum 2024-T351," Entropy, vol. 21, no. 10, pp. 967, 2019, doi: 10.3390/e21100967.

  • Y. Xu, Y. Singh*, C. Pan and G. Subbarayan, "Adhesive toughness and instability in bonded heterogeneous films," International Journal of Solids and Structures, vol. 169, pp. 41-54, 2019, doi: 10.1016/j.ijsolstr.2019.04.003.

  • T. Song*, C-P. Chen*, G. Subbarayan, H. Lin and S. Gurrum, "Estimating the Modulus and Yield Strength of the Top-Layer Film on Multilayer BEOL Stacks," IEEE Transactions on Device and Materials Reliability, vol. 18, pp. 438-449, 2018, doi:10.1109/TDMR.2018.2865904.

  • P. Vaitheeswaran* and G. Subbarayan, "Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model," ASME Journal of Electronic Packaging, vol. 140, no. 2, 2018, doi: 10.1115/1.4039136.

  • S. Sudharsanan*, Y. Singh* and G. Subbarayan, "Characterization of Rate-Dependent Constitutive Behavior of Copper Free-Air Ball and its Use for Wire Bonding Process Simulation," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 6, pp. 1092-1106, 2018, doi: 10.1109/TCPMT.2018.2827842.

  • K. Upreti*, T. Song* and G. Subbarayan, “Signed Algebraic Level Sets on NURBS Surfaces and Implicit Boolean Compositions for Isogeometric CAD-CAE Integration,” Computer Aided Design, vol. 82, pp. 112-126, 2017, doi: 10.1016/j.cad.2016.09.006.

  • A. Udupa*, S. Sadasiva*, and G. Subbarayan, “A Framework for Studying Dynamics and Stability of Diffusive-Reactive Interfaces with Application to Cu6Sn5 Intermetallic Compound Growth” Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol. 472, issue 2190, no. 20160134, 2016, doi: 10.1098/rspa.2016.0134.

  • K. Upreti*, H-Y. Lin*, G. Subbarayan, D.Y. Jung, B.G. Sammakia, “An Assessment of Risk of Fracture during Wirebonding over Active Circuits on ULK Dies.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6, no. 2, pp. 314-325, 2016, doi: 10.1109/TCPMT.2015.2466679.

  • A. Tambat* and G. Subbarayan, “Simulations of Arbitrary Crack Path Deflection at a Material Interface in Layered Structures.” Engineering Fracture Mechanics, vol. 141, pp. 124-139, 2015, doi: 10.1016/j.engfracmech.2015.04.034

  • O. Morgan*, K. Upreti*, G. Subbarayan, and D.C. Anderson, “HiGeoM: A Symbolic Framework for a Unified Function Space Representation of Trivariate Solids for Isogeometric Analysis.” Computer Aided Design, vol. 65, pp. 34-50, 2015, doi: 10.1016/j.cad.2015.03.005

  • T. Song*, K. Upreti*, and G. Subbarayan, “A Sharp Interface Isogeometric Solution to the Stefan Problem,” Computer Methods in Applied Mechanics and Engineering, vol. 284, pp. 556-582, 2015, doi: 10.1016/j.cma.2014.10.013.

  • H-Y. Lin*, M. Rayasam*, and G. Subbarayan, “ISOCOMP: Unified Geometric and Material Compostion for Optimal Topology Design,” Structural and Multidisciplinary Optimization, vol. 51, pp. 687-703, 2015, doi: 10.1007/s00158-014-1164-1

  • K. Upreti*, T. Song*, A. Tambat* and G. Subbarayan, “Algebraic Distance Estimations for Enriched Isogeometric Analysis,” Computer Methods in Applied Mechanics and Engineering, vol. 280, pp. 28-56, 2014, doi: 10.1016/j.cma.2014.07.012.

  • J.P Tucker*, D.K. Chan*, G. Subbarayan, and C.A. Handwerker, "Maximum Entropy Fracture Model and its Use for Predicting Cyclic Hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 Solder Alloys," Microelectronics Reliability, vol. 54, pp. 2513-2522, 2014, doi: 10.1016/j.microrel.2014.04.012.

  • K. Upreti* and G. Subbarayan, “Algebraic Distance Field for Meshless Analysis of Free Form CAD Models,” Computer-Aided Design and Applications, vol. 10, no.3, pp. 427-443, 2013, doi: 10.3722/cadaps.2013.427-443.

  • H-Y. Lin* and G. Subbarayan, “Optimal Topological Design through Insertion and Configuration of Finite-Sized Heterogeneities,” International Journal of Solids and Structures, vol. 50, pp. 429-446, 2013, doi: 10.1016/j.ijsolstr.2012.10.006.

  • A. Udupa*, G. Subbarayan, and C-K. Koh, “Analytical Estimates of Stress around a Doubly Periodic Arrangement of Through-Silicon Vias,” invited paper for special issue on three-dimensional packaging, Microelectronics Reliability, vol. 53, pp. 63-69, 2013, doi: 10.1016/j.microrel.2012.09.006.

  • S. Chavali*, G. Subbarayan, A. Bansal, and M. Ahmad, "Effect of Pad Surface Finish and Reflow Cooling Rate on the Microstructure and the Mechanical Behavior of SnAgCu Solder Alloys," Microelectronics Reliability, doi: 10.1016/j.microrel.2013.02.006.

  • D. Chan*, X. Nie*, D. Bhate*, G. Subbarayan, W. Chen, and I. Dutta, “Intermediate and High-Strain Rate Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys: Constitutive Models and their Demonstration,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3, no. 1, pp. 133-146, 2013, doi: 10.1109/TCPMT.2012.2211022.

  • B. Dan*, B.G. Sammakia G. Subbarayan, S. Kanuparthi* and S. Mallampati, “The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials by Finite Element Method,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3, no. 12, pp. 2068-2074, 2013 doi: 10.1109/TCPMT.2013.2286996.

  • B. Dan*, B.G. Sammakia G. Subbarayan, and S. Kanuparthi* “An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” ASME Transactions Journal of Electronic Packaging, vol. 135, no. 3, article 031003, 2013 doi: 10.1115/1.4024392.

  • A. Tambat* and G. Subbarayan, “Isogeometric Enriched Field Approximations,” Computer Methods in Applied Mechanics and Engineering, vol. 245-246, pp. 1-21, 2012, doi: 10.1016/j.cma.2012.06.006.

  • O. Morgan*, G. Subbarayan, and D.C. Anderson, “A Hybrid Hierarchical Procedure for Composing Trivariate NURBS Solids,” Computer-Aided Design and Applications, vol. 9, no. 2, pp. 215-226, 2012, doi:10.3722/cadaps.2012.215-226.

  • N. Bajaj*, G. Subbarayan and S. Garimella, “Topological Design of Channels for Squeeze Flow Optimization of Thermal Interface Materials,” International Journal of Heat and Mass Transfer, vol. 55, pp. 3360-3575, 2012, doi: 10.1016/j.ijheatmasstransfer.2012.03.020.

  • K. Srinivasan*, T. Siegmund and G. Subbarayan, “Wrinkling on Irreversibly Deforming Foundations,” Thin Solid Films, vol. 520, no. 17, pp. 5671-5682, 2012, doi: 10.1016/j.tsf.2012.04.071.

  • D. Chan*, G. Subbarayan, and L. Nguyen, “Maximum Entropy Principle for Modeling Damage and Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty,” Invited Paper, Journal of Electronic Materials, vol. 41, no. 2, pp. 398-411, 2012, doi: 10.1007/s11664-011-1804-9.

  • D. Bhate*, K. Mysore* and G. Subbarayan, “An Information Theoretic Argument on the Nature of Damage Accumulation in Solids,” Invited paper in honor of Professor J.N. Reddy’s 65th birthday special issue, Mechanics of Advanced Materials and Structures, vol. 19, pp. 184-195, 2012, doi: 10.1080/15376494.2011.572246.

  • A. Tambat*, H-Y. Lin*, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Simulations of damage, crack initiation and propagation in interlayer dielectric stacks: understanding assembly-induced fracture in dies,” Invited paper, special issue on 3D packaging, IEEE Transactions on Devices and Materials Reliability, vol. 12, no. 2, pp. 241-254, 2012, doi: 10.1109/TDMR.2012.2195006.

  • S. Sadasiva*, G. Subbarayan, L. Jiang and D. Pantuso, “Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects,” Invited paper, ASME Transactions Journal of Electronic Packaging, Special issue in honor of Professor Avi Bar-Cohen, vol. 134, no. 2, pp. 020907, 2012, doi:10.1115/1.4006707.

  • [1]P. Kumar*, Z. Huang*, S. Chavali*, D. K. Chan*, I. Dutta, G. Subbarayan and V. Gupta, “A Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-based Solders,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 2, pp. 256-265, 2012, doi: 10.1109/TCPMT.2011.2173494.

  • J.P. Tucker*, G. Subbarayan, and C.A. Handwerker, "Constitutive Behavior of Mixed SnPb/Sn3.0Ag0.5Cu Solder Alloys," Journal of Electronic Materials, vol. 41, no. 3, pp. 596-610, 2012, doi: 10.1007/s11664-011-1812-9.

  • S. Mahajan*, G. Subbarayan and B.G. Sammakia, “Estimating Kapitza resistance between Si-SiO2 interface using molecular dynamics simulations,” IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 1, no. 8, pp. 1132-1139, 2011, doi:10.1109/TCPMT.2011.2112356.

  • K. Mysore*, O. Morgan*, and G. Subbarayan, “NURBS Representational Strategies for Tracking Moving Boundaries and Topological Changes during Phase Evolution,” Computer Methods in Applied Mechanics and Engineering, vol. 200, pp. 2594-2610, 2011, doi: 10.1016/j.cma.2011.04.002.

  • V. Srinivasan*, G. Subbarayan, S. Radhakrishnan, D. Pantuso and S. Shankar, “Hierarchical Partition of Unity Field Compositions (HPFC) for Meshless Analysis and Optimal Design in the Presence of Cracks,” Mechanics of Advanced Materials and Structures, vol. 17, no. 7, pp. 467-480, 2010, doi: 10.1080/15376494.2010.508989.

  • V. Srinivasan*, S. Radhakrishnan* and G. Subbarayan, “Coordinated Synthesis of Hierarchical Engineering Systems,” Computer Methods in Applied Mechanics and Engineering, vol. 199, pp. 392-404, 2010, doi: 10.1016/j.cma.2008.08.021.

  • S. Goyal*, K. Srinivasan*, G. Subbarayan and T. Siegmund “On Instability-Induced Debond Initiation in Thin Film Systems,” Engineering Fracture Mechanics, vol. 77, pp. 1298-1313, 2010, doi: 10.1016/j.engfracmech.2010.02.001.

  • S. Goyal*, K. Srinivasan*, G. Subbarayan and T. Siegmund “A Non-Contact Thermally-Driven Buckling Delamination Test to Measure Interfacial Fracture Toughness of Thin Film Systems,” Thin Solid Films, vol. 518, pp. 2058-2064, 2010, doi: 10.1016/j.tsf.2009.07.148.

  • D. Bhate*, G. Subbarayan, L. Nguyen, J. Zhao, D. Edwards, “Singularities at Solder Joint Interfaces and their Effects on Fracture Models,” ASME Transactions Journal of Electronic Packaging, vol. 132, pp. 021007-1, 2010, doi: 10.1115/1.4001588.

  • K. Srinivasan*, S. Goyal*, T. Siegmund, G. Subbarayan and Q. Lin, “Thermally-Induced Wrinkling in Thin-Film Stacks on Patterned Substrates,” IBM Journal of Research and Development, vol. 53, no. 3, pp. 12:1-12:10, 2009, doi: 10.1147/JRD.2009.5429025.

  • S. Kanuparthi*, G. Subbarayan, T. Siegmund, and B.G. Sammakia, “The Effect of Polydispersivity on the Thermal Conductivity of Particulate Thermal Interface Materials,” IEEE Transactions on Components and Packaging Technology, vol. 32, no. 2, pp. 424-434, 2009, doi: 10.1109/TCAPT.2008.2010502.

  • S. Kanuparthi*, M. Rayasam*, G. Subbarayan, B.G. Sammakia, A. Gowda, and S. Tonapi, “Hierarchical Compositions for Simulations of Near-Percolation Thermal Transport in Particulate Materials,” Computer Methods in Applied Mechanics and Engineering, vol. 198, pp. 657-668, 2009, doi: 10.1016/j.cma.2008.10.001.

  • I. Dutta, P. Kumar*, and G. Subbarayan, “Microstructural Coarsening in Sn-Ag Based Solders and Its Effects on Mechanical Properties,” Invited paper, Journal of Metals (JOM), vol. 61, no. 6, pp. 29-38, TMS, 2009, doi: 10.1007/s11837-009-0085-8.

  • K. Mysore*, G. Subbarayan, V. Gupta, R. Zhang, “Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy,” IEEE Transactions on Electronics Packaging Manufacturing, vol. 32, no. 4, pp. 221-232, 2009, doi: 10.1109/TEPM.2009.2024119.

  • [2]M. Rayasam*, S. Chaparala*, D. Farnam*, B.G. Sammakia and G. Subbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three Dimensional Packages,” ASME Transactions Journal of Electronic Packaging, vol. 131, article no. 011015, pp. 1-9, 2009, doi: 10.1115/1.3077131.

  • V. Srinivasan*, S. Radhakrishnan*, T. Ratanawilai*, G. Subbarayan, T.V. Baughn, and L.T. Nguyen “A Robust Digital Image Correlation Technique for High-Resolution Characterization of Packaging Materials,” International Journal of Materials and Product Technology, vol. 34, no. 1/2, pp. 139-157, 2009, doi: 10.1504/IJMPT.2009.022409.

  • S. Kanuparthi*, G. Subbarayan, T. Siegmund, and B.G. Sammakia “An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” IEEE Transactions on Components and Packaging Technology, vol. 31, no. 3, pp. 611-621, 2008, doi: 10.1109/TCAPT.2008.2001839.

  • D. Bhate*, D. Chan*, G. Subbarayan, T.C. Chiu, V. Gupta and D. Edwards “Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu older Alloys at Creep and Low Strain Rate Regimes,” IEEE Transactions on Components and Packaging Technology, vol. 31, no. 3, pp. 622-633, 2008, doi: 10.1109/TCAPT.2008.2001165.

  • D. Bhate*, D. Chan*, G. Subbarayan, and L. Nguyen, “A Nonlinear Fracture Mechanics Perspective on Solder Joint Failure: Going beyond the Coffin-Manson Equation,” ASME Transactions Journal of Electronic Packaging, vol. 130, no. 2, pp. 021003-021012, 2008, doi: 10.1115/1.2840057.

  • S. Mahajan*, G. Subbarayan, and B.G. Sammakia, “Estimating Thermal Conductivity of Amorphous Silica Nano-Particles and Nano-Wires using Molecular Dynamics Simulations,” Physical Review E, 76, 056701, 2007, doi: 10.1103/PhysRevE.76.056701.

  • M. Rayasam*, V. Srinivasan*, and G. Subbarayan. “CAD Inspired Hierarchical Partition of Unity Constructions for NURBS-based Meshless Design, Analysis and Optimization,” International Journal for Numerical Methods in Engineering, vol. 72, pp. 1452-1489, 2007, doi: 10.1002/nme.2046.

  • X. Zhang*, M. Rayasam* and G. Subbarayan, “A Meshless, Compositional Approach to Shape Optimal Design,” Computer Methods in Applied Mechanics and Engineering, vol. 196, pp. 2130-2146, 2007, doi: 10.1016/j.cma.2006.11.008.

  • Y. Luo* and G. Subbarayan, “A Study of Multiple Singularities in Multi-Material Wedges and their Use in Analysis of Microelectronic Interconnect Structures,” Engineering Fracture Mechanics, vol. 74, no. 3, pp. 416-430, 2007, doi: 10.1016/j.engfracmech.2006.04.032.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen and W. Mazotti, “Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages,” ASME Transactions Journal of Electronic Packaging, vol. 129, no. 3, pp. 229-235. 2007, doi: 10.1115/1.2753885.

  • D. Littlewood* and G. Subbarayan, “Updating a CMYK Printer Model using a Sparse Data Set,” Journal of Imaging Science and Technology, vol. 50, no. 6, pp. 556-566, 2006, doi: 10.2352/J.ImagingSci.Technol.(2006)50:6(556).

  • X. Zhang* and G. Subbarayan, “jNURBS: An Object-Oriented, Symbolic Framework for Integrated Meshless Analysis and Optimal Design,” Advances in Engineering Software, vol. 37, no. 5, pp. 287-311, 2006, doi: 10.1016/j.advengsoft.2005.08.001.

  • M. Rayasam*, T.B. Thompson*, G. Subbarayan, C. Gurumurthy, and J.R. Wilcox. “A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage,” ASME Transactions Journal of Electronic Packaging, vo. 128, no. 3, pp. 184-191, 2006, doi: 10.1115/1.2227058.

  • A. Desai*, S. Mahajan*, G. Subbarayan, W.E. Jones, J. Geer, and B.G. Sammakia, “A Numerical Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” ASME Transactions Journal of Electronic Packaging, vol. 128, no. 1, pp. 92-97, 2006, doi: 10.1115/1.2161231.

  • S.G. Gadag*, G. Subbarayan and W. Barker, “Thermo-elastic Properties of Dense YSZ and Porous Ni-ZrO2 Monolithic and Isotropic Materials,” Journal of Materials Science, vol. 41, no. 4, 1221-1232, 2006, doi: 10.1007/s10853-005-3660-6.

  • P. Towashiraporn*, G. Subbarayan and C.S. Desai, “A Hybrid Model for Computationally Efficient Fatigue Fracture Simulations at Microelectronic Assembly Interfaces,” International Journal of Solids and Structures, vol. 42, pp. 4468-4483, 2005, doi: 10.1016/j.ijsolstr.2004.12.012.

  • L. Zhang*, G. Subbarayan, B.C. Hunter and D. Rose, “Response Surface Models for Efficient, Modular Estimation of Solder Joint Reliability in Area Array Packages,” Microelectronics Reliability, vol. 45, pp. 623-635, 2005, doi: 10.1016/j.microrel.2004.06.007.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen and W. Mazotti, “A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiber-Optic System,” ASME Transactions Journal of Electronic Packaging, vol. 127, no. 4, pp. 391-396, 2005, doi: 10.1115/1.2056573.

  • D. Natekar*, X. Zhang*, and G. Subbarayan, “Constructive Solid Analysis: A Hierarchical, Geometry based Meshless Procedure for Integrated Design and Analysis,” Computer Aided Design, vol. 36, pp. 473-486, 2004, doi: 10.1016/S0010-4485(03)00129-5.

  • X. Zhang* and G. Subbarayan, “A Constructive Approach for Heterogeneous Material Modeling and Analysis,” Computer-Aided Design and Applications, vol. 1, no. 1-4, pp. 171-178, 2004, doi: 10.3722/cadaps.2004.171-178.

  • P. Towashiraporn*, K. Gall, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, and R. Sullivan, “Powercycling Thermal Fatigue of Sn-Pb Solder Joints in a Chip-Scale Package,” International Journal of Fatigue, vol. 26, pp. 497-510, 2004, doi: 10.1016/j.ijfatigue.2003.09.004.

  • P. Towashiraporn*, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, and R. Sullivan, “The Effect of Model Building on the Accuracy of Fatigue Life Predictions in Electronic Packages,” Microelectronics Reliability, vol. 44, no. 1, pp. 115-127, 2004, doi: 10.1016/j.microrel.2003.08.012.

  • T. Ratanawilai* and G. Subbarayan, “An Assessment of Change in Stress Due to Cross-sectioning in Moire Interferometric Characterization of Electronic Packages,” IEEE Transactions on Components and Packaging Technology, vol. 26, no. 4, pp. 705-711, 2003, doi: 10.1109/TCAPT.2003.821679.

  • D. Kulkarni* and G. Subbarayan, “A Dynamic Model for Predicting the Motion of Solder Droplets During Assembly,” IEEE Transactions on Components and Packaging Technology, vol. 26, no. 4, pp. 698-704, 2003, doi: 10.1109/TCAPT.2003.821680.

  • T. Ratanawilai*, B.C. Hunter*, G. Subbarayan and D. Rose, “A Study on the Variation of Effective CTE of Printed Circuit Boards through a Validated Comparison between Strain Gages and Moire Interferometry,” IEEE Transactions on Components and Packaging Technology, vol. 26, no. 4, pp. 712-718, 2003, doi: 10.1109/TCAPT.2003.821685.

  • [3]D. Littlewood* and G. Subbarayan, “Controlling the Grey Component with Pareto-Optimal Color Space Transformations,” Journal of Imaging Science and Technology, vol. 46, no. 6, pp. 533-542, 2002.

  • D. Littlewood*, P.A. Drakopoulos*, and G. Subbarayan, “Pareto-Optimal Formulations for Cost Versus Calorimetric Accuracy Trade-offs in Printer Color Management,” ACM Transactions on Graphics, vol. 21, no. 2, pp. 132-175, 2002, doi: 10.1145/508357.508361.

  • L. Zhang* and G. Subbarayan. “An Evaluation of Back-Propagation Neural Networks for the Optimal Design of Structural Systems – Part I: Training Procedure,” Computer Methods in Applied Mechanics and Engineering, vol. 191, no. 25-26, pp. 2873-2886, 2002, doi: 10.1016/S0045-7825(01)00372-3.

  • L. Zhang* and G. Subbarayan. “An Evaluation of Back-Propagation Neural Networks for the Optimal Design of Structural Systems – Part II: Numerical Evaluation,” Computer Methods in Applied Mechanics and Engineering, vol. 191, no. 25-26, pp. 2887-2904, 2002, doi: 10.1016/S0045-7825(02)00213-X.

  • [4]P. Towashiraporn*, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, and R. Sullivan, “Predictive Reliability Models through Validated Correlation between Power Cycling and Thermal Cycling Accelerated Life Tests,” Soldering and Surface Mount Technology, vol. 14, no. 3, pp. 51-60, 2002, doi: 10.1108/09540910210444737.

  • D. Natekar* and G. Subbarayan, “Computationally Efficient Fracture Analysis of Electronic Packages through Decomposition,” International Journal of Damage Mechanics, vol. 10, no. 2, pp. 171-186, 2001, doi: 10.1106/F9W7-XGV5-9PME-D5CX.

  • T.B. Thompson* and G. Subbarayan, “Applications of a Decomposed Analysis Procedure for Area-Array Packages,” ASME Transactions Journal of Electronic Packaging, vol. 123, no. 2, pp. 132-140, 2001, doi: 10.1115/1.1339197.

  • F.P. Renken* and G. Subbarayan. “NURBS-Based Solutions to Inverse Boundary Problems in Droplet Shape Prediction,” Computer Methods in Applied Mechanics and Engineering, vol. 190, no. 11-12, pp. 1391-1406, 2000, doi: 10.1016/S0045-7825(00)00168-7.

  • A. Deshpande* and G. Subbarayan, “Optimal Design of Land Grid Array Connectors,” ASME Transactions Journal of Electronic Packaging, vol. 122, no. 3, pp. 247-253, 2000, doi: 10.1115/1.1286021.

  • G. Subbarayan and D.L. Bartel, “A Reconciliation of Local and Global Models for Bone Remodeling Through Optimization Theory,” ASME Transactions Journal of Biomechanical Engineering, vol. 122, no. 1, pp. 72-76, 2000, doi: 10.1115/1.429633.

  • A. Deshpande*, G. Subbarayan, and D. Rose, “A System for First Order Reliability Estimation of Area Array Packages,” ASME Transactions Journal of Electronic Packaging, vol. 122, no. 1, pp. 6-12, 2000, doi: 10.1115/1.483125.

  • A. Deshpande* and G. Subbarayan, “Decomposition Techniques for the Efficient Analysis of Area Array Packages,” ASME Transactions Journal of Electronic Packaging, vol. 122, no. 1, pp. 13-19, 2000, doi: 10.1115/1.483126.

  • G. Subbarayan and R. Raj, “A Methodology for Integrating Materials Science with System Engineering,” Materials & Design, Elsevier Science, vol. 20, pp. 1-12, 1999, doi: 10.1016/S0261-3069(98)00048-X.

  • L. Zhang*, B. Hunter*, G. Subbarayan, and D. Rose, “The Accuracy of Structural Approximations Employed in Analysis of Area Array Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 22, no. 4, pp. 525-533, 1999, doi: 10.1109/6144.814968.

  • F.P. Renken* and G. Subbarayan, “A Two-Body Formulation for Solder Joint Shape Prediction,” ASME Transactions Journal of Electronic Packaging, vol. 120, no. 3, pp. 302-308, 1998, doi: 10.1115/1.2792637.

  • Y. Li*, R. L. Mahajan, and G. Subbarayan, “The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints,” ASME Transactions Journal of Electronic Packaging, vol. 120, no. 1, pp. 54-60, 1998, doi: 10.1115/1.2792286.

  • G. Subbarayan, K. Ramakrishna, and B.G. Sammakia, “The Impact of Interfacial Adhesion on PTH and Via Stress State,” ASME Transactions Journal of Electronic Packaging, vol. 119, no. 4, pp. 260-267, 1997, doi: 10.1115/1.2792247.

  • G. Subbarayan and A. Deshpande*, “The Nature of Centroidal Locus in Misaligned Flip-Chip and BGA Solder Joints,” ASME Transactions Journal of Electronic Packaging, vol. 119, no. 3, pp. 156-162, 1997, doi: 10.1115/1.2792228.

  • A. Deshpande*, G. Subbarayan and R.L. Mahajan, “Maximizing Solder Joint Reliability through Optimal Shape Design,” ASME Transactions Journal of Electronic Packaging, vol. 119, no. 3, pp. 149-155, 1997, doi: 10.1115/1.2792227.

  • S.A. Leclerc* and G. Subbarayan, “A Design for Assembly Evaluation Methodology for Photonic Systems,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing, vol. 19, no. 3, pp. 189-200, 1996, doi: 10.1109/3476.558871.

  • G. Subbarayan, “A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints,” ASME Transactions Journal of Electronic Packaging, vol. 118, no. 3, pp. 127-133, 1996, doi: 10.1115/1.2792142.

  • [5]G. Subbarayan, Y. Li*, and R.L. Mahajan, “Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models,” ASME Transactions Journal of Electronic Packaging, vol. 118, no. 3, pp. 148-156, 1996, doi: 10.1115/1.2792145.

  • G. Subbarayan, M. Ferrill, and S. DeFoster, “Reliability of Metallized Ceramic Modules,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 19, no. 3, pp. 685-691, 1996, doi: 10.1109/96.533912.

Peer-Reviewed Short Notes in Journals

  • S. Goyal*, K. Srinivasan*, G. Subbarayan and T. Siegmund, “Estimating the Yield Strength of Thin-Films through Thermally-Driven Elastic-Plastic Buckling,” IEEE Transactions on Devices and Materials Reliability, vol. 11, no. 2, pp. 358-361, 2011, doi: 10.1109/TDMR.2011.2112362.

  • D. Bhate*, G. Subbarayan, J. Zhao, V. Gupta, and D. Edwards, “Improved Solder Joint Fatigue Models through Reduced Geometry Dependence of Empirical Fits” ASME Transactions Journal of Electronic Packaging, vol. 131, no. 4, article no. 044502, pp. 1-3, 2009, doi: 10.1115/1.4000208.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen, and W. Mazotti, “Material Behavior Uncertainty in the Design of Bonded Systems – Part II: Exhaustive Materials Characterization and Design Guidelines,” Materials & Design, vol. 28, pp. 2712-2718, 2007, doi: 10.1016/j.matdes.2006.10.006.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen, and W. Mazotti, “Material Behavior Uncertainty in the Design of Bonded Systems – Part I: Shear Displacement and Stress Prediction,” Materials & Design, vol. 28, pp. 2706-2711, 2007, doi: 10.1016/j.matdes.2006.10.005.

  • A. Desai*, S. Mahajan*, G. Subbarayan, W. Jones, J. Geer, and B. Sammakia, “A Numerical Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” Journal of Electronic Packaging, vol. 128, no. 1, pp. 92-97, 2006, doi: 10.1115/1.2161231.

  • M. Rayasam*, and G. Subbarayan, “A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment,” ASME Transactions Journal of Electronic Packaging, vol. 128, no. 3, pp. 291-293, 2006, doi: 10.1115/1.2229232.

Conference Proceedings Edited

  • C.H. Amon, K. Ramakrishna, B.G. Sammakia, G. Subbarayan, S.B. Sathe, Y.K. Joshi, ITherm 2002 the eighth intersociety conference on thermal and thermomechanical phenomena in electronic systems.

  • Y.C. Lee, M. Shiratori, G. Subbarayan, and E. Suhir. Advances in Electronic Packaging, Volumes 1&2, EEP-Vol. 19-1 and EEP-Vol. 19-2, ASME, 1997.

Peer-Reviewed Full-Length Conference Publications

  • C-S. Lee*, P. Vaitheeswaran*, G. Subbarayan, Y. Park, J. Chung and S. Krishnan, "Reliability of Metal-Dielectric Structures Under Intermittent Current Pulsing," IEEE International Reliability Physics Symposium (IRPS), Dallas, TX, USA, pp. 1-6, 2020, doi: 10.1109/IRPS45951.2020.9128331.

  • C.-P. Chen*, Y. Chen* G. Subbarayan, H.-Y. Lin, and S. Gurrum, "A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages," 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, IEEE, pp. 1121-1127, 2020, doi: 10.1109/ITherm45881.2020.9190600.

  • Y. Chen*, C. Jois* and G. Subbarayan, "Meshfree CAD-CAE Integration through Immersed B-rep model and Enriched Isogeometric Analysis," in proceedings of CAD Conference and Exhibition (CAD '19), paper number 81, Jun 24-26, 2019, Singapore, doi: 10.14733/cadconfP.2019.435-440.

  • P. Vaitheeswaran* and G. Subbarayan, "Topological Modifications through Boolean Compositions on Algebraic Level Sets Constructed from B-rep Models," in proceedings of CAD Conference and Exhibition (CAD '19), paper number 80, Jun 24-26, 2019, Singapore, doi: 10.14733/cadconfP.2019.456-461.

  • S. Achar P. L.*, H. Liao* and G. Subbarayan, “Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Micrsotructural Models and Effective Behavior,” in proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack '19), Anaheim,CA,ASME, paper number IPACK2019-6501, doi: 10.1115/IPACK2019-6501.

  • T. Dale*, Y. Singh*, I. Bernander, G. Subbarayan, C. Handwerker, P. Su and B. Glasauer, "Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads," in proceedings of ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack '19), Anaheim, CA, ASME, paper number IPACK2019-6507, doi: 10.1115/IPACK2019-6507.

  • C-P. Chen*, G. Subbarayan, H. Lin, S. Gurrum, "Estimating the yield strength of metal films in ILD stacks using optimization-based inverse finite element analysis," in proceedings of 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 1409-1415, 2017, doi: 10.1109/ITHERM.2017.7992646.

  • [6]P. Vaitheeswaran* and G. Subbarayan, "Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model," in proceedings of ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack '17), San Francisco, CA, ASME, paper number IPACK2017-74129, doi: 10.1115/IPACK2017-74129.

  • Y. Li*, Y. Singh* and G. Subbarayan, "Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy," in proceedings of ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack '17), San Francisco, CA, ASME, paper number IPACK2017-74201, doi: 10.1115/IPACK2017-74201.

  • C-P. Chen*, Y. Weng*, and G. Subbarayan, "Topology Optimization for Efficient Heat Removal in 3D Packages." in proceedings of 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 238-244, 2016, doi: 10.1109/ITHERM.2016.7517556.

  • T. Song*, G. Subbarayan, H-Y. Lin and S. Gurrum, "Estimation of Passivated Metal Stack Modulus through Simulations of Micro-Indentation." in proceedings of 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 1326-1332, 2016, doi: 10.1109/ITHERM.2016.7517702.

  • Y. Singh*, N. Bajaj*, and G. Subbarayan, "Simultaneous Thermal/Flow Characterization of Thermal Interface Materials." in proceedings of 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 1360-1365, 2016, doi: 10.1109/ITHERM.2016.7517707.

  • A. Udupa*, G. Subbarayan, and C-K. Koh, "Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs," in proceedings of ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack ’15), July 6-9, 2015, San Francisco, CA, ASME, paper number IPACK2015-48656, doi: 10.1115/IPACK2015-48656.

  • S. Sadasiva* and G. Subbarayan, "Diffcode: A System for Simulation of Diffusion Driven Phase Evolution in Solids," in proceedings of ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack ’15), July 6-9, 2015, San Francisco, CA, ASME, paper number IPACK2015-48655, doi: 10.1115/IPACK2015-48655.

  • S.S. Paranjothy*, G. Subbarayan, D.Y. Jung, and B.G. Sammakia, "An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball," in proceedings of ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack ’15), July 6-9, 2015, San Francisco, CA, ASME, paper number IPACK2015-48653, doi: 10.1115/IPACK2015-48653.

  • A. Udupa*, G. Subbarayan, and C.K Koh, "A model for the free (top) surface deformation of through-silicon vias." in proceedings of 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 616-620, 2014, doi: 10.1109/ITHERM.2014.6892338.

  • K. Upreti*, H-Y. Lin*, G. Subbarayan, D.Y. Jung, and B. Sammakia, "Simulations of damage and fracture in ULK under pad structures during Cu wirebond process," in proceedings of 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 609–615, 2014, doi:10.1109/ITHERM.2014.6892337.

  • S.S. Paranjothy*, Y. Singh*, A. Tippman*, H-Y. Lin*, G. Subbarayan, D.Y. Jung; and B.G. Sammakia, "Characterization of Cu Free Air Ball Constitutive Behavior using Microscale Compression Test," 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp.365,368, 2014, doi: 10.1109/ITHERM.2014.6892303.

  • H-Y. Lin*, K. Upreti*, A. Tippmann*, G. Subbarayan, D.Y. Jung, B.G. Sammakia, "Simulations of Deformation and Stress during Copper Wirebond on ULK Chips," in proceedings of ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack ’13), July 16-18, 2013, San Francisco, CA, ASME, paper number InterPACK2013-73178, doi: 10.1115/IPACK2013-73178.

  • Z. Huang*, I. Dutta, and G. Subbarayan, “Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps”, in proceedings of ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack ’13), July 16-18, 2013, San Francisco, CA, ASME, paper number IPACK2013-73079, doi: 10.1115/IPACK2013-73079.

  • H-Y. Lin* and G. Subbarayan, “Quantification of Behavioral Uncertainty resulting from Insertion of Heterogeneity into microstructure,” in proceedings of 53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, paper number AIAA-2012-1531, AIAA, 2012, doi: 10.2514/6.2012-1531.

  • B. Dan*, B.G. Sammakia, S. Kanuparthi*, G. Subbarayan, and S. Mallampati, "The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials to Refine the Random Network Model," in proceedings of 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 207-215, 2012, doi: 10.1109/ITHERM.2012.6231564.

  • J.P Tucker*, D.K. Chan*, G. Subbarayan, and C.A. Handwerker, "Maximum Entropy Fracture Model and Fatigue Fracture of Mixed SnPb/Sn3.0Ag0.5Cu Solder Alloys," in proceedings of 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 870-879, 2012, doi: 10.1109/ITHERM.2012.6231518.

  • S. Chavali*, Y. Singh*, G. Subbarayan and S. Garimella, “Viscoelastic Response of Compliant Thermal Interface Materials,” in proceedings of 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 282-289, 2012, doi: 10.1109/ITHERM.2012.6231441.

  • J.P Tucker*, D.K. Chan*, G. Subbarayan, and C.A. Handwerker, "Maximum Entropy Fracture Model and its Use for Predicting Cyclic Hysteresis in Solder Alloys," in proceedings of 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 207-215, 2012, doi: 10.1109/ITHERM.2012.6231432.

  • O. Morgan*, G. Subbarayan and D.C. Anderson, “A Hybrid Hierarchical Procedure for Composing Trivariate NURBS Solids,” In proceedings of CAD Conference and Exhibition (CAD’11), Paper#92, June 27-30, 2011, Taipei, Taiwan, 2011, doi: 10.3722/cadaps.2012.215-226.

  • S.S. Khalsa* and G. Subbarayan, “Squeeze Flow Models for Thermal Interface Materials contained between Parallel Plates and Plates with Posts,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ‘11), July 6-8, 2011, Portland, OR, ASME, Paper number IPACK2011-52170, 2011, doi: 10.1115/IPACK2011-52170.

  • A. Tambat*, H-Y. Lin*, I. Claydon*, G. Subbarayan, D-Y. Jung, and B.G. Sammakia, “Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ‘11), July 6-8, 2011, Portland, OR, ASME, Paper number IPACK2011-52237, 2011, doi: 10.1115/IPACK2011-52237.

  • H-Y. Lin*, A. Tambat*, I. Claydon*, G. Subbarayan, D-Y. Jung, and B.G. Sammakia, “Impact of Die Size, Die Thickness and Solder Joint Material on the Risk of Fracture in Low-k Dielectric Stacks,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ‘11), July 6-8, 2011, Portland, OR, ASME, Paper number IPACK2011-52258, 2011, doi: 10.1115/IPACK2011-52258.

  • S. Sadasiva* and G. Subbarayan, “3-D Numerical Simulations of Electro-migration Driven Void Initiation and Propagation in Pb-free Solder Interconnects,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ‘11), July 6-8, 2011, Portland, OR, ASME, Paper number IPACK2011-52230, 2011, doi: 10.1115/IPACK2011-52230.

  • N. Bajaj*, G. Subbarayan, and S.V. Garimella, "Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials," ASME International Mechanical Engineering Conference and Exhibition, vol. 4, pp. 427-436, November 12-18, 2010, Vancouver, BC, Canada, Paper number IMECE2010-40953, ASME, 2010, doi: 10.1115/IMECE2010-40953.

  • N. Bajaj*, G. Subbarayan, and S.V. Garimella, "Squeeze Flow Characterization of Particle-Filled Polymeric Materials through Image Correlation," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 1-6, 2010, doi: 10.1109/ITHERM.2010.5501302.

  • S. Goyal*, K. Srinivasan*, G. Subbarayan and T. Siegmund “Buckling, Wrinkling and Debonding in Thin Film Systems,” An invited paper in proceedings of 2010 IEEE International Reliability Physics Symposium, IEEE, pp. 430-439, 2010, doi: 10.1109/IRPS.2010.5488790.

  • K. Mysore* and G. Subbarayan, “A Theoretical and Computational Framework for Modelling Diffusion-Driven Boundary Motion without Remeshing,” An invited paper, in proceedings of International Union of Theoretical and Applied Mechanics (IUTAM) Symposium on Multifunctional Materials and Structures (IUTAM-MMSS08), Springer-Verlag, Volume 19, pp 335-342, 2010, doi: 10.1007/978-90-481-3771-8_34.

  • B. Dan*, B.G. Sammakia, and G. Subbarayan, "On Refining the Parameters of a Random Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 1-8, 2010, doi: 10.1109/ITHERM.2010.5501349.

  • Z. Huang, P. Kumar, I. Dutta, G. Subbarayan, V. Gupta, D. Chan*, and C.H. Wen, "Development of a Microstructurally Adaptive Unified Primary-cumsecondary Creep Model for SAC387 Solder Joints," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, pp. 1-8, 2010, doi: 10.1109/ITHERM.2010.5501264.

  • S. Chavali*, K. Mysore*, G. Subbarayan and I. Dutta, “Observations of Changes in Rate Dependent Flow of SnAgCu Alloys due to Aging,” in proceedings of ASME 2009 International Mechanical Engineering Congress and Exposition, Volume 5: Electronics and Photonics, pp. 173-178, November 13–19, 2009, Lake Buena Vista, FL, ASME, Paper number IMECE2009-11704, doi: 10.1115/IMECE2009-11704.

  • D. Chan*, X. Nie*, D. Bhate*, G. Subbarayan, W. Chen, and I. Dutta, “High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location within Solder Joints,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89404, 2009, doi: 10.1115/InterPACK2009-89404.

  • D. Chan*, D. Bhate*, G. Subbarayan, J. Zhao, D. Edwards, “Predicting Crack Growth and Fatigue Lives of QFN Solder Joints using a Multiscale Fracture Model,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89403, 2009, doi: 10.1115/InterPACK2009-89403.

  • D. Chan*, D. Bhate*, G. Subbarayan, L. Nguyen, “Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89402, 2009, doi: 10.1115/InterPACK2009-89402.

  • K. Mysore*, S. Chavali*, D. Chan*, G. Subbarayan, I. Dutta, V. Gupta, D. Edwards, “Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89401, doi: 10.1115/InterPACK2009-89401.

  • D. Bhate*, K. Mysore*, and G. Subbarayan, “A Multiscale Damage Accumulation Theory for Solder Joint Failure,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89399, doi: 10.1115/InterPACK2009-89399.

  • B. Dan*, S. Kanuparthi*, G. Subbarayan and B.G. Sammakia, “An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” In proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack ’09), July 19-23, 2009, San Franciso, CA, ASME, Paper number IPACK2009-89116, 2009, doi: 10.1115/InterPACK2009-89116.

  • S. Mahajan*, G. Subbarayan and B.G. Sammakia, “Estimating Kapitza resistance between Si-SiO2 interface using molecular dynamics simulations,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 1055-1062, 2008, doi: 10.1109/ITHERM.2008.4544379.

  • P. Kumar*, O. Cornejo*, I. Dutta, G. Subbarayan and V Gupta, “Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders” In proceedings of the 10th Electronic Packaging Technology Conference, Singapore, IEEE, pp. 903-909, 2008, doi: 10.1109/EPTC.2008.4763545.

  • D. Bhate*, G. Subbarayan, L. Nguyen, and J. Zhao, “Singularities at Solder Joint Interfaces and their Effects on Fracture Models: Part II,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 746-750, 2008, doi: 10.1109/ITHERM.2008.4544342.

  • D. Bhate*, G. Subbarayan, L. Nguyen, and J. Zhao, “Singularities at Solder Joint Interfaces and their Effects on Fracture Models: Part I,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 738-745, 2008, doi: 10.1109/ITHERM.2008.4544341.

  • X. Nie*, D. Bhate*, D. Chan*, W. Chen, G. Subbarayan, and I. Dutta, “Rate-Dependent Behavior of Sn3.8Ag0.7Cu Solder Over Strain Rates of 10-6 to 102 s-1,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 676-682, 2008, doi: 10.1109/ITHERM.2008.4544333.

  • K. Mysore*, D. Chan*, D. Bhate*, G. Subbarayan, I. Dutta, V. Gupta, J. Zhao, and D. Edwards, “Aging Informed Behavior of Sn3.8Ag0.7Cu Solder Alloys,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 870-875, 2008, doi: 10.1109/ITHERM.2008.4544357.

  • [7]S. Kanuparthi*, G. Subbarayan, T. Siegmund, and B.G. Sammakia, “Microstructural Characteristics Influencing the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” In proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008), IEEE, Vol. 1-3, pp. 227-237, 2008, doi: 10.1109/ITHERM.2008.4544275.

  • V. Srinivasan* and G. Subbarayan, “Hierarchical Partition of Unity Constructions for Meshless Optimal Design in the Presence of Cracks,” In proceedings (CD-ROM) of the 17th International Conference on Computer Methods in Mechanics (CMM), Lodz-Spala, Poland, June 19-22, 2007.

  • V. Srinivasan*, S. Radhakrishnan* and G. Subbarayan, “Design without CAD Exchange – A Secure Procedure for Design and Analysis in Distributed Product Development Environments,” In proceedings of the 7th World Congress on Structural and Multidisciplinary Optimization (WCSMO), ISBN: 978-89-959384-2-3, pp.647-656, COEX Seoul, Korea, May 21-25, 2007.

  • M. Rayasam*, X. Zhang*, G. Subbarayan, “A Compositional Approach to Shape Optimal Design”. In proceedings of the 7th World Congress on Structural and Multi-disciplinary Optimization (WCSMO), ISBN: 978-89-959384-2-3, pp 1613 - 1622, Seoul, Korea, May 21-25, 2007.

  • M. Rayasam*, V. Srinivasan*, G. Subbarayan, “Unified Topology and Shape Design of Multiscale, Heterogeneous Structures through Compositional Modeling of Geometry, Material and Behavior,” In proceedings of the 7th World Congress on Structural and Multidisciplinary Optimization (WCSMO), ISBN: 978-89-959384-2-3, pp.1769-1778, COEX Seoul, Korea, May 21-25, 2007.

  • D. Bhate*, D.K. Chan*, G. Subbarayan, T.C. Chiu, V. Gupta, and D. Edwards, “Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes,” In proceedings of the 2007 ASME International Mechanical Engineering Congress and Exhibition (IMECE07), paper number IMECE2007-44151, ASME, 2007, doi: 10.1115/IMECE2007-44151.

  • S. Mahajan*, G. Subbarayan and B.G. Sammakia, “Thermal Conductivity of Amorphous Silica Using Non-Equilibrium Molecular Dynamics Simulations,” In proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2006), IEEE, pp. 1269-1275, 2006, doi: 10.1109/ITHERM.2006.1645491.

  • S. Kanuparthi*, X. Zhang*, G. Subbarayan, B.G. Sammakia, A. Gowda and S. Tonapi, “Full Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance,” In proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2006), IEEE, pp. 1276-1282, 2006, doi: 10.1109/ITHERM.2006.1645492.

  • S. Kanuparthi*, X. Zhang*, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda and S. Tonapi, “Random Network Percolation Model for Particulate Thermal Interface Materials,” In proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2006), IEEE, pp. 1192-1198, 2006, doi: 10.1109/ITHERM.2006.1645480.

  • D. Bhate* and G. Subbarayan, “A Nonlinear Fracture Mechanics Perspective on Solder Joint Failure: Going Beyond the Coffin-Manson Equation,” In proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2006), IEEE, pp. 1220-1225, 2006, doi: 10.1109/ITHERM.2006.1645484.

  • D. Bhate*, D. Chan*, G. Subbarayan and T.C. Chiu, “Solder Interconnection Specimen Design and Test Control Procedure for Valid Constitutive Modeling of Solder Alloys,” In proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2006), IEEE, pp. 977-983, 2006, doi: 10.1109/ITHERM.2006.1645451.

  • D. Bhate*, D. Chan*, G. Subbarayan, "Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters," In proceedings of the 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, (EuroSimE 2006), Como, Italy, p 11643992, 2006, doi: 10.1109/ESIME.2006.1643992.

  • M. Rayasam* and G. Subbarayan, “Meshless Modeling and Shape Optimal Design of Heterogeneous Objects through Boolean Compositions of Geometrical, Behavioral and Material Fields,” An invited paper, in proceedings of the International Conference on Computational and Experimental Engineering and Sciences (ICCES ’05), pp. 366-374, India, Dec. 1-10, 2005.

  • S. Kanuparthi*, X. Zhang*, M. Rayasam*, G. Subbarayan, B.G. Sammakia, A. Gowda and S. Tonapi, “Hierarchical Design of Thermal Interface Materials,” A keynote paper, in proceedings of the International Conference on Computational and Experimental Engineering and Sciences (ICCES ’05), pp. 2508-2514, India, Dec. 1-10, 2005.

  • X. Zhang*, S. Kanuparthi*, G. Subbarayan, B.G. Sammakia, and S. Tonapi, “Hierarchical Modeling and Trade-off Studies in Design of Thermal Interface Materials,” In 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS and Electronic Systems (InterPack ’05), ASME, Paper number IPACK2005-73259, 2005, doi: 10.1115/IPACK2005-73259.

  • A. Desai, S. Mahajan*, G. Subbarayan, W. Jones, J. Geer and B.G. Sammakia, “A Technical Review of Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” In proceedings of the 4th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2005), Cairo, Egypt, September 19-22, 2005.

  • V. Srinivasan*, S. Radhakrishnan*, X. Zhang*, G. Subbarayan, T. Baughn and L. Nguyen, “High Resolution Characterization of Materials Used in Packages through Digital Image Correlation,” In 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS and Electronic Systems (InterPack ’05), ASME, Paper number IPACK2005-73258, 2005, doi: 10.1115/IPACK2005-73258.

  • D. Littlewood* and G. Subbarayan, “Maintaining an Accurate Printer Characterization,” In the proceedings of the 12th Color Imaging Conference: Color Science and Engineering, Systems, Technologies, Applications, IS&T, ISBN / ISSN: 0-89208-254-2, pp. 203-210, Scottsdale, AZ, November 9, 2004.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen, and W. Mazotti, “Stochastic Characterization of Epoxies to Predict Performance Uncertainty of Photonic Packages,” In the proceedings of the 2004 ASME International Mechanical Engineering Congress and Exhibition (IMECE04), paper number IMECE2004-61846, ASME, 2004, doi: 10.1115/IMECE2004-61846.

  • A. Desai, S. Mahajan*, G. Subbarayan, W. Jones, J. Geer and B.G. Sammakia, “An analytical study of transport in a thermal interface material enhanced with carbon nanotubes,” In proceedings of the 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2004), IEEE, pp. 403-409, 2004, doi: 10.1109/ITHERM.2004.1319203.

  • S. Mahajan*, G. Subbarayan, B.G. Sammakia and W. Jones, “Molecular Dynamics Simulations of Nanotube-Polymer Composites for use as Thermal Interface Material,” In proceedings of the 2003 ASME International Mechanical Engineering Congress and Exhibition, paper number IMCE2003-42462, ASME, 2003, doi: 10.1115/IMECE2003-42462.

  • P. Towashiraporn*, and G. Subbarayan, “A Hybrid Fracture-Damage Model for Computationally Efficient Fracture Simulations in Solder Joints,” An invited Paper presented at the special session in memory of Andreas Schubert. In proceedings of the 5th Electronic Packaging Technology Conference (EPTC 2003), IEEE, pp. 462-469, 2003, doi: 10.1109/EPTC.2003.1271566.

  • S. Radhakrishnan*, G. Subbarayan, L. Nguyen and W. Mazotti, “A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiber-Optic System,” In proceedings of the 2003 ASME International Mechanical Engineering Congress and Exhibition, paper number IMCE2003-42667, ASME, 2003, doi: 10.1115/IMECE2003-42667.

  • X. Zhang* and G. Subbarayan, “A Meshfree Framework for Droplet Shape Prediction,” In proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2002), IEEE, pp. 819-826, 2002, doi: 10.1109/ITHERM.2002.1012539.

  • P. Towashiraporn*, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, and R. Sullivan, “The Effect of Model Building on the Accuracy of Fatigue Life Predictions in Electronic Packages,” In proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2002), IEEE, pp. 854-861, 2002, doi: 10.1109/ITHERM.2002.1012544.

  • P. Towashiraporn*, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, and R. Sullivan, “Predictive Reliability Models through Validated Correlation between Power Cycling and Thermal Cycling Accelerated Life Tests,” In proceedings of Apack 2001, International Conference on Advances in Packaging, ISBN No. 981-04-4638-1, pp. 326-337, Dec. 5-7, 2001, Singapore, doi: 10.1108/09540910210444737.

  • L. Zhang*, G. Subbarayan, B.C. Hunter and D. Rose, “Response Surface Models for Efficient, Modular Estimation of Solder Joint Reliability in Area Array Packages,” In proceedings of Apack 2001, International Conference on Advances in Packaging, ISBN No. 981-04-4638-1, pp. 234-244, Dec. 5-7, 2001, Singapore, doi: 10.1016/j.microrel.2004.06.007.

  • P. Towashiraporn*, T.B. Thompson*, G. Subbarayan, C. Gurumurthy, and J.R. Wilcox, “Validation of a Model for Predicting the Shape of Solder Joints in the Presence of Volume Variation and Component/Board Warpage,” In proceedings of Apack 2001, International Conference on Advances in Packaging, ISBN No. 981-04-4638-1, pp. 226-233, Dec. 5-7, 2001, Singapore.

  • D. Natekar* and G. Subbarayan, “Computationally Efficient Fracture Analysis of Mixed Linear-Nonlinear Systems through Decomposition,” In 2001 Pacific Rim/International, Intersociety, Electronic Packaging Technical Conference and Exhibition (InterPack ’01), ASME, Paper number IPACK2001-15704, 2001, doi: 10.1106/F9W7-XGV5-9PME-D5CX.

  • T. Ratanawilai* and G. Subbarayan, “An Evaluation of the Accuracy of Cross-Sectional Moire Interferometry for Thermal Strain Measurement,” In 2001 Pacific Rim/International, Intersociety, Electronic Packaging Technical Conference and Exhibition (InterPack ’01), ASME, Paper number IPACK2001-15689, 2001.

  • L. Zhang* and G. Subbarayan, “A Decomposed Analysis Procedure for Underfilled Area-Array Packages,” In 2001 Pacific Rim/International, Intersociety, Electronic Packaging Technical Conference and Exhibition (InterPack ’01), ASME, Paper number IPACK2001-15703, 2001.

  • [8]D. Kulkarni* and G. Subbarayan, “A Dynamic Model for Predicting the Motion of Solder Droplets During Assembly,” In proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2000), Kromann, G. et al. (ed.), IEEE, `Volume I, pp. 368-376, 2000, doi: 10.1109/ITHERM.2000.866849.

  • T.B. Thompson*, F.P. Renken*, G. Subbarayan and R. James, “A Stochastic Model for Assessing the Reliability Impact of Board Warpage on Area-Array Packages,” In proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2000), Kromann, G. et al. (ed.), IEEE, Volume I, pp. 405-414, 2000, doi: 10.1109/ITHERM.2000.866855.

  • T. Ratanawilai*, B.C. Hunter*, G. Subbarayan and D. Rose, “A Comparison between Moire Interferometry and Strain Gages for Effective CTE Measurement in Electronic Packages,” In proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2000), Kromann, G. et al. (ed.), IEEE, Volume II, pp. 246-252, 2000, doi: 10.1109/ITHERM.2000.866198.

  • T.B. Thompson* and G. Subbarayan, “An implementation of a decomposed analysis procedure for area-array packages,” Paper number 99-IMECE/EEP-11, ASME, 1999, doi: 10.1115/1.1339197

  • A. Deshpande* and G. Subbarayan, “Decomposition techniques for the efficient analysis of area array packages,” In D. Agonafer, M. Saka and Y.C. Lee (eds.), Advances in Electronic Packaging – 1999, EEP-Vol. 26-1, Volume 1, pp. 35-42, ASME, 1999, doi: 10.1115/1.483126.

  • B.C. Hunter*, G. Subbarayan and D. Rose, “Characterization of PCB expansion using Moiré interferometry and the impact of expansion variability on the life of solder joints,” In D. Agonafer, M. Saka and Y.C. Lee (eds.), Advances in Electronic Packaging – 1999, EEP-Vol. 26-1, Volume 1, pp. 875-882, ASME, 1999.

  • A. Deshpande*, G. Subbarayan, and D. Rose, “A System for First Order Reliability Estimation of Area Array Packages,” In proceedings of the ASME Manufacturing Science and Engineering Division – 1998, ASME, MED-Vol 8, pp. 767-777, 1998, doi: 10.1115/1.483125.

  • L. Zhang*, B.C. Hunter*, G. Subbarayan, and D. Rose, “An Evaluation of the Accuracy of Structural Approximations Employed for Area Array Packages,” In 1998 proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm ’98), IEEE, pp. 269-276, 1998, 10.1109/ITHERM.1998.689560.

  • A. Deshpande* and G. Subbarayan, “Optimal Design of Land Grid Array Connectors,” In Y.C. Lee, G. Subbarayan, E. Suhir, and M. Shiratori (eds.), Advances in Electronic Packaging 1997, EEP-Vol. 19-1, pp. 939-943, ASME, 1997, doi: 10.1115/1.2792227.

  • F.P. Renken* and G. Subbarayan, “A Two-Body Formulation for Solder Joint Shape Prediction,” In Y.C. Lee, G. Subbarayan, E. Suhir, and M. Shiratori (eds.), Advances in Electronic Packaging 1997, EEP-Vol. 19-2, pp. 1397-1405, ASME, 1997, doi: 10.1115/1.2792637.

  • Y. Li*, R.L. Mahajan, and G. Subbarayan, “The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints,” In International Symposium on Information Storage and Processing Systems, ASME, Manufacturing Engineering Division, MED. V 4 pp. 119-129, ASME, New York, NY, USA, 1996, doi: 10.1115/1.2792286.

  • A. Deshpande*, G. Subbarayan and R.L. Mahajan, “Global Approximation Concepts for Optimal Design of Electronic Packages,” Paper number 96-WA/EEP-9, ASME, 1996.

  • G. Subbarayan, “The Nature of Centroidal Locus in Misaligned Flip-Chip and BGA Solder Joints,” Paper number 96-WA/EEP-18, ASME, 1996.

  • G. Subbarayan, “A Procedure for Automated Profile and Life Prediction in Flip-Chip and BGA Solder Joints. Part II: Numerical Solution,” Paper number 95-WA/EEP-25, ASME, 1995.

  • G. Subbarayan, “A Procedure for Automated Profile and Life Prediction in Flip-Chip and BGA Solder Joints. Part I: Mathematical Model,” Paper number 95-WA/EEP-17, ASME, 1995.

  • G. Subbarayan, K. Ramakrishna, and B.G. Sammakia, “The Impact of Interfacial Adhesion on PTH and Via Reliability,” In T.Y. Wu (ed.), Application of Fracture Mechanics in Electronic Packaging and Materials, ASME, pp. 45-54, 1995.

  • S.A. Leclerc* and G. Subbarayan, “Issues in Low-Cost Manufacture of Reliable Optoelectronic Systems,” In Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium “Manufacturing Technologies – Present and Future,” IEEE, pp. 460-470, 1995, doi: 10.1109/IEMT.1995.526204.

  • G. Subbarayan, Y. Li*, and R.L. Mahajan, “Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models,” In T.R. Hsu, A. Bar-Cohen, and W. Nakayama (eds.), Advances in Electronic Packaging 1995, ASME, pp. 459-472, 1995, doi: 10.1115/1.2792145.

  • K. Ramakrishna, G. Subbarayan, and B.G. Sammakia, “Effect of Non-Uniformities and Defects on PTH Strain During Assembly and Accelerated Thermal Cycling,” In W.T. Chen, and H. Abe (eds.), Advances in Electronic Packaging 1992, ASME, EEP-Vol. 2, pp. 891-908, 1992.

  • G. Subbarayan and D.L. Bartel. “Fully Stressed and Minimum Mass Structures in Bone Remodeling Problems,” In P.A. Torzilli and M.H. Friedman (eds.), 1989 Biomechanics Symposium, ASME, AMD-Vol. 98, pp. 173-176, 1989.

  • G. Subbarayan, D.L. Bartel, and D.L. Taylor, “Method for Comparative Performance Evaluation of Structural Optimization Codes. Part II: Applications,” In S.S. Rao (ed.), Advances in Design Automation, ASME, DE-Vol. 14, pp. 227-232, 1988.

  • G. Subbarayan, D.L. Bartel, and D.L. Taylor, “Method for Comparative Performance Evaluation of Structural Optimization Codes. Part I: Theory. In S.S. Rao (ed.), Advances in Design Automation, ASME, DE-Vol. 14, pp. 221-225, 1988.

  • G. Subbarayan, D.L. Taylor, and D.L. Bartel, “An Implementation of a Programming System for Shape Optimal Design of Continuous Solids,” In proceedings of ASME International Computers in Engineering Conference and Exhibition, ASME, pp. 221-226, 1988.

Published Extended Abstracts of Conference Presentations (Selected)

  • G. Subbarayan and D.L. Bartel, “Bone Remodeling Around a Hole: A Comparison of Theoretical and Experimental Results,” In Transactions of the 37th Annual Meeting of the Orthopaedic Research Society, Vol. 16, section 2, pp. 425, 1991.

Patents

  • B.G. Sammakia, W.E. Jones and G. Subbarayan, Nano-Structure Enhancements for Anisotropic Conductive Adhesive and Thermal Interposers. U.S. Patent No. 7,645,512 B1, awarded January 12, 2010.

  • P.A. Drakopoulos* and G. Subbarayan. Color Printer Characterization Using Optimization Theory and Artificial Neural Networks. U.S. Patent No. 6,480,299 B1, awarded November 12, 2002. Currently under license to Bukhara Tech Talk.

Keynote Presentations

  • “Enriched Isogeometric Analysis on Stitched NURBS Patches,” 15th US National Congress on Computational Mechanics (USNCCM), July 28-Aug. 1, 2019.

  • “Algebraic Point Projection for Explicitly Tracked Interfaces and Immersed Boundaries,” USACM Conference on Isogeometric Analysis and Meshfree Methods, La Jolla, CA, October 10-12, 2016.

  • “A Unified Material-Geometric Approach to Topology Optimization,” Keynote presentation at the Fourth International Conference on Structural Stability and Dynamics (ICSSD-2012), Jaipur, India, January 4-6, 2012.

  • “Simulations of Crack Initiation and Propagation in Interlayer Dielectric Stacks: An Evaluation of Chip-Package Interaction,” Keynote presentation in the Symposium on Mechanics of Integrated Structures and Materials in Advanced Technologies, 2011 ASME International Mechanical Engineering Congress and Exposition, Denver, CO, November 11-17, 2011.

  • “Hierarchical Design of Thermal Interface Materials,” Keynote paper presented at the International Conference on Computational and Experimental Engineering and Sciences (ICCES ’05), pp. 2508-2514, Chennai, India, Dec. 1-10, 2005.


[1] Received the 2012 Best Paper Award, Characterization and Modeling category.

[2] Received the Best Paper of the Year Award, 2008-2009.

[3] Received the 2003 Charles E. Ives Outstanding Paper Award (honorable mention).

[4] Received the 2003 Highly Commended Paper Award.

[5] Received the 1996 Peter A. Engel Best Paper Award.

[6] Received Best Paper Award for the conference.

[7] Received the Outstanding Paper Award.

[8] Received the Itherm 2000 Best Paper Award.