Group Members
Current Group Members
Y. Chen
C-S. Lee
S. Achar
H. Liao
D. Halbrooks
S. Prasad
S. Ganti
C. Jois
C. Greene
Past Group Members - Ph.D.
1. T. Dale, "Brittle-Ductile Fracture of Intermetallic Rich Solder Joints," Ph.D. Thesis, Purdue University, 2020.
T. Dale (2020)
2. P. Vaitheeswaran, "Interface Balance Laws, Growth Conditions and Explicit Interface Modeling using Algebraic Level Sets for Multiphase Solids with Inhomogeneous Surface Stress ," Ph.D. Thesis, Purdue University, 2020.
https://www.linkedin.com/in/pavan-kumar-vaitheeswaran-b65982b7/
P. Vaitheeswaran (2020)
3. C-P. Chen, "Enriched Isogeometric Analysis For Parametric Domain Decomposition And Fracture Analysis," Ph.D. Thesis, Purdue University, 2020.
C-P. Chen (2020)
4. Y. Singh, "Characterization of Interfacial Energy of Thin Films through Current Induced Diffusive Interfacial Voiding," Ph.D. Thesis, Purdue University, 2019.
Y. Singh (2019)
5. C. J. Young, “Damage, Tension/Compression Asymmetry and Inferred Crack Growth in Fatigue of Aluminum Alloys,” Ph.D. Thesis, Purdue University, 2017. (Co-Advised by Professor A.K. Bajaj)
C. J. Young (2017)
6. T. Song, “A Sharp Interface Isogeometric Strategy for Moving Boundary Problems,” Ph.D. Thesis, Purdue University, 2016.
T. Song (2016)
7. A. Udupa, “Phase Nucleation and Evolution Mechanisms in Heterogeneous Solids,” Ph.D. Thesis, Purdue University, 2015.
A. Udupa (2015)
8. K. Upreti, “Algebraic Level Sets for CAD/CAE Integration and Moving Boundary Problems,” Ph.D. Thesis, Purdue University, 2014.
K. Upreti (2014)
9. S. Sadasiva, “Simulations of Diffusion Driven Phase Evoluation in Heterogeneous Solids,” Ph.D. Thesis, Purdue University, 2014.
S. Sadasiva (2014)
10. H-Y. Lin, “Configurational Optimization for Optimal Topological and Fracture Resistant Design of Solids,” Ph.D. Thesis, Purdue University, 2013.
H-Y. Lin (2013)
11. A. Tambat, “Explicit Geometry Based Enriched Field Approximations,” Ph.D. Thesis, Purdue University, 2013.
A. Tambat (2013)
12. S. Chavali, “Diffusion Driven Microstructural Evolution and its Effect on Mechanical Behavior of SnAgCu Solder Alloys,” Ph.D. Thesis, Purdue University, 2012. (Co-advised by Professor M. Dayananda)
S. Chavali (2012)
13. D.K. Chan, “A Maximum Entropy Fracture Model for Low and High Strain-Rate Fracture in SnAgCu Alloys,” Ph.D. Thesis, Purdue University, 2012.
D. K. Chan (2012)
14. J. Tucker, “Microstructural Effects on Constitutive and Fatigue Fracture Behavior of SnAgCu Solder,” Ph.D. Thesis, Purdue University, 2012.
J. Tucker (2012)
15. O. Morgan, “HIGEOM: A Symbolic Framework for a Unified Function Space Representation of Geometry and Attributes of Solids,” Ph.D. Thesis, Purdue University, 2011. (Co-advised by Professor D.C. Anderson)
O. Morgan (2011)
16. K. Mysore, “Arbitrarily Explicit/Implicit Computational Procedures for Modeling Phase Evolution,” Ph.D Thesis, Purdue University, 2009.
K. Mysore (2009)
17. S. Goyal, “Mechanics of Thermally Driven Buckling-Induced Debonding in Thin Films,” Ph.D. Thesis, Purdue University, 2009.
S. Goyal (2009)
18. K. Srinivasan, “Numerical Simulations of Wrinkling and Wrinkling-Induced Debond,” Ph.D. Thesis, Purdue University, 2008. (Co-advised by Professor T. Siegmund)
K. Srinivasan (2008)
19. V. Srinivasan, “Hierarchical Field Compositions for Discontinuous Enrichment and System-Level Synthesis,” Ph. D. Thesis, Purdue University, 2008.
V. Srinivasan (2008)
20. D. Bhate, “Hierarchy in Fracture as a Stochastic Process: Model, Implementation, and Validation,” Ph.D. Thesis, Purdue University, 2008.
D. Bhate (2008)
21. S. Kanuparthi, “Simulations of Near-Percolation Thermal Transport in Particulate Composites,” Ph.D. Thesis, Purdue University, 2007. (Co-advised by Professor T. Siegmund)
S. Kanuparthi (2007)
22. S. Mahajan, “Molecular Simulations for Determination of Transport Properties of Nano-composites,” Ph.D. Thesis, Purdue University, 2007.
S. Mahajan (2007)
23. M. Rayasam, “Hierarchical Partition of Unity Constructions for Multiscale Design Optimization of Heterogeneous Objects,” Ph.D. Thesis, Purdue University, 2007.
M. Rayasam (2007)
24. Y. Luo, “Modeling of Stress and Stressmigration in Microelectronics Interconnects,” Ph.D. Thesis, Purdue University, 2007.
Y. Luo (2007)
25. S. Radhakrishnan, “Hierarchical Procedures for Distributed Design of Engineering Systems,” Ph.D. Thesis, Purdue University, 2005.
S. Radhakrishnan (2005)
26. X. Zhang, “Constructive Modeling Strategies and Implementation Frameworks for Hierarchical Synthesis,” Ph.D. Thesis, Purdue University, 2004.
X. Zhang (2004)
27. P. Towashiraporn, “Computationally Efficient Fatigue Life Prediction of Area Array Solder Joints: Comparison of Empirical and Damage Based Models,” Ph.D. Thesis, University of Colorado, 2003.
P. Towaishiraporn (2003)
28. D. W. Natekar, “Constructive Solid Analysis (CSA): A Geometry-Based Meshless Procedure for Integrated Analysis and Design,” Ph.D. Thesis, University of Colorado, 2002.
D. W. Natekar (2002)
29. T. Ratanawilai, “Inexpensive, High-Resolution, and High-Temperature Characterization of Thermally Induced Strains: Applications to Microelectronics and Fuel Cells,” Ph.D. Thesis, University of Colorado, 2002.
T. Ratanawilai (2002)
30. D.J. Littlewood, “Printer Color Management Using Pareto-Optimization and Efficient Calibration Techniques,” Ph.D. Thesis, University of Colorado, 2001.
D. J. Littlewood (2001)
31. L. Zhang, “An Evaluation of Feed-Forward, Back-Propagation Neural Networks for Optimal Design of Structural Systems and Modular Analysis of Electronic Packages,” Ph.D. Thesis, University of Colorado, 2001.
L. Zhang (2001)
32. T.B. Thompson, “Decomposed Analysis of the Reliability of Area-Array Electronic Packages Including Assembly Process Effects,” Ph.D. Thesis, University of Colorado, 2000.
T. B. Thompson (2000)
33. A. Deshpande, “Partitioned Analysis and Approximations in Optimization of Mechanical Systems: A Focus on Electronic Packages,” Ph.D. Thesis, University of Colorado, 2000.
A. Deshpande (2000)
Past Group Members - M.S.
1. S. Achar, “Generation of Ultra-Packed Thermal Greases and Evaluation of their Effective Properties,” M.S. Thesis, Purdue University, 2018.
S. Achar (2018)
2. Y. Li, “The Effect of Static and Dynamic Aging on the Fatigue Behavior of Sn3.5Ag0.7Cu Solder Alloy,” M.S. Thesis, Purdue University, 2016.
Y. Li (2016)
3. S. Paranjothy, “Experimental Characterization of Cu Free-Air-Ball and Simulations of Dielectric Fracture During Wire Bonding,” M.S. Thesis, Purdue University, 2014.
S. Paranjothy (2014)
4. N. Bajaj, “Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials,” M.S. Thesis, Purdue University, 2011. (Co-advised by Professor S. Garimella)
N. Bajaj (2011)
5. S. S. Khalsa, “Development of Squeeze Flow Models for Thermal Interface Materials Contained Between Planar and Non-Planar Geometries,” M.S. Thesis, Purdue University, 2010.
S. S. Khalsa (2010)
6. D. V. Kulkarni, “Non Uniform Rational B-spline based Analysis Techniques,” M.S. Thesis, University of Colorado, 2002.
D. V. Kulkarni (2002)
7. B. C. Hunter, “Development of the Experimental Capabilities of Moire Interferometry and Micro-Mechanical Testing for the Characterization of Electronic Packages,” M.S. Thesis, University of Colorado, 1998.
B. C. Hunter (1998)
8. P. A. Drakopoulos, “Color Printer Characterization Using Optimization Theory and Artificial Neural Networks,” M.S. Thesis, University of Colorado, 1997.
P. A. Drakopoulos (1997)
9. F. P. Renken, “Optimization Analysis for Solder Joint Shape Prediction using Finite Element and NURBS Surface Representation,” M.S. Thesis, University of Colorado, 1997.
F. P. Renken (1997)
10. R. K. L. Sripada, “A Second Order Mixed Interior-Exterior Point Algorithm for Optimal Design of LGA Connectors,” M.S. Thesis, University of Colorado, 1995.
R. K. L. Sripada (1995)
Past Post-Doctoral Research Associates & Visiting Scholars
A. Udupa, 8/15-12/15, Currently a post-doctoral researcher in School of Industrial Engineering, Purdue University.
Professor Y. Xu, 7/15-6/16, Visiting Scholar from Zhejiang University of Technology.
D. Basu, 1/07-6/07, Currently on the faculty of Civil Engineering at U. Waterloo, Waterloo, Canada.
S. Gadag, 12/00-5/02
A. Deshpande, 9/01-4/02, Currently at Intel Corporation, Bangalore, India.