Ganesh Subbarayan


Professor, School of Mechanical Engineering

Purdue University, 585 Purdue Mall, West Lafayette, IN 47907-2088

Phone: (765) 494-9770, Email: ganeshs[at]purdue.edu

Education

Ph.D., Mechanical Engineering, Cornell University, Ithaca, New York, January 1991.

(Direct Ph.D. program, special M.S. awarded in January 1989)

B. Tech., Mechanical Engineering, Indian Institute of Technology, Madras, India, July 1985.

Professional Experience

7/14-8/15 Associate Head for Graduate Studies, Mechanical Engineering, Purdue University, West Lafayette, Indiana

1/09-6/09: Visiting Professor, Mechanical and Production Engineering, National University of Singapore, Singapore

8/05- Professor, Mechanical Engineering, Purdue University, West Lafayette, Indiana

10/02- 8/05: Associate Professor, Mechanical Engineering, Purdue University, West Lafayette, Indiana

8/99-9/02: Associate Professor, Mechanical Engineering, University of Colorado, Boulder, Colorado

1/94-7/99: Assistant Professor, Mechanical Engineering, University of Colorado, Boulder, Colorado

10/90-11/93: Development Staff Member, IBM Corporation, Endicott, New York

Honors and Awards

  • 2017 Best Paper Award (of all the papers presented at the conference), ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK '17).
  • 2016 Best Paper Award (Honorable Mention, Mechanics Track), 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm ‘16).
  • 2016 Best Student Poster Award (Mechanics Track, T. Song), 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm ‘16).
  • 2016 Student Poster Award (Third place, Y. Singh), 2016 Flexible & Printed Electronics Conference & Exhibition (2016 FLEX), http://www.prnewswire.com/news-releases/outstanding-group-of-companies-and-individuals-receive-flextechs-flexi-awards-for-flexible-electronics-innovation-rd-and-leadership-300230506.html.
  • 2012 Best Paper, Characterization and Modeling, IEEE Transactions on Components, Packaging and Manufacturing Technology.
  • 2011 Ruth and Joel Spira Award for Excellence in Teaching, for “Excellence in Teaching as a mechanical engineering faculty member who both inspires students and fosters excellence in commercial or defense product realization.”
  • 2011 Intel Best Student Paper Award (S. Chavali, total of 252 papers, 62 student papers), 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
  • Elected Fellow, IEEE, 2011, “for contributions to reliability and their associated computational techniques in mechanics.”
  • Topical Editor, Advanced Packaging, 2011-12, Encyclopedia of Electrical and Electronics Engineering, John Wiley & Sons.
  • 2008-2009 Best Paper of the Year Award, ASME Transactions Journal of Electronic Packaging.
  • 2008 Outstanding Paper Award, Thermal Track (approximately 90 papers), IEEE Eleventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2008).
  • Elected Fellow, ASME, 2006
  • University Faculty Scholar Award, 2005-2010, Purdue University. Selected by College of Engineering among elected nominees from various Schools of Engineering (two from schools with 20+ faculty, one otherwise).
  • “2005 Excellence in Mechanics Award,” Electronic and Photonic Packaging Division, ASME, November 2005, for outstanding contributions in the area of Engineering Mechanics applications to the field of Electronic and Photonic Packaging.
  • 2005 Discovery in ME Award, School of Mechanical Engineering, Purdue University, for singular faculty research accomplishment over five years.
  • Elected Senior Member, IEEE, 2005
  • 2003 Charles E. Ives Outstanding Paper Award (honorable mention, one of two papers selected for this mention), Journal of Imaging Science and Technology.
  • 2003 Highly Commended Award, Soldering & Surface Mount Technology Journal.
  • Editor-in-Chief, IEEE Transactions on Advanced Packaging (2002-2010). Impact factor: 0.947 (2002), 1.070 (2003, 2nd highest of all manufacturing related journals), 1.025 (2004), 1.254 (2005, 3rd highest of all manufacturing related journals), 1.443 (2006), 1.011 (2007), 1.253 (2008), 1.122 (2009). Five-year impact factor (for years available): 1.282 (2007), 1.734 (2008), 1.482 (2009).
  • 2000 Best Paper Award, 7th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm ‘00).
  • NSF CAREER Award, April 1998.
  • 1996 Peter A. Engel Best Paper Award, ASME Transactions Journal of Electronic Packaging.