Embedded Files
Pui-In Mak (Elvis) was born in Macau ('79), and raised there with his early education in Escola de Santa Teresa and Instituto Salesiano. He received the B.Sc. (’03) and Ph.D. (’06) degrees from the University of Macau (UM), where he is currently Full Professor at the Faculty of Science and Technology (FST) - Electrical and Computer Engineering (ECE); Director at the State-Key Laboratory of Analog and Mixed-Signal VLSI, and Deputy Director (Research) at the Institute of Microelectronics. His research focuses are on circuits and systems for wireless and multidisciplinary innovations. He has advised 60+ graduate students and 20+ researchers.
He co-developed 44 state-of-the-art chips reported consecutively at the 2011-2025 IEEE International Solid-State Circuits Conference - ISSCC (Chip Olympics), of which 10 are ISSCC Highlight Papers. His graduates are with universities/companies developing cutting-edge topics/products for a wide variety of applications like 5G+ precision analog, smart energy, IoE connectivity and automotive.
His group pioneered the Intelligent Digital Microfluidic (iDMF) and micro-Nuclear Magnetic Resonance (micro-NMR) plaftorms for biological/chemical diagnostics. The works led to multidisciplinary publications in leading journals: Nature Communications, Advanced Science, Microsystems & Nanoengineering, Lab on a Chip, ACS Analytical Chemistry, ACS Sensors, Biosensors and Bioelectronics, Sensors and Actuators, etc. In 2018, the group founded the DigiFluidic Biotech Ltd. for commercializing the iDMF platform for virus screening and food-quality monitoring.
He has co-authored ~590 publications (12, books/book chapters, 330+ papers in journals and 250+ in conferences) and holds 35+ patents (issued/filed). He has delivered 120+ lectures as keynotes (PRIME’16, RFID-TA’16, ICAC'19, ICTA'19, APCCAS'21, ICICM'22, ICICM'23, Hisi Analog Technology Summit'25), industrial seminars (Qualcomm’17, imec’17) and tutorials/short courses (ISCAS’12, APCCAS’12, VLSI-DAT’15, ACTS'20).
Prof. Mak is recognized globally for his scientific merits and leadership. He received several medals and fellowships from prestigious academies and societies, and is the Editor-in-Chief of IEEE Solid-State Circuits Letters (2024-2026). His research works have been recognized with many awards, including the Tencent Xplorer Prize in 2022 and the ISSCC 70th Anniversary Top Paper Contributors in 2023.
Global Collaboration:
Chinese Academy of Sciences, Stanford U., Harvard U., U. of Pavia, imec, UC Dublin, IST-ULisboa, etc
Career Highlights:
Medal of Merit - Education, Macau SAR Government, 2024
Foreign Academician, Academy of Sciences of Lisbon, Portugal, since 2024
ISSCC 70th Anniversary Top Paper Contributors, IEEE International Solid-State Circuits Conference (ISSCC), 2023
Tencent Xplorer Prize, New Cornerstone Foundation, 2022
Visiting Chair Professorship, Chinese Ministry of Education, China, since 2021
Fellow, Royal Society of Chemistry (RSC) UK, since 2020
Fellow, Institute of Electrical and Electronics Engineers (IEEE), since 2019
National Commemorative Medal, PRC 70th Anniversary, 2019
National Parade Representative, PRC 70th Anniversary, 2019
Fellow, Institution of Engineering and Technology (IET), since 2018
Overseas Expert, Chinese Academy of Sciences (CAS), since 2018
Distinguished Lecturer, IEEE Solid-State Circuits Society (SSCS), 2017 - 2018
Distinguished Lecturer, IEEE Circuits and Systems Society (CASS), 2014 - 2015
Macau Science & Technology Award x 9, Macau SAR Government - FDCT, since 2012
National Science & Technology Progress Award, National Award Series, 2011
Clare-Hall Visiting Fellow, University of Cambridge UK, 2009
Honorary Title of Value, Macau SAR Government, 2005
IEEE Awards Highlights:
Predoctoral Achievement Award x7 (students), IEEE Solid-State Circuits Society (SSCS), since 2014
Student Paper Award, IEEE Radio-Frequency Integrated Circuits Symposium (RFIC), 2021
Best Paper Award, IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2019
SRP Poster Award, IEEE International Solid-State Circuits Conference (ISSCC), 2018
Silkroad Award, IEEE International Solid-State Circuits Conference (ISSCC), 2016
Distinguished Design Award, IEEE Asian Solid-State Circuits Conference (A-SSCC), 2015
Best Associate Editor, IEEE Transactions on Circuits and Systems II (TCAS-II), 2012 - 2013
GOLD Achievement Award, IEEE Member and Geographic Activities (MGA), 2009
Outstanding Young Author Award, IEEE Circuits and Systems Society (CASS), 2009
Student Paper Award, IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2008
Design Contest Award, ACM Design Automation Conference (DAC) and ISSCC, 2005
IEEE Involvement Highlights:
AdCom Member, IEEE Solid-State Circuits Society (SSCS), 2024 - 2026
Chairperson of Distinguished Lecturer Program, IEEE Circuits and Systems Society (CASS), 2018 - 2019
Board-of-Governor Member, IEEE Circuits and Systems Society (CASS), 2009 - 2011
Editorial & Conference Experience Highlights:
Editor-in-Chief, IEEE Solid-State Circuits Letters (SSCL), 2024 - 2026 [first Asian scholar appointed]
Editorial Board Member, Nature Scientific Reports, 2025 -
Associate Editor, IEEE Journal of Solid-State Circuits (JSSC), 2018 - 2024
Associate Editor, IOP Journal of Semiconductors (JOS), 2021- 2023
Associate Editor, IEEE Solid-State Circuits Letters (SSCL), 2017 - 2023
Editorial Board Member, IEEE Press, 2014 - 2016
Senior Editor, IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), 2014 - 2015
Associate Editor, IEEE Transactions on Circuits and Systems I (TCAS-I), 2010 - 2011, 2014 - 2015
Associate Editor, IEEE Transactions on Circuits and Systems II (TCAS-II), 2010 - 2013
Guest Editor, IEEE RFIC Virtual Journal 2014, JSSC 2018, JETCAS 2018 and IEEE Sensors Journal 2019
Technical Program Committee Member, ISSCC 2017- 2019, ESSCIRC 2016 - 2017, and A-SSCC 2013 - 2016,'19
Press Release & Interview Links:
University of Macau Introduction
State-Key Lab of AMSV Video
Digifluidic Virus Hunter Plus Video
DigiFluidic company highlighted in Nature Spotlight - Making it in the megacity, November 2020.
Interview of Batteryless Intelligent Electronic Chips - MIT Technology Review China
IEEE Spectrum (Chinese) Interview, August 2022.
Foreign Academician (Fellow), Academy of Sciences of Lisbon, Portugal
Editor-in-Chief, IEEE Solid-State Circuits Letters
Explore the realm of industry-university-research cooperation, Ambassador for Hengqin
Pui-In Mak's Book Preview in Apple
Google Sites
Report abuse