<Journal Publication>
(†): Co-first authors, (*): Corresponding authors
[9] Byeong-Je Park, Chae-Jeong Hwang, Geon-Ung Park, Min-Su Park*, and Daeyong Shim*, “Drain-Voltage Assessment-Based RC Snubber Design Approach for GaN HEMT Flyback Converters,” electronics 15(2) 271 (2026).
[8] D. Shim et al., "Holistic approaches to memory solutions for the Autonomous Driving Era," 2022 IEEE International Symposium on Circuits and Systems (ISCAS), Austin, TX, USA, pp. 351-355, (2022).
[7] Dong Uk Lee, Ho Sung Cho, Jihwan Kim, Young Jun Ku, Sangmuk Oh, Chul Dae Kim, Hyun Woo Kim, Woo Young Lee, Tae Kyun Kim, Tae Sik Yun, Min Jeong Kim, SeungGyeon Lim, Seong Hee Lee, Byung Kuk Yun, Jun Il Moon, Ji Hwan Park, Seokwoo Choi, Young Jun Park, Chang Kwon Lee, Chunseok Jeong, Jae-seung Lee, Sang Hun Lee, Woo Sung We, Jong Chan Yun, Doobock Lee, Junghyun Shin, Seungchan Kim, Junghwan Lee, Jiho Choi, Yucheon Ju, Myeong-Jae Park, Kang Seol Lee, Youngdo Hur, Daeyong Shim, Sangkwon Lee, Junhyun Chun, Kyo-Won Jin, "22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST," 2020 IEEE International Solid-State Circuits Conference - (ISSCC), San Francisco, CA, USA, pp. 334-336, (2020).
[6] Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Kangseol Lee, Sangmook Oh, Joungho Kim, "Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 9, pp. 1835-1846, Sept. 2019.
[5] Jin Hee Cho, Jihwan Kim, Woo Young Lee, Dong Uk Lee, Tae Kyun Kim, Heat Bit Park, Chunseok Jeong, Myeong-Jae Park, Seung Geun Baek, Seokwoo Choi, Byung Kuk Yoon, Young Jae Choi, Kyo Yun Lee, Daeyong Shim, Jonghoon Oh, Jinkook Kim, Seok-Hee Lee, "A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control," 2018 IEEE International Solid-State Circuits Conference - (ISSCC), San Francisco, CA, USA, pp. 208-210, (2018).
[4] H. Lee, D. Shim, J. Rhee, M. Kim and S. Kim, "A Sub-1.0-V On-Chip CMOS Thermometer With a Folded Temperature Sensor for Low-Power Mobile DRAM," in IEEE Transactions on Circuits and Systems II: Express Briefs, vol. 63, no. 6, pp. 553-557, June 2016.
[3] Daeyong Shim, Hyunsik Jeong, Hyunjoong Lee, Jooyeol Rhee, Deog-Kyoon Jeong, Suhwan Kim, "A Process-Variation-Tolerant onChip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM," IEEE Journal of Solid-State Circuits, vol. 48, no. 10, pp. 2550-2557, Oct. 2013.
[2] Woo-Yeol Shin, Gi-Moon Hong, Hyongmin Lee, Jae-Duk Han, Kyu-Sang Park, Dong-Hyuk Lim, Sunkwon Kim, Daeyong Shim, Jung-Hoon Chun, Deog-Kyoon Jeong, Suhwan Kim, "A 4-Slot, 8-Drop Impedance-Matched Bidirectional Multi-Drop DQ Bus with a 4.8-Gb/s Memory Controller Transceiver," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 5, pp. 858-869, May 2013.
[1] G.-M. Hong, W.-Y. Shin, D. Shim, J.-H. Park, M.-O. Kim, and S. Kim, "High-Speed Phase Rotator using Resistive Interpolation for a 3.75-6.9Gb/s Serial-Link Receiver," IEEE Electronics Letters, vol.48, no.8, pp.429-430, April 2012.