附錄 III (Annex III) 電子電氣設備
ANNEX III 中文
Applications exempted from the restriction in Article 4(1)
Exemption
Scope and dates of applicability
1 Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
1(a) For general lighting purposes < 30 W: 5 mg
Expires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011 until 31 December 2012; 2,5 mg shall be used per burner after 31 December 2012
1(b) For general lighting purposes ≥ 30 W and < 50 W: 5 mg
Expires on 31 December 2011; 3,5 mg may be used per burner after 31 December 2011
1(c) For general lighting purposes ≥ 50 W and < 150 W: 5 mg
1(d) For general lighting purposes ≥ 150 W: 15 mg
1(e) For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm
No limitation of use until 31 December 2011; 7 mg may be used per burner after 31 December 2011
1(f) For special purposes: 5 mg
2(a) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):
2(a)(1) Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (e.g. T2): 5 mg
Expires on 31 December 2011; 4 mg may be used per lamp after 31 December 2011
2(a)(2) Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg
Expires on 31 December 2011; 3 mg may be used per lamp after 31 December 2011
2(a)(3) Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mg
Expires on 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011
2(a)(4) Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mg
Expires on 31 December 2012; 3,5 mg may be used per lamp after 31 December 2012
2(a)(5) Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg
Expires on 31 December 2011; 5 mg may be used per lamp after 31 December 2011
2(b) Mercury in other fluorescent lamps not exceeding (per lamp):
2(b)(1) Linear halophosphate lamps with tube > 28 mm (e.g. T10 and T12): 10 mg
Expires on 13 April 2012
2(b)(2) Non-linear halophosphate lamps (all diameters): 15 mg
Expires on 13 April 2016
2(b)(3) Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9)
No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
2(b)(4) Lamps for other general lighting and special purposes (e.g. induction lamps)
No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
3 Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
3(a) Short length (≤ 500 mm)
No limitation of use until 31 December 2011; 3,5 mg may be used per lamp after 31 December 2011
3(b) Medium length (> 500 mm and ≤ 1 500 mm)
No limitation of use until 31 December 2011; 5 mg may be used per lamp after 31 December 2011
3(c) Long length (> 1 500 mm)
No limitation of use until 31 December 2011; 13 mg may be used per lamp after 31 December 2011
4(a) Mercury in other low pressure discharge lamps (per lamp)
No limitation of use until 31 December 2011; 15 mg may be used per lamp after 31 December 2011
4(b) Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60:
4(b)-I P ≤ 155 W
No limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011
4(b)-II 155 W < P ≤ 405 W
No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(b)-III P > 405 W
No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(c) Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):
4(c)-I P ≤ 155 W
No limitation of use until 31 December 2011; 25 mg may be used per burner after 31 December 2011
4(c)-II 155 W < P ≤ 405 W
No limitation of use until 31 December 2011; 30 mg may be used per burner after 31 December 2011
4(c)-III P > 405 W
No limitation of use until 31 December 2011; 40 mg may be used per burner after 31 December 2011
4(d) Mercury in High Pressure Mercury (vapour) lamps (HPMV)
Expires on 13 April 2015
4(e) Mercury in metal halide lamps (MH)
4(f) Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex
5(a) Lead in glass of cathode ray tubes
5(b) Lead in glass of fluorescent tubes not exceeding 0,2 % by weight
6(a) Lead as an alloying element in steel for machining purposes and in galvanised steel containing up to 0,35 % lead by weight
鉛和鉛化合物 - Annex III 6(a) 加工用鋼和鍍鋅鋼中作為合金元素的鉛,按重量計鉛含量小於 0.35%。適用於第 8 類和第 9 類 (除體外診斷醫療器械和工業監控儀器以外)
鉛和鉛化合物 - Annex III 6(a)-I 機械加工用鋼中作為合金元素的鉛,按重量計鉛含量小於 0.35%,以及批量熱處理鍍鋅鋼組件中的鉛含量不超過 0.2% 。適用於類別 1-7 和 10 PS.豁免延期申請
6(b) Lead as an alloying element in aluminium containing up to 0,4 % lead by weight
鉛和鉛化合物 - Annex III 6(b) 作為鋁中的合金元素的鉛,按重量計鉛含量小於 0.4%。
鉛和鉛化合物 - Annex III 6(b)-I 鋁中作為合金元素的鉛,按重量計鉛含量小於 0.4%,前提是它來自含鉛鋁廢料回收。適用於類別 1-7 和 10 PS.2020/07/01以後失效
鉛和鉛化合物 - 6(b)-II 鋁中作為合金元素的鉛,用於機械加工,按重量計鉛含量小於 0.4%。適用於類別 1-7 和 10 於 2021/5/18 到期 PS.2020/07/01以後失效
6(c) Copper alloy containing up to 4 % lead by weight
鉛和鉛化合物 - Annex III 6(c) 銅合金中的鉛,按重量計鉛含量小於 4%。 豁免延期申請
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
鉛和鉛化合物 - Annex III 7(a) 高熔化溫度型焊料中的鉛 (如鉛含量超過 85%的鉛基合金焊料)。
適用於第 1-7 類和第 10 類 (Annex III 第 24 項豁免條款中的應用除外)
7(b) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
鉛和鉛化合物 - Annex III 7(c)-I 電子電氣元件中玻璃或陶瓷材料 (電容中陶瓷介質除外)所含的鉛,如壓電設備或玻璃/陶瓷複合元件。適用於類別 1-7 和 10 (Annex III 第 34 項豁免條款中的應用除外) (作用是密封, 釉帶入鉛高溫燒製)
7(c)-II Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
Expires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013
8(a) Cadmium and its compounds in one shot pellet type thermal cut-offs (融斷保險絲)
Expires on 1 January 2012 and after that date may be used in spare parts for EEE placed on the market before 1 January 2012
8(b) Cadmium and its compounds in electrical contacts
9 Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution
9(b) Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications
11(a) Lead used in C-press compliant pin connector systems
May be used in spare parts for EEE placed on the market before 24 September 2010
11(b) Lead used in other than C-press compliant pin connector systems
Expires on 1 January 2013 and after that date may be used in spare parts for EEE placed on the market before 1 January 2013
12 Lead as a coating material for the thermal conduction module C-ring
May be used in spare parts for EEE placed on the market before 24 September 2010
13(a) Lead in white glasses used for optical applications
13(b) Cadmium and lead in filter glasses and glasses used for reflectance standards
14 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight
Expired on 1 January 2011 and after that date may be used in spare parts for EEE placed on the market before 1 January 2011
15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
16 Lead in linear incandescent lamps with silicate coated tubes
Expires on 1 September 2013
17 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications
18(a) Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
Expired on 1 January 2011
18(b) Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb)
19 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
Expires on 1 June 2011
20 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
Expires on 1 June 2011
21 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses
23 Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less
May be used in spare parts for EEE placed on the market before 24 September 2010
24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
25 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring
26 Lead oxide in the glass envelope of black light blue lamps
Expires on 1 June 2011
27 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
Expired on 24 September 2010
29 Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC (1)
30 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more
31 Lead in soldering materials in mercury free flat fluorescent lamps (which, e.g. are used for liquid crystal displays, design or industrial lighting)
32 Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
33 Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers
34 Lead in cermet-based trimmer potentiometer elements
36 Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
Expired on 1 July 2010
37 Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
38 Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide
39 Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems
Expires on 1 July 2014