Book Chapters and Non Peer-Reviewed Journals (*As corresponding author)

1. M.-H. Li*, “Acoustic resonators with a commercial ring,” Nat. Electron., vol. 5, no. 9, pp. 545-546, Sep. 2022. Link (Invited, News & Views)

2. W. Fang, S.-S. Li, Y. Chiu, and M.-H. Li, “MEMS Using CMOS Wafer,” in M. Esashi (ed.) 3D and Circuit Integration of MEMS. Weinheim: Wiley-VCH, pp. 131-207, 2021. ISBN: 978-3527346479

Preprints (*As corresponding author)

1. T.-H. Hsu, J. Campbell, J. Kramer, S. Cho, M.-H. Li*, and R. Lu, “C-Band lithium niobate on silicon carbide surface acoustic wave resonator with figure-of-merit of 124 at 6.5 GHz“, arxiv, 2024. Link

Journal Papers (*As corresponding author)

1. Z.-Q. Lee, T.-H. Hsu, Y.-C. Yu, Y.-C. Liao, C.-C. Lin, S. Cho, R. Lu, and M.-H. Li*, “Spectrum-clean dispersion-engineered YX-LN/SiO2/Si wideband SH-SAW resonators with crossed interdigital transducers,” IEEE Trans. Electron Devices, Accepted. Link

2. T.-H. Hsu, Z.-Q. Lee, C.-H. Tsai, C.-C. Lin, Y.-C. Yu, and M.-H. Li*, “Harnessing acoustic dispersions in YX-LN/SiO2/Si SH-SAW resonators for electromechanical coupling optimization and Rayleigh mode suppression,” IEEE Trans. Ultrason. Ferroelect. Freq. Contr., vol. 70, no. 12, pp. 1786-1793, Dec. 2023. Link

3. Y.-M. Huang, C.-Y. Chang, T.-H. Hsu, Y. Ho, Y.-H. Chen, Y. Pradeep, R. Chand, S.-S. Li, W. Fang, and M.-H. Li*, “S-band micromechanical resonant impedance transformers based on aluminum nitride FBARs,” IEEE Trans. Microw. Theory Techn., vol. 71, no. 10, pp. 4193-4205, Oct. 2023. Link

4. H.-Y. Chen, P.-I Shih, W. Reza Ali, M.-H. Li, and S.-S. Li, “Platform development for CMOS-MEMS multi-gap capacitive transducers,” J. Microelectromech. Syst., vol. 32, no. 5, pp. 461-473, Oct. 2023. Link

5. M.-L. Tsai, R.-Q. Qiu, K.-Y. Wu, T.-H. Hsu, M.-H. Li, and C.-Y. Lo, “Machine-learning based characteristic estimation method in printed circuit board production lines,” Flex. Print. Electron., vol. 8, no. 3, pp. 034001, Sep. 2023. Link

6. T.-H. Hsu, C.-H. Tsai, S.-S. Tung, and M.-H. Li*, “Miniature LiNbO3/SiO2/Si SH-SAW resonators with near-spurious-free response,“ IEEE Electron Device Lett., vol. 44, no. 7, pp. 1200-1203, Jul. 2023. Link

7. T.-H. Hsu, S.-S. Tung, Y.-M. Huang, G.-L. Wu, C.-Y. Chang, Y. Ho, Y.-H. Chen, Y. Pradeep, R. Chand, and M.-H. Li*, “An 8-inch commercial aluminum nitride MEMS platform for the co-existence of Lamb wave and film bulk acoustic wave resonators,” J. Micromech. Microeng., vol. 33, no. 5, pp. 054001, May 2023. Link

8. Y.-H. Chen, Y.-M. Huang, P.-K. Tsai, M.-H. Li, J.-S. Chen, and Y.-B. Chen, “Fluid-coupled Lamb waves for self-assembling three-dimensional photonic crystals,” J. Appl. Phys., vol. 132, no. 6, pp. 065301, Aug. 2022. Link (Featured article)

9. M.-H. Li*, “CMOS-MEMS oscillator architecture and phase noise: a mini-review,” Front. Mech. Eng., vol. 8, pp. 882344, May 2022. Link (Invited)

10. H.-Y. Chen, S.-S. Li, and M.-H. Li*, “A low impedance CMOS-MEMS capacitive resonator based on metal-insulator-metal (MIM) capacitor structure,” IEEE Electron Device Lett., vol. 42, no. 7, pp. 1045-1048, May. 2021. Link

11. T.-H. Hsu, K.-J. Tseng, and M.-H. Li*, “Thin-film lithium niobate-on-insulator (LNOI) shear horizontal surface acoustic wave resonators,” J. Micromech. Microeng., vol. 31, no. 5, pp. 054003, Apr. 2021. (Special issue collection of JMM Emerging Leaders 2021; Highlights of 2021) Link

12. T.-H. Hsu, K.-J. Tseng, and M.-H. Li*, “Large coupling acoustic wave resonators based on LiNbO3/SiO2/Si functional substrate,” IEEE Electron Device Lett., vol. 41, no. 12, pp. 1825-1828, Dec. 2020. Link

13. A. E. Hassanien, M. Breen, M.-H. Li, and S. Gong, “Acoustically driven electromagnetic radiating elements,” Sci. Rep., vol. 10, 17006, Oct. 2020. Link

14. K.-J. Tseng and M.-H. Li*, “Low loss acoustic delay lines based on solidly mounted lithium niobate thin film,” J. Microelectromech. Syst.,  vol. 29, no. 4, pp. 449-451, Aug. 2020. Link

15. R. Lu, Y. Yang, M.-H. Li, and S. Gong, "GHz low-loss acoustic RF couplers in lithium niobate thin film," IEEE Trans. Ultrason. Ferroelect. Freq. Contr., vol. 67, no. 7, pp. 1448-1461, Jul. 2020. Link

16. M.-H. Li*, R. Lu, T. Manzaneque, and S. Gong, “Low phase noise RF oscillators based on thin-film lithium niobate acoustic delay lines,” J. Microelectromech. Syst., vol. 29, no. 2, pp. 129-131, Apr. 2020. Link

17. R. Lu, Y. Yang, M.-H. Li, T. Manzaneque, and S. Gong, “GHz broadband SH0 mode lithium niobate acoustic delay lines,” IEEE Trans. Ultrason. Ferroelect. Freq. Contr., vol. 67, no. 2, pp. 402-412, Feb. 2020.  Link

18. R. Lu, Y. Yang, M.-H. Li, M. Breen, and S. Gong, “5-GHz antisymmetric mode acoustic delay lines in lithium niobate thin film,” IEEE Trans. Microw. Theory Techn., vol. 68, no. 2, pp. 573-589, Feb. 2020.  Link

19. A. E. Hassanien, M. Breen, M.-H. Li, and S. Gong, “A theoretical study of acoustically driven antennas,” J. Appl. Phys, no. 127, pp. 014903, Jan. 2020. Link

20. M.-H. Li, W.-C. Chiu, C.-Y. Chou, G. Pillai, and S.-S. Li, “Conceptual design of a resonant Pirani gauge towards wide-range pressure sensing,” IEEE Sens. Lett., vol. 3, no. 11, pp. 2501804, Nov. 2019.  Link 

21. M.-H. Li*, C.-Y. Chen, R. Lu, Y. Yang, T. Wu, and S. Gong, “Temperature stability analysis of thin-film lithium niobate SH0 plate wave resonators,” J. Microelectromech. Syst., vol. 28, no. 5, pp. 799-809, Oct. 2019. Link 

22. C.-Y. Chen, M.-H. Li, A. A. Zope, and S.-S. Li, “A CMOS-integrated MEMS platform for frequency stable resonators - Part I: Fabrication, implementation and characterization,” J. Microelectromech. Syst., vol. 28, no. 5, pp. 744-754, Oct. 2019. Link 

23. C.-Y. Chen, M.-H. Li, C.-S. Li, and S.-S. Li, “A CMOS-integrated MEMS platform for frequency stable resonators - Part II: Design and analysis,”J. Microelectromech. Syst., vol. 28, no. 5, pp. 755-765, Oct. 2019. Link 

24. R. Lu, T. Manzaneque, Y. Yang, M.-H. Li, and S. Gong, “GHz low-loss and wide-band S0 mode lithium niobate acoustic delay lines,” IEEE Trans. Ultrason. Ferroelect. Freq. Contr.,  vol. 66, no. 8, pp. 1373-1386, Aug. 2019. Link 

25. R. Lu, M.-H. Li, Y. Yang, T. Manzaneque, and S. Gong, “Accurate extraction of large electromechanical coupling in piezoelectric MEMS resonators,” J. Microelectromech. Syst., vol. 28, no. 2, pp. 209-218, Apr. 2019. Link

Conference Proceedings (*As corresponding author)

1. T.-H. Hsu, J. Campbell, J. Kramer, S. Cho, Z.-Q. Lee, M.-H. Li, and R. Lu, “Thin-film lithium niobate on insulator surface acoustic wave devices for 6G centimeter bands,” in Proc., IEEE MTT-S Int. Conf. Microwave Acoustics & Mechanics (ICMAM'24), 2024.

2. T.-H. Hsu, Z.-Q. Lee, C.-H. Tsai, V. Chulukhadze, C.-C. Lin, Y.-C. Yu, R. Lu, and M.-H. Li*, “A dispersion-engineered YX-LN/SiO2/Sapphire SH-SAW resonator for enhanced electromechanical coupling and Rayleigh mode suppression,” in Proc., the 37th IEEE Micro Electro Mechanical Systems (MEMS’24), Austin, TX, USA, Jan. 21-25, 2024, pp. 27-30. (Outstanding Student Oral Paper Award Finalist)

3. C.-C. Lin, T.-H. Hsu, Z.-Q. Lee, C.-H. Tsai, Y.-C. Yu, S.-S. Tung, and M.-H. Li*, “A thin-film lithium niobate on insulator multimode SH-SAW resonator exploiting grating waveguide structure,” in Proc., the 37th IEEE Micro Electro Mechanical Systems (MEMS’24), Austin, TX, USA, Jan. 21-25, 2024, pp. 40-43.

4. Z.-Q. Lee, T.-H. Hsu, C.-H. Tsai, C.-C. Lin, Y.-C. Yu, S.-S. Tung, and M.-H. Li*, “L-band LiNbO3/SiO2/Sapphire longitudinal leaky SAW (LLSAW) resonators with high figure of merit,” in Proc., the 37th IEEE Micro Electro Mechanical Systems (MEMS’24), Austin, TX, USA, Jan. 21-25, 2024, pp. 1095-1098. (Outstanding Student Poster Paper Award Finalist)

5. P.-C. Chen, Y.-C. Lin, H.-Y. Chen, S.-S. Li, and M.-H. Li*, “A bipolar-biased differential CMOS-MEMS CMUT,” in Proc., the 37th IEEE Micro Electro Mechanical Systems (MEMS’24), Austin, TX, USA, Jan. 21-25, 2024, 951-954. 

6. T.-H. Hsu, S.-S. Tung, C.-H. Tsai, G.-L. Wu, and M.-H. Li*, “GHz miniaturized impedance transformer based on a near-spurious-free lithium niobate-on-insulator SAW resonator,” in Proc., IEEE Int. Ultrason. Symp. (IUS'23), Montreal, Canada, Sept. 3-8, 2023, pp. 1-4. 

7. C.-H. Tsai, T.-H. Hsu, Z.-Q. Lee, C.-C. Lin, Y.-C. Yu, S.-S. Tung, and M.-H. Li*, “Low propagation loss acoustic delay lines based on YX-LiNbO3/SiO2/Sapphire,” in Proc., IEEE Int. Ultrason. Symp. (IUS'23), Montreal, Canada, Sept. 3-8, 2023, pp. 1-4. 

8. K.-T. Chen, T.-H. Hsu, G.-L. Wu, and M.-H. Li*, “Reduced order modeling of piezoelectric resonators with multi-frequency impedance estimation,” in Proc., 22nd Int. Conf. on Solid-State Sensors & Actuators (Transducers’23), Kyoto, Japan, June 25-29, 2023, pp. 585-588.

9. Z.-Q. Lee, J.-S. Jiang, H.-Y. Chen, S.-S. Li, and M.-H. Li*, “An intrinsically temperature-compensated fully differential CMOS-MEMS resonator with dual-resistor piezoresistive detection,” in Proc., 22nd Int. Conf. on Solid-State Sensors & Actuators (Transducers’23), Kyoto, Japan, June 25-29, 2023, pp. 577-580. (Outstanding Young Researcher Paper Competition Finalist)

10. H.-Y. Chen, Y.-S. Chan, T.-H. Hsu,  M.-H. Li, and S.-S. Li “A single-chip CMOS-MEMS CMUT array transceiver with low bias,” in Proc., 22nd Int. Conf. on Solid-State Sensors & Actuators (Transducers’23), Kyoto, Japan, June 25-29, 2023, pp. 136-139. (Outstanding Young Researcher Paper Competition Winner, 1% Selection Rate)

11. V. Sandeep Nagaraja, S. Khan, B. McCarthy, D. O'connell, M. Nasser, M.-H. Li, and D. Psychogiou, “AlScN-based SAW resonator with improved RF performance using high resistivity silicon substrate,” in Proc., 2023 Joint Conf. of IEEE Int. Freq. Contr. Symp. - Eur. Freq. Time Forum (IFCS-EFTF’23), Toyama, Japan, May 15-19, 2023, pp. 1-4.

12. S.-S. Tung, T.-H. Hsu, Y. Ho, Y.-H. Chen, Y. Pradeep, R. Chand, and M.-H. Li*, “Suppression of spurious modes in aluminum nitride S1 lamb wave resonators using a mechanical soft-contact scheme,” in Proc., 36th IEEE Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jan. 15-19, 2023, pp. 1198-1201. (Best Student Poster Paper Award Finalist)

13. C.-C. Yeh, C.-H. Tsai, G.-L. Wu, T.-H. Hsu, and M.-H. Li*, “Sub-3 dB insertion loss broadband acoustic delay lines and high FOM resonators in LiNbO3/SiO2/Si functional substrate,” in Proc., 36th IEEE Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jan. 15-19, 2023, pp. 1194-1197.

14. H.-Y. Chen, M.-H. Li, and S.-S. Li, “A new finding on nonlinear damping and stiffness of flexural mode capacitive MEMS resonators,” in Proc., the 36th IEEE Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jan. 15-19, 2023, pp. 526-529.

15. W. Fang, S.-S. Li, and M.-H. Li, “Leveraging semiconductor ecosystems to MEMS,” in Proc., the 36th IEEE Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jan. 15-19, 2023, pp. 143-148.

16. Y.-M. Huang, C.-Y. Chang, T.-H. Hsu, Y. Ho, Y.-H. Chen, Y. Pradeep, R. Chand, S.-S. Li, W. Fang, and M.-H. Li*, “S-band high passive gain resonant transformers based on aluminum nitride FBAR resonators,”  in Proc., IEEE MTT-S Int. Microw. Symp. (IMS'22), Denver, CO, June 19-24, 2022, pp. 891-894.

17. T.-H. Hsu, G.-L. Wu, Y.-M. Huang, Y. Ho, Y.-H. Chen, Y. Pradeep, R. Chand, and M.-H. Li*, “On the geometry design of AlN Lamb wave resonators with predefined shallow release cavities,” in Proc., 2022 Solid-State Sensor, Actuator, and Microsystems Workshop (Hilton Head'22), Hilton Head, South Carolina, June 5-9, 2022.

18. C.-Y. Chang, Y.-M. Huang, T.-H. Hsu, Y.-H. Chen, R. Chand, Y. Pradeep, Y. Ho,  M.-H. Li, W. Fang, and S.-S. Li, “On the spurious modes in FBAR resonators with quasi-free edges,” in Proc., 2022 Joint Conf. of Eur. Freq. Time Forum - IEEE Int. Freq. Contr. Symp. (EFTF-IFCS’22), Paris, France, Apr. 24-28, 2022, pp. 1-3.

19. H.-Y. Chen, P.-I. Shih, M.-H. Li, and S.-S. Li, “5V-bias CMOS-MEMS capacitive resonator with Rm < 5KΩ based on metal-insulator-metal (MIM) capacitor,” in Proc., 35th IEEE Micro Electro Mechanical Systems (MEMS’22), Tokyo, Japan, Jan. 9-13, 2022, pp. 1042-1045.

20. T.-H. Hsu, K.-J. Tseng, and M.-H. Li*, “Wideband and high quality factor shear horizontal SAW resonators with improved temperature stability in LNOI platform,” in Proc., 2021 Joint Conf. of Eur. Freq. Time Forum - IEEE Int. Freq. Contr. Symp. (EFTF-IFCS’21), Virtual Conference, Jul. 7-17, 2021, pp. 1-4.

21. C.-Y. Chou, P.-C. Chen, H.-T. Wu, T.-H. Hsu, and M.-H. Li*, “Piston-shaped CMOS-MEMS CMUT front-end featuring force-displacement transduction enhancement,” in Proc., 21st Int. Conf. on Solid-State Sensors & Actuators (Transducers’21), Virtual Conference, June 20-25, 2021, pp. 26-29. 

22. T.-H. Hsu, F.-C. Su, K.-J. Tseng, and M.-H. Li*, “Low loss and wideband surface acoustic wave devices in thin film lithium niobate on insulator (LNOI) platform,” in Proc., 34th IEEE Micro Electro Mechanical Systems (MEMS’21), Virtual Conference, Jan. 25-29, 2021, pp. 474-477.

23. K. Bhosale, C.-Y. Chen, M.-H. Li, and S.-S. Li, “Standard CMOS integrated ultra-compact micromechanical oscillating active pixel arrays,” in Proc., 34th IEEE Micro Electro Mechanical Systems (MEMS’21), Virtual Conference, Jan. 25-29, 2021, pp. 157-160.

24. T.-H. Hsu, A. Zope, M.-H. Li*, and S.-S. Li, “A compact monolithic CMUT receiver front-end in a TiN-C CMOS-MEMS platform,” in Proc., IEEE Int. Ultrason. Symp. (IUS'20), Virtual Conference, Sept. 6-11, 2020.

25. K.-J. Tseng and M.-H. Li*, “Frequency and coupling factor scaling of shear horizontal SAW resonators in LNOI platform,” in Proc., IEEE Int. Freq. Contr. Symp. and Int. Symp. Appl. Ferro. (IFCS-ISAF'20), Virtual Conference, Jul. 19-23, 2020.

26. T.-H. Hsu, A. Zope, M.-H. Li*, and S.-S. Li, “A sub-mW/pixel zero-bias CMUT-in-CMOS receiver front-End with TiN electrode,” in Proc., IEEE Int. Freq. Contr. Symp. and Int. Symp. Appl. Ferro. (IFCS-ISAF'20), Virtual Conference, Jul. 19-23, 2020. (Best Student Paper Award Winner, 3% Selection Rate)

27. K.-J. Tseng, M.-H. Li, and S.-S. Li, “A monolithic tri-axis MEMS gyroscope operating in air,” in Proc., 7th IEEE Int. Symp. Inertial Sensors and Systems (INERTIAL), Hiroshima, Japan, Mar. 23-26, 2020, pp. 1-3.

28. M.-H. Li*, R. Lu, T. Manzaneque, and S. Gong, “Thin-film lithium niobate acoustic delay line oscillators,” in Proc., 33rd IEEE Micro Electro Mechanical Systems (MEMS’20), Vancouver, Canada, Jan. 18-22, 2020, pp. 1285-1288. 

29. R. Lu, Y. Yang, M.-H. Li, M. Breen, and S. Gong, “8.5 GHz and 11.5 GHz acoustic delay lines using higher-order Lamb modes in lithium niobate thin film,” in Proc., 33rd IEEE Micro Electro Mechanical Systems (MEMS’20), Vancouver, Canada, Jan. 18-22, 2020, pp. 1242-1245. 

30. R. Lu, Y. Yang, M. Breen, M.-H. Li, and S. Gong, “5 GHz acoustic delay lines using antisymmetric mode in lithium niobate thin film”, in Proc., IEEE Int. Ultrason. Symp., Oct. 2019, pp. 265-268.

31. C.-Y. Chen, A. A. Zope, M.-H. Li, and S.-S. Li, "A generic TiN-C process for CMOS FEOL/BEOL-embedded vertically-coupled capacitive and piezoresistive resonators,” in Proc., 20th Int. Conf. on Solid-State Sensors & Actuators (Transducers’19), Berlin, Germany, June 23-27, 2019, pp. 531-534. 

32. C.-Y. Chen, M.-H. Li, A. Gao, R. Lu, S.-S. Li, and S. Gong, “Q-enhanced lithium niobate SH0 resonators with optimized acoustic boundaries,” in Proc., IEEE Int. Freq. Contr. Symp. (IFCS’19), Apr. 2019, pp. 1-4.

33. M.-H. Li*, C.-Y. Chen, R. Lu, Y. Yang, T. Wu, and S. Gong, “Power-efficient ovenized lithium niobate SH0 resonator arrays with passive temperature compensation,” in Proc., 32nd IEEE Micro Electro Mechanical Systems (MEMS’19), Seoul, Korea, Jan. 27-31, 2019, pp. 911-914.

34. A. Emad, R. Lu, M.-H. Li, Y. Yang, T. Wu, and S. Gong, “Resonant torsional micro-actuators using thin-film lithium niobate,” in Proc., 32nd IEEE Micro Electro Mechanical Systems (MEMS’19), Seoul, Korea, Jan. 27-31, 2019, pp. 282-285.

35. R. Lu, T. Manzaneque, Y. Yang, M.-H. Li, and S. Gong, “Towards digitally addressable delay synthesis: GHz low-loss acoustic delay elements from 20 ns to 900 ns,” in Proc., 32nd IEEE Micro Electro Mechanical Systems (MEMS’19), Seoul, Korea, Jan. 27-31, 2019, pp. 121-124.

36. C.-A. Sung, T.-Y. Liu, A. A. Zope, M.-H. Li, and S.-S. Li, “Interface circuit design to enable miniaturization of thermal-piezoresistive oscillators for mass sensing applications,” in Proc., 32nd IEEE Micro Electro Mechanical Systems (MEMS’19), Seoul, Korea, Jan. 27-31, 2019, pp. 899-902.

37. J.-R. Guo, A. A. Zope, C.-Y. Chen, M.-H. Li, M.-F. Lai, and S.-S. Li, “A fully-differential CMOS-MEMS DETF resonator design with extended mass and electrodes to enable high power handling,” in Proc., 32nd IEEE Micro Electro Mechanical Systems (MEMS’19), Seoul, Korea, Jan. 27-31, 2019, pp. 903-906. 

Patent disclosure

1. A. E. Hassanien, M. Breen, M.-H. Li, and S. Gong, “Acoustically-Driven Electromagnetic Antennas Using Piezoelectric Material,” under US Patent application, Application Serial No. 17/249,672, 2021.

2. S.-S. Li and M.-H. Li, “Active type temperature compensation resonator structure,” US Patent Number US9899987B2, Feb. 2018.

3. S.-S. Li, C.-Y. Chen, and M.-H. Li, “CMOS-MEMS resonant transducer and method for fabricating the same,” TW Patent Number TWI562224B, Dec. 2016.

4. S.-S. Li and M.-H. Li, “Active type temperature compensation resonator structure,” TW Patent Number TWI538395B, Jun. 2016.

Domestic conference presentations (No proceedings)

1. C.-Y. Chou, P.-C. Chen, H.-T. Wu, T.-H. Hsu, and M.-H. Li*, “Piston-shaped CMOS-MEMS CMUT front-end featuring force-displacement transduction enhancement,” in ICSS 2021 International Conference on Smart Sensors (暨科技部工程司研究成果發表會 暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), Virtual Conference, Oct. 14-15, 2021. (Distinguished Oral Paper Award)

2. T.-H. Hsu, F.-C. Su, and M.-H. Li*, “Intrinsic temperature compensation of shear-horizontal SAW resonators in lithium niobate on insulator (LNOI) platform,” in ICSS 2021 International Conference on Smart Sensors (暨科技部工程司研究成果發表會 暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), Virtual Conference, Oct. 14-15, 2021. (Distinguished Oral Paper Award)

3. T.-H. Hsu, F.-C. Su, K.-J. Tseng, and M.-H. Li*, “UHF shear-horizontal SAW resonators in lithium niobate on insulator (LNOI) platform with large electromechanical coupling over 15%,” in 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020. (Distinguished Oral Paper Award)

4. F.-C. Su, T.-H. Hsu, K.-J. Tseng, and M.-H. Li*, “Low-loss and wideband acoustic delay lines based on solidly mounted lithium niobate thin film and shear-horizontal surface waves,” in ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020.

• Prior to 2019

Journal Papers

1. M.-H. Li, C.-Y. Chen, and S.-S. Li, “A study on the design parameters for MEMS oscillators incorporating nonlinearities,” IEEE Trans. Circuits Syst. I Reg. Papers, vol. 65, no. 10, pp. 3424-3434, Oct. 2018.

2. C.-Y. Chen, M.-H. Li, and S.-S. Li, “CMOS-MEMS resonators and oscillators: a review,” MEMS, Sensors and Materials, vol. 30, no. 4, pp. 733-756, Apr. 2018.

3. M.-H. Li, C.-Y. Chen, C.-Y. Liu, and S.-S. Li, “A sub-150μW BEOL-embedded CMOS-MEMS oscillator with a 138dBΩ ultra-low-noise TIA,” IEEE Electron Device Lett., vol. 37, no. 5, pp. 648-651, May 2016.

4. C.-Y. Chen, M.-H. Li, C.-H. Chin, and S.-S. Li, “Implementation of a CMOS-MEMS filter through a mixed electrical and mechanical coupling scheme,” J. Microelectromech. Syst., vol. 25, no. 2, pp. 262-274, Apr. 2016.

5. C.-H. Chin, M.-H. Li, C.-Y. Chen, Y.-L. Wang, and S.-S. Li, “A CMOS-MEMS arrayed resonant-gate field effect transistor (RGFET) oscillator,” J. Micromech. Microeng., vol. 25, no. 11, pp. 115025, 2015. 

6. M.-H. Li, C.-Y. Chen, W.-C. Chen, and S.-S. Li, “A vertically coupled MEMS resonator pair for oscillator applications,” J. Microelectromech. Syst., vol. 24, no. 3, pp. 528-530, Jun. 2015.

7. M.-H. Li, C.-Y. Chen, C.-S. Li, C.-H. Chin, and S.-S. Li, “Design and characterization of a dual-mode CMOS-MEMS resonator for TCF manipulation,” J. Microelectromech. Syst., vol. 24, no. 2, pp. 446-457, Apr. 2015.

8. M.-H. Li, C.-Y. Chen, C.-S. Li, C.-H. Chin, and S.-S. Li, “A monolithic CMOS-MEMS oscillator based on an ultra-low-power ovenized micromechanical resonator,” J. Microelectromech. Syst., vol. 24, no. 2, pp. 360-372, Apr. 2015. 

9. C.-S. Li, M.-H. Li, C.-C. Chen, C.-H. Chin, and S.-S. Li, “A low voltage CMOS-Microelectromechanical Systems thermal-piezoresistive resonator with Q > 10,000,” IEEE Electron Device Lett., vol. 36, no. 2, pp. 192-194, Feb. 2015.

10. C.-S. Li, M.-H. Li, and S.-S. Li, “Differentially piezoresistive transduction of high-Q encapsulated SOI-MEMS resonators with sub-100nm gaps,” IEEE Trans. Ultrason. Ferroelect. Freq. Contr., vol. 62, no. 1, pp. 220-229, Jan. 2015.

11. C.-H. Chin, C.-S. Li, M.-H. Li, Y.-L. Wang, and S.-S. Li, “Fabrication and characterization of a charge-biased CMOS-MEMS resonant gate field effect transistor,” J. Micromech. Microeng., vol. 24, no. 9, pp. 095005, 2014. 

12. C.-Y. Chen, M.-H. Li, C.-S. Li, and S.-S. Li, “Design and characterization of mechanically coupled CMOS-MEMS filters for channel-select applications,” Sens. Actuators A: Phys, vol. 216, pp. 394-404, Sep. 2014.

13. C.-S. Li, M.-H. Li, C.-H. Chin, and S.-S. Li, “Differentially piezoresistive sensing for CMOS-MEMS resonators,” J. Microelectromech. Syst., vol. 22, no. 6, pp. 1361-1372, Dec. 2013.

14. Y.-C. Liu, M.-H. Tsai, W.-C. Chen, M.-H. Li, S.-S. Li, and W. Fang, “Temperature-compensated CMOS-MEMS oxide resonators,” J. Microelectromech. Syst., vol. 22, no. 5, pp. 1054-1065, Oct. 2013.

15. V. Pachkawade, M.-H. Li, C.-S. Li, and S.-S. Li, “A CMOS-MEMS resonator integrated system for oscillator application,” IEEE Sens. J., vol. 13, no. 8, pp. 2882-2889, Aug. 2013.

16. M.-H. Li, W.-C. Chen, and S.-S. Li, “Realizing deep-submicron gap spacing for CMOS-MEMS resonators,” IEEE Sens. J., vol. 12, no. 12, pp. 3399-3407, Dec. 2012.

17. Y.-C. Lee, M.-H. Li, W. Hsu, Y.-T. Cheng, and S.-S. Li, “Electroplated Ni-CNT Nanocomposite for Micromechanical Resonator Applications,” IEEE Electron Device Lett., vol. 33, no. 6, pp. 872-874, Jun. 2012.

18. W.-C. Chen, M.-H. Li, Y.-C. Liu, W. Fang, and S.-S. Li, “A fully-differential CMOS-MEMS DETF oxide resonator with Q > 4,800 and positive TCF,” IEEE Electron Device Lett., vol. 33, no. 5, pp. 721-723, May 2012.

19. M.-H. Li, W.-C. Chen, and S.-S. Li, “Mechanically-coupled CMOS-MEMS free-free beam resonator arrays with enhanced power handling capability,” IEEE Trans. Ultrason. Ferroelect. Freq. Contr., vol. 59, no. 3, pp. 346-357, Mar. 2012.

Conference Proceedings

1. K.-J. Tseng, Y.-H. Huang, M.-H. Li, and S.-S. Li, “Design of a 3-axis MEMS gyroscope based on a fully differential operation,” Proc., Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT), Hong Kong, June 24-27, 2018.

2. T.-H. Hsu, C.-Y. Chen, C.-Y. Liu, M.-H. Li, and S.-S. Li, “A 200-nm-gap titanium nitride composite CMOS-MEMS CMUT for biomedical ultrasounds,” Proc., 2018 IEEE Int. Freq. Contr. Symp. (IFCS’18), Olympic Valley, CA, May 21-24, 2018, pp. 468-470. (Best Student Paper Award Finalist)

3. G. Fang, G. Pillai, M.-H. Li, C.-Y. Liu, and S.-S. Li, “A VHF temperature compensated lithium niobate-on-oxide resonator with Q > 3900 for low phase noise oscillators,” Proc., 31st IEEE Int. Micro Electro Mechanical Systems Conf. (MEMS’18), Belfast, Northern Ireland, Jan. 21-25, 2018, pp. 723-726.

4. T.-Y. Liu, C.-C. Chu, M.-H. Li, C.-Y. Liu, C.-Y. Lo, and S.-S. Li, “CMOS-MEMS thermal-piezoresistive oscillators with high transduction efficiency for mass sensing applications,” Tech. Dig., 19th Int. Conf. on Solid-State Sensors & Actuators (Transducers’17), Kaohsiung, Taiwan, June 18-22, 2017, pp. 452-455. 

5. C.-Y. Chou, M.-H. Li, C.-Y. Chen, C.-Y. Liu, and S.-S. Li, “An innovative 3-D mechanically-coupled array design for MEMS resonators and oscillators,” Tech. Dig., 19th Int. Conf. on Solid-State Sensors & Actuators (Transducers’17), Kaohsiung, Taiwan, June 18-22, 2017, pp. 90-93.

6. C.-Y. Chen, M.-H. Li, G. Pillai, J. M.-L. Tsai, and S.-S. Li, “An innovative piezo-MEMS channel-select filter design based on non-monotonic coupled modes,” Proc., 30th IEEE Int. Micro Electro Mechanical Systems Conf. (MEMS’17), Las Vegas, NV, Jan. 22-26, 2017, pp. 950-953.

7. C.-Y. Liu*, M.-H. Li*, Ranjith H.G, and S.-S. Li, “A 1 MHz 4 ppm CMOS-MEMS oscillator with built-in self-test and sub-mW ovenization power,” Proc., IEEE Int. Electron Devices Mtg. (IEDM’16), San Francisco, USA, Dec. 3-7, 2016, pp. 26.7.1-26.7.4. (*Equally Contribution)

8. M.-H. Li, K.-J. Tseng, C.-Y. Liu, C.-Y. Chen, and S.-S. Li, “An 8V 50μW 1.2MHz CMOS-MEMS oscillator,” Proc., 2016 IEEE Int. Freq. Contr. Symp. (IFCS’16), New Orleans, Louisiana, USA, May 9-12, 2016, pp. 1-3.

9. C.-Y. Liu, M.-H. Li, C.-Y. Chen, S.-S. Li, “An ovenized CMOS-MEMS oscillator with isothermal resonator and sub-mW heating power,” Proc., 2016 IEEE Int. Freq. Contr. Symp. (IFCS’16), New Orleans, Louisiana, USA, May 9-12, 2016, pp. 1-3.

10. W.-C. Chiu, M.-H. Li, C. Chou, S.-S. Li, “A ring-down technique implemented in CMOS-MEMS resonator circuits for wide-range pressure sensing applications,” Proc., in 2016 IEEE Int. Freq. Contr. Symp. (IFCS’16), New Orleans, Louisiana, USA, May 9-12, 2016, pp. 1-3.

11. M.-H. Li, C.-Y. Chen, and S.-S. Li, “A reliable CMOS-MEMS platform for titanium nitride composite (TiN-C) resonant transducers with enhanced electrostatic transduction and frequency stability,” Proc., IEEE Int. Electron Devices Mtg. (IEDM’15), Washington DC, USA, Dec. 7-9, 2015, pp. 18.4.1-18.4.4.

12. C.-Y. Chen, C.-H. Chin, M.-H. Li, and S.-S. Li, “Statistical characterization of a CMOS-MEMS resonator for monolithic ovenized oscillator applications,” Tech. Dig., 18th Int. Conf. on Solid-State Sensors & Actuators (Transducers’15), Alaska, USA, June 21-25, 2015, pp. 1965-1968.

13. C.-Y. Chen, M.-H. Li, C.-H. Wang, and S.-S. Li, “Transduction comparison of a resonant transducer realized in a commercially available CMOS-MEMS platform,” Tech. Dig., 18th Int. Conf. on Solid-State Sensors & Actuators (Transducers’15), Alaska, USA, June 21-25, 2015, pp.145-148.

14. J. Ren, C.-Y. Liu, M.-H. Li, C.-C. Chen, C.-Y. Chen, C.-S. Li, and S.-S. Li, “A mode-matching 130-kHz ring-coupled gyroscope with 225 ppm initial driving/sensing mode frequency splitting,” Tech. Dig., 18th Int. Conf. on Solid-State Sensors & Actuators (Transducers’15), Alaska, USA, June 21-25, 2015, pp. 1057-1060.

15. H.-C. Su, M.-H. Li, C.-Y. Chen, and S.-S. Li, “A single-chip oscillator based on a deep-submicron gap CMOS-MEMS resonator array with high-stiffness driving scheme,” Tech. Dig., 18th Int. Conf. on Solid-State Sensors & Actuators (Transducers’15), Alaska, USA, June 21-25, 2015, pp. 133-136.

16. W.-C. Chiu, M.-H. Li, C.-Y. Chen, and S.-S. Li, “Effects of pressure and bias voltage on the phase noise of CMOS-MEMS oscillators,” Proc., 2015 Joint Conf. of the IEEE Int. Freq. Contr. Symp. – Eur. Freq. Time Forum (IFCS-EFTF’15), Colorado, Denver, USA, Apr. 12-16, 2015, pp. 155-157. 

17. M.-H. Li, C.-S. Li, and S.-S. Li, “Exploring the Q-factor limit of temperature compensated CMOS-MEMS resonators,” Proc., 28th IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS’15), Estoril, Portugal, Jan. 18-22, 2015, pp. 853-856.

18. C.-H. Chin, C.-S. Li, M.-H. Li, and S.-S. Li, “A CMOS-MEMS arrayed RGFET oscillator using a band-to-band tunneling bias scheme,” Proc., 28th IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS’15), Estoril, Portugal, Jan. 18-22, 2015, pp. 988-991.

19. M.-H. Li, C.-Y. Chen, C.-H. Chin, C.-S. Li, and S.-S. Li, “Optimizing the close-to-carrier phase noise of monolithic CMOS-MEMS oscillators using bias-dependent nonlinearity,” Tech. Dig., IEEE Int. Electron Devices Mtg. (IEDM’14), San Francisco, USA, Dec. 15-17, 2014, pp. 22.3.1-22.3.4.

20. K.-H. Li, C.-C. Chen, M.-H. Li, and S.-S. Li, “A self-sustained nanomechanical thermal-piezoresistive oscillator with ultra-low power consumption,” Tech. Dig., IEEE Int. Electron Devices Mtg. (IEDM’14), San Francisco, USA, Dec. 15-17, 2014, pp. 22.2.1-22.2.4.

21. M.-H. Li, C.-Y. Chen, and S.-S. Li, “An experimental investigation on the Q-boosted CMOS-MEMS flexural-mode resonator circuits,” Proc., 2014 IEEE Int. Freq. Contr. Symp. (IFCS’14), Taipei, Taiwan, May 19-22, 2014, pp. 327-328.

22. J. Lee*, C.-S. Li*, Z. Wang, M.-H. Li, C.-H. Chin, S.-S. Li, P. X.-L. Feng “High-Frequency Parametric Bulk Mode Resonators in CMOS-MEMS Technology,” Proc., IEEE Int. Freq. Contr. Symp. (IFCS’14), Taipei, Taiwan, May 19-22, 2014, pp. 329-331. (*Equally Contribution)

23. J. Lee*, C.-S. Li*, Z. Wang, M.-H. Li, C.-H. Chin, S.-S. Li, P. X.-L. Feng “Multimode Characteristics of High-Frequency CMOS-MEMS Bulk-Mode Resonators,” Proc., IEEE Int. Freq. Contr. Symp. (IFCS’14), Taipei, Taiwan, May 19-22, 2014, pp. 478-480. (*Equally Contribution)

24. C.-Y. Chen, M.-H. Li, C.-H. Chin, C.-S. Li, and S.-S. Li, “Combined electrical and mechanical coupling for mode-reconfigurable CMOS-MEMS filters,” Proc., 27th IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS’14), San Francisco, USA, Jan. 26-30, 2014, pp. 1249-1252.

25. M.-H. Li, C.-Y. Chen, C.-S. Li, C.-H. Chin, C.-C. Chen, and S.-S. Li, “Foundry-CMOS integrated oscillator circuits based on ultra-low power ovenized CMOS-MEMS resonators,” Tech. Dig., IEEE Int. Electron Devices Mtg. (IEDM’13), Washington DC, USA, Dec. 9-11, 2013, pp. 18.4.1-18.4.4.

26. M.-H. Li, C.-Y. Chen, C.-S. Li, C.-H. Chin, and S.-S. Li, “Enhanced temperature sensitivity of a single CMOS-MEMS resonator via resonant modes in orthogonal axes,” Proc., 2013 Joint UFFC, EFTF and PFM Symposium (UFFC’13), Prague, Czech Republic, July 21-25, 2013, pp.539-542.

27. C.-S. Li, M.-H. Li, C.-H. Chin, C.-Y. Chen, Philip X.-L. Feng, and S.-S. Li, “A piezoresistive CMOS-MEMS resonator with high Q and low TCF,” Proc., 2013 Joint UFFC, EFTF and PFM Symposium (UFFC’13), Prague, Czech Republic, July 21-25, 2013, pp. 425-428.

28. C.-H. Chin, C.-S. Li, M.-H. Li, and S.-S. Li, “A CMOS-MEMS resonant-gate transistor,” Tech. Dig., 17th Int. Conf. on Solid-State Sensors & Actuators (Transducers’13), Barcelona, Spain, June 16-20, 2013, pp. 2284-2287.

29. C.-Y. Chen, M.-H. Li, C.-S. Li, and S.-S. Li, “Design and characterization of mechanically-coupled CMOS-MEMS filters,” Tech. Dig., 17th Int. Conf. on Solid-State Sensors & Actuators (Transducers’13), Barcelona, Spain, June 16-20, 2013, pp. 2288-2291.

30. H. Zhu, C.-H. Chuang, C.-S. Li, M.-H. Li, J. E.-Y. Lee, and S.-S. Li, “The effects of tight capacitive coupling on phase noise performance: A LAMÉ-mode MEMS oscillator study,” Tech. Dig., 17th Int. Conf. on Solid-State Sensors & Actuators (Transducers’13), Barcelona, Spain, June 16-20, 2013, pp. 2304-2307.

31. W.-C. Chen, M.-H. Li, Y.-C. Liu, D. Weinstein, W. Fang, and S.-S. Li, “Fully differential CMOS-MEMS square-plate oxide resonators with embedded poly-silicon electrodes,” Tech. Dig., 17th Int. Conf. on Solid-State Sensors & Actuators (Transducers’13), Barcelona, Spain, June 16-20, 2013, pp. 2292-2295.

32. M.-H. Li, C.-S. Li, C.-H. Chin, C.-Y. Chen and S.-S. Li, “An ultra-low power ovenized CMOS-MEMS resonator monolithically integrated with interface circuits,” Proc., 26th IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS’13), Taipei, Taiwan, Jan. 20-24, 2013, pp. 753-756.

33. M.-H. Li, C.-S. Li, L.-J. Hou, Y.-C. Liu and S.-S. Li, “A 1.57mW 99dBW CMOS transimpedance amplifier for VHF micromechanical reference oscillators,” Proc., 2012 IEEE Int. Symp. Circ. Syst. (ISCAS’12), Seoul, Korea, May 20-23, 2012, pp. 209-212.

34. C.-S. Li, M.-H. Li, and S.-S. Li, “Differential measurement of piezoresistive transduction for silicon-based MEMS resonators,” Proc., 2012 IEEE Int. Freq. Contr. Symp. (IFCS’12), Baltimore, MD, USA, May 21-24, 2012, pp. 1-4.

35. C.-C. Chen, M.-H. Li, W.-C. Chen, H.-T. Yu, and S.-S. Li, “Thermally-actuated and piezoresistively-sensed CMOS-MEMS resonator array using differential-mode operation,” Proc., 2012 IEEE Int. Freq. Contr. Symp. (IFCS’12), Baltimore, MD, May 21-24, 2012, pp. 1-4.

36. M.-H. Li, W.-C. Chen, and S.-S. Li, “CMOS-MEMS transverse-mode square plate resonator with high Q and low motional impedance,” Tech. Dig., 16th Int. Conf. on Solid-State Sensors & Actuators (Transducers'11), Beijing, China, June 5-9, 2011, pp. 1500-1503.

37. M.-H. Li, W.-C. Chen, and S.-S. Li, “Mechanically-coupled CMOS-MEMS free-free beam resonator arrays with two-port configuration,” Proc., 2011 Joint Conf. of the IEEE Int. Freq. Contr. Symp. – Eur. Freq. Time Forum (IFCS-EFTF’11), San Francisco, California, USA, May 1-5, 2011, pp.16-19. (Best Student Paper Award Winner)

38. W.-C. Chen, M.-H. Li, W. Fang, and S.-S. Li, “High-Q integrated CMOS-MEMS resonators with deep-submicron gaps,” Proc., IEEE Int. Freq. Contr. Symp. (IFCS’10), Newport Beach, California, USA, June 1-4, 2010, pp. 340-343.

39. W.-C. Chen, M.-H. Li, W. Fang, and S.-S. Li, “Realizing deep-submicron gap spacing for CMOS-MEMS resonators with frequency tuning capability via modulated boundary conditions,” Proc., 23rd IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS’10), Hong Kong, Jan. 24-28, 2010, pp. 735-738.