Patent

Jaehong Lim, Youngho Hwang, Byungjo Kim, Sangki Nam, Suyoung Yoo, Sanghyun Lim, Youngkyun Im, Hyungkyu Choi, Seok Heo, "Post baking apparatus", US Patent, US20240192604A1 (Published), 2024. 06. 13.

Byungjo Kim, Sangki Nam, Jungmin Ko, Kwonsang Seo, Seungbo Shim, Younghyun Jo, “Upper electrode and substrate processing apparatus including the same”, US Patent, US11,869,751B2 (Published), 2024. 01. 09.

Jonggu Lee, Sunghyup Kim, Byungjo Kim, Sanghoon Lee, Sukwon Lee, Sebin Choi, “Method of manufacturing a semiconductor package”, US Patent, US11,848,301B2 (Published), 2023. 12. 19.