Effect of Humidity and Thermal Cycling Conditions on the Mechanical Strength of Dual Cure Epoxy Adhesives For Assembly of Camera Modules Utilized by Active Alignment Technique
Andy Lam (MatE), Daniel Broskie (ME), Sahib Dokal (CNSM), Yusef Alramahi (BME)
Advisors: Anthony Babasa (Jabil) and Silvie Tran (Jabil)
Adhesive bonding is essential in precision manufacturing, especially optical assemblies where infinitesimal-scale alignment is critical. Active alignment—a technique that optimizes optical component positioning and orientation in real time—relies heavily on adhesives that can be partially cured to keep the alignment stationary before full curing. Dual-cure epoxy adhesives, capable of both UV and thermal curing, are ideal for this process, offering excellent mechanical properties, flexibility in cure sequence and spatial control. However, these assemblies often face fluctuating environmental conditions, where humidity and thermal cycling may degrade adhesive performance over time. Despite their growing use, limited data and research exist on the long-term mechanical reliability of dual-cure adhesives in exposure to such environmental stresses, especially in the context of active alignment-based assemblies. This project aims to address that gap by evaluating the strength retention of dual-cure epoxy adhesive joints after exposure to controlled humidity and thermal cycling conditions. Cylindrical and lap shear samples fabricated from 6061 aluminum were bonded using commercial dual-cure epoxies. These samples were subjected to specific environmental conditioning protocols for microelectronics and photonic devices, then tested for tensile and shear strength. Results from conditioned samples were compared to control specimens kept under standard laboratory conditions. The findings were compiled into an expanded adhesive performance database with a user-friendly interface designed to support optimized adhesive selection. By linking environmental durability with application-specific performance, this research advances the reliability of active alignment assemblies and optimizes adhesive selection for demanding environments.
