The Extreme Lithography & Materials Innovation Center (ELMIC) is advancing the fundamental science that drives the integration of new materials and processes for future microelectronic systems. ELMIC's research is centered on the science and technology of creating and controlling small dimensions in innovative materials while understanding their underlying physical principles. The center focuses on plasma-based nanofabrication, extreme ultraviolet (EUV) photon sources, 2D-material systems, and extreme-scale memory.
ELMIC is one of three 2024 Microelectronics Science Research Centers funded by the U.S. Department of Energy.
ELMIC's four projects focus on three collaborative research thrusts aimed at advancing microelectronics and materials science.
Two ELMIC projects, ANGEL and LEEPS, aim to improve EUV light conversion efficiency. The ANGEL project seeks to enhance EUV source efficiency using low-density Sn targets through experimental studies and modeling of plasma physics and also investigates multi-layer mirror degradation due to hydrogen exposure. The LEEPS project focuses on developing a high-energy Tm:YLF laser driver and explores laser-matter interaction physics.
"ANGEL" "LEEPS"
Both LEEPS and PlasMat2D study plasma-related processes crucial for microelectronics materials synthesis. LEEPS will use a high-power thulium-doped yttrium fluoride lithium (Tm: YLF) crystals laser driver to explore laser-matter interaction physics, while PlasMat2D will develop industrially compatible manufacturing processes for 2D materials using a science-based plasma-processing toolbox.
Materials for Microelectronics
This research area advances the fundamental science needed to enable next-generation semiconductor devices. It includes the growth and atomistic understanding of 2D materials like TMD monolayers for 3D integration, as well as the development of nanostructured materials with precise, atomic-scale control for revolutionary memory technologies.
"PlasMat2D" "UDM"