Developed 4H-SiC Detectors during my PhD
Developed TSC/TSCAP based Trap Characterization setup during my PhD
Working with DLTS Characterization
DCTS characterization for GaN-based HEMTs
Handling capability of instruments:
PhysTech FT 1030 Deep-Level Transient Fourier Spectroscopy (DLTFS) system.
Janis ST-500-UHT Cryogenic Probe Station, Janis ST-100, and Helitran LT4 Cryostat.
Agilent B1500A Semiconductor Device Analyzer.
Keithley 6517A and 6517B Electrometer, Lakeshore 325, 330, and 336 Temperature controller.
Keithley 2634B Dual-Channel SMU.
MFIA Impedance Analyzer.
Agilent 4285A LCR meter, Agilent 4294A Impedance Analyzer.
RENISHAW Raman Spectroscopy system.
Boonton 72B Capacitance Meter, DL Instruments 1211 Current Preamplifier.
Carbolite Gero Tube Furnace STF 16/450, Cascade Microtech Summit 12000AP Probe Station.
Hummer 6.6 Turbo RF Sputtering System, Loresta-GP MCP-T610 low resistivity meter.
Hind HiVac Vacuum Coating Unit 12A4D, SC7620 Mini Sputter Coater.
SPS6 Manual DC Probe Station.
NIM Modules: Ortec 807 Vacuum Chamber, Eurorad PR-16H Preamplifier, Fast ComTec CSP-10 Preamplifier, Canberra 2022 Amplifier, Ortec EASY-MCA, Ortec Maestro-32, Canberra 807 pulser.
Simulation Skills:
Simulation Tools: Sentaurus TCAD, Silvaco TCAD, SRIM-2013, Tanner L-edit.
Computational Tools: LabVIEW 2013, Origin Pro, MATLAB 2014, Xilinx ISE i9.1.
Device Fabrication Exposure:
Wafer cleaning, Wet etching process, Metallization,
Annealing, Photolithography, and Mask Design.