Research
Embedded Files
Emerging Materials & Process for energy-efficient computing technologies
Emerging Materials
& beyond-CMOS devices
Emerging Materials
& beyond-CMOS devices
Discovery of emerging topological semimetals (TSMs) at the nanoscale
Wafer-scale MOCVD & Atomic-layer conversion for epitaxial quantum materials and transport properties
Emerging materials for Beyond CMOS devices and next-generation computing
(research on 2D Epitaxy @ POSTECH)
Nature Nanotechnology, 16(10) 1092 (2021)
Science Advances, 5(7), eaaw3180 (2019)
Advanced Materials, 27 (25), 3839-3839 (2015)
Nature Communications, 6, 7372 (2015)
Post-Cu Interconnects (BEOL) & Reliability
Post-Cu Interconnects (BEOL) & Reliability
Screening beyond-Cu interconnects & transport of scaled interconnect via topological conduction in quasi-2D forms
Reliability of interconnects and dielectrics (ILDs)
Atomically thin 2D Materials for interconnects components
(research on topological semimetal)
Science, 393, 6808, 272-279 (2026)
Nature Communications, 15, 5889 (2024)
Advanced Materials, 2208965 (2023)
Appl. Phys. Lett. 1 , 121, 113105 (2022)
APL Materials, 12, 121113 (2024)
Advanced
2.x-3D Package Design
Advanced
2.x-3D Package Design
Process developments and reliability of fine-pitch embedded 2.xD RDL on glass
Hybrid beyond-Cu bonding for 3D packaging
(research on advanced pacakging)
IEEE ECTC 2140-2144 (2025)
IEEE ECTC 2451-2455 (2026)
Submitted to IEEE TCPMT (2026)
Submitted to Nat. Communs (2026)
Facilites
Shared clean room facilites (Gachon NANO FAB)(Maskless laser writer litho system, RIE, E-beam evaporator)(1st floor, Semi. Colg. Bld.)
Shared Characterization tools (Probe station, semiconductor analyzer, Raman, High power source meter, AFM,) (603, Semi. Colg. Bld.)
Thin-film deposition systems and characterization tools (107, Eng. Colg. Bld. 1)
characterization tools (B204E, Semi. Colg. Bld.)
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