Research
Embedded Files
Emerging Materials & Process for On-chip & Off-chip Interconnects
Quantum Materials
& beyond-CMOS devices
Quantum Materials
& beyond-CMOS devices
Discovery of emerging topological semimetals at the nanoscale
Wafer-scale MOCVD & Atomic-layer conversion for epitaxial quantum materials, hetero-interfaces, and transport properties
Beyond CMOS devices
Nature Nanotechnology, 16(10) 1092 (2021)
Science Advances, 5(7), eaaw3180 (2019)
Advanced Materials, 27 (25), 3839-3839 (2015)
Nature Communications, 6, 7372 (2015)
Post-Cu Interconnects (BEOL) & Reliability
Post-Cu Interconnects (BEOL) & Reliability
Screening beyond-Cu interconnects & transport of scaled interconnect via topological conduction
Reliability of interconnects and low-k dielectrics (ILDs)
Atomically thin 2D Materials for interconnects components
Nature Communications, 15, 5889 (2024)
Advanced Materials, 2208965 (2023)
Applied Physics Letters, 121 (11), 113105 (2022)
arXiv:2503.04621 (under review) (2025)
Advanced
2.x-3D Package Design
Advanced
2.x-3D Package Design
Process developments and reliability of fine-pitch embedded 2.1D RDL on glass
Hybrid beyond-Cu bonding for 3D packaging
IEEE ECTC 2140-2144 (2025)
IEEE ECTC submitted (2026)
In prep. (2026)
Facilites
Shared clean room facilites (Gachon NANO FAB)
Shared Characterization tools (Probe station, semiconductor analyzer, AFM, Maskless laser writer litho system)
Thin-film deposition systems and characterization tools
Bond Reliability testing systems
Report abuse