Research
Emerging On-chip & Off-chip Interconnects
Ultra-scaled Materials
for Fine-pitch Integration
for Fine-pitch Integration
Discovery of emerging interconnects materials via Magnetron Co-sputtering & ALDep
CVD of Low-k ILDs for interconnects and RDLs
Wafer-scale CVD for Epitaxial 2D FEOL transistors
Nature Nanotechnology, 16(10) 1092 (2021)
Science Advances, 5(7), eaaw3180 (2019)
Advanced Materials, 27 (25), 3839-3839 (2015)
Nature Communications, 6, 7372 (2015)
Post-Cu Interconnects (BEOL) & Reliablity
Screening Beyond-Cu Interconnects (BEOL) & transport of scaled interconnect
Reliability of Interconnects and low-k dielectrics
Nature Communications, In press (2024)
Advanced Materials, 2208965 (2023)
Applied Physics Letters, 121 (11), 113105 (2022)
Advanced
2.x-3D Package Design
2.x-3D Package Design
Process developments and reliability of fine-pitch embedded 2.1D RDL using advanced gap-fill approaches
Hybrid beyond-Cu bonding for 3D packaging utilizing novel passiviation layers
Buffered build-up films for high AR TGVs
Thermo-Mechanical Simulations (On-going)
In prep. (2024)
In prep. (2024)