Research
Embedded Files
Emerging Materials & Process for energy-efficient computing technologies
Emerging Materials
& beyond-CMOS devices
Emerging Materials
& beyond-CMOS devices
Discovery of emerging topological semimetals (TSMs) at the nanoscale
Wafer-scale MOCVD & Atomic-layer conversion for epitaxial quantum materials, hetero-interfaces, and transport properties
Emerging materials for Beyond CMOS devices, next-generation computing and versatile electronic system
(research on 2D heterostructures)
Nature Nanotechnology, 16(10) 1092 (2021)
Science Advances, 5(7), eaaw3180 (2019)
Advanced Materials, 27 (25), 3839-3839 (2015)
Nature Communications, 6, 7372 (2015)
Post-Cu Interconnects (BEOL) & Reliability
Post-Cu Interconnects (BEOL) & Reliability
Screening beyond-Cu interconnects & transport of scaled interconnect via topological conduction in quasi-2D forms
Reliability of interconnects and low-k dielectrics (ILDs)
Atomically thin 2D Materials for interconnects components
(research on topological semimetal)
Nature Communications, 15, 5889 (2024)
Advanced Materials, 2208965 (2023)
Appl. Phys. Lett. 1 , 121, 113105 (2022)
arXiv:2503.04621 (under review) (2025)
Advanced
2.x-3D Package Design
Advanced
2.x-3D Package Design
Process developments and reliability of fine-pitch embedded 2.xD RDL on glass
Hybrid beyond-Cu bonding for 3D packaging
(research on advanced pacakging)
IEEE ECTC 2140-2144 (2025)
IEEE ECTC submitted (2026)
In prep. (2026)
Facilites
Shared clean room facilites (Gachon NANO FAB)(1st floor, Semi. Colg. Bld.)
Shared Characterization tools (Probe station, semiconductor analyzer, AFM, Maskless laser writer litho system) (603, Semi. Colg. Bld.)
Thin-film deposition systems and characterization tools (107, Eng. Colg. Bld. 1)
characterization tools (B204E, Semi. Colg. Bld.)
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