Research
Embedded Files
Emerging Materials & Process for On-chip & Off-chip Interconnects
Ultra-scaled Quantum Materials
for Fine-pitch Integration
Ultra-scaled Quantum Materials
for Fine-pitch Integration
Discovery of emerging topological interconnects materials via scalable dep.
Wafer-scale CVD & Atomic-layer conversion for epitaxial quantum materials
Low-k ILDs for interconnects and RDLs
Nature Nanotechnology, 16(10) 1092 (2021)
Science Advances, 5(7), eaaw3180 (2019)
Advanced Materials, 27 (25), 3839-3839 (2015)
Nature Communications, 6, 7372 (2015)
Post-Cu Interconnects (BEOL) & Reliability
Post-Cu Interconnects (BEOL) & Reliability
Screening beyond-Cu interconnects & transport of scaled interconnect via topological conduction
Reliability of interconnects and low-k dielectrics
Atomically thin 2D Materials for interconnects components
Nature Communications, 15, 5889 (2024)
Advanced Materials, 2208965 (2023)
Applied Physics Letters, 121 (11), 113105 (2022)
arXiv:2503.04621 / Science (under review) (2025)
Advanced
2.x-3D Package Design
Advanced
2.x-3D Package Design
Process developments and reliability of fine-pitch embedded 2.1D RDL using advanced gap-fill approaches
Hybrid beyond-Cu bonding for 3D packaging utilizing novel passiviation layers
Thermo-Mechanical/Electrical Simulations (On-going)
IEEE ECTC (2025)
In prep. (2025)
Facilites
Shared clean room facilites (Gachon NANO FAB)
Shared Characterization tools (Probe station, semiconductor analyzer, AFM, Maskless laser writer litho system)
Thin-film deposition systems and characterization tools
Bond Reliability testing systems
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