05.27.2026
Meeting with
OCI 중앙연구소
Embedded Files
05.29.2026
반도체디스플레이학회
우수논문상 김경준
05.27.2026
Meeting with
CTO C. Lee @ TDS Inno.
05.28.2026
Special lecture,
SKKU SAINT
05.25.2026
Yeryun(Cornell Univ.) visited TIPL
2026 한양대-반도체메모리특론
"첨단패키징과 HBM 동향" 강의
2026 MRS Spring, Hawaii, US
Jungsoo Lee
2026 ACW invited talk
2026-1 Group photo
Gachon-NSYSU MOU
0220.2026 Seminar at Ajou Univ.
Samsung Elec. 특강
High power probe station
Shared facilities: E-beam deposition & RIE
Shared facilities: CMP(Chemical Mechanical Polishing)
Shared facilities: Nano-polisher, tester, diamond cutter
1125.2025 Seminar at
Seong Keun Kim Group @ KIST
KOREA-JAPAN Ceramics 39, Jeju
Invited talk
2025 Advanced Pacakging R&D 연차기술교류회 발표
0911.2025 National Sun Yat-sen University, Taiwan,
Dept. of photonics
0901.2025 KIMS visit
2025 Advanced Semiconductor Packaging & Chiplet Show
2025 MRS Spring, Seattle with Prof. Judy Cha (Cornell Univ.)
Shared facilities
-Vacuum probe station
Shared facilities
-AFM
Shared facilities-FluoTime300
Gachon NanoFab facilities
-Depo. Etch. Litho.
2025 과기부 반도체사업 성과교류회
2025 INPEC, Ewha univ,
Invited talk
2025 KMEPS (Microelectronics And Packaging Society )
Tokyo Electron Korea TTCK-2 invitation
Tokyo Electron Korea TTCK-2 invitation
2024 Advanced Pacakging R&D 연차기술교류회 발표
2024 반도체 미래기술 로드맵 발표회 참여
2025 Korean Conference on Semiconductors 초청연사발표
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2024 첨단 패키징 R&D 사업 착수교류회 발표
2024 숭실고등학교
진로멘토특강
Col. of Semi.
Before Gachon Univ. (~2024)
Ithaca (Cornell)
CNF (Cornell)
New Haven (Yale)
WCC (Yale)
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