Thin-Film Interconnects
& Packaging Laboratory
박막 배선 패키징 연구실
박막 배선 패키징 연구실
The rate-limiting factor in processor chips is how we move information. Interconnect is a major rate-limiting factor to overall product performance. We advance energy-efficient interconnects for AI and the Fourth Industrial Revolution by developing quantum materialsthat surpass scaling limits and next-generation on/off-chip interconnects with advanced integration and processing. Using integrated epitaxy, scalable integration techniques, cutting-edge inspection, and analysis, we deliver innovations in advanced packaging and interconnect design.
<Open positions for Interns, Grad Students, Postdocs>
Current available projects:
(1) Beyond-Cu Interconnects (Topological semimetals) & reliability
(2) Epitaxial 2D Quantum Materials, transport, and logic devices
(3) Process development for Advanced Packaging / FEA Simulation
(NRF, BK21, KIAT 반도체특성화대학 사업 등 등록금 및 장학금 지원)
We are always seeking motivated undergraduate, graduate students, and postdocs in Electronic Eng., Materials Science, Physics, Chemistry, Mech. Eng. and Chemical Engineering. Contact: gjin@gachon.ac.kr
[ LAB NEWS ]
(2025.09) NRF -중견연구(창의연구형) 선정되었습니다. 정부 지원에 큰 감사드립니다.
(2025.06) Ministry of Education - 인프라 고도화 지원과제 사업 선정- (핵심연구자(참여연구자)) [News]
(2025.03) Ministry of Education - BK 21 지능형 반도체 인재 양성 사업 참여
(2024.07) KIAT-반도체 특성화 대학 사업 참여
(2024.07) Diameter-dependent phase selectivity in 1D-confined tungsten phosphides, G Jin et al., Published in Nature Communications [News]
(2024.04) NRF-Advanced Pacakging R&D 사업-차세대 반도체 대응 미세기판 기술 개발사업 수행 [News]