We drive the AI Revolution by bridging the gap between nanoscience and system-level integration through a comprehensive device-to-system scale-up. Our research starts with scalable quantum materials, such as topological semimetals and epitaxial 2D heterostructures, to develop Beyond-CMOS logic and high-performance interconnects. We extend this expertise from on-chip beyond-Cu solutions to macroscopic off-chip interfaces, leveraging 2.XD interposers and HBM joints. By utilizing simulation-driven analysis to ensure structural and electrical reliability, our multi-scale approach effectively overcomes the rate-limiting factors and thermal-mechanical bottlenecks of next-generation AI semiconductors.