Our mission is to address the escalating demand for high-performance system semiconductors—critical enablers of artificial intelligence and the broader Fourth Industrial Revolution. Our research focuses on pioneering quantum materials and advanced interconnect technologies for both on-chip and off-chip integration. We are particularly interested in leveraging unconventional electron scattering mechanisms that transcend the limitations of traditional copper-based interconnects. To realize these goals, we employ a comprehensive suite of fabrication and characterization tools, including epitaxial growth platforms, scalable thin-film deposition systems, and state-of-the-art inspection and analytical instrumentation. Through this integrated approach, we aim to contribute foundational innovations to the future of semiconductor packaging and interconnect design.