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Design Iterations:

Folding Case Mk. I:

Initial CAD design for circuitry housing. This was the first rough concept for the circuitry housing.

Folding Case Mk. II:

A more detailed and functional iteration of the initial folding case design. This was designed and 3D printed to be compatible with the TI SensorTag.

Single Piece, Flexible Shell Mk. I:

This alternative design is a single piece that fits the TI SensorTag. It was printed with flexible material (TangoBlackPlus and VeroClearPlus blend) and snugly grips the circuitry with a cut to allow access to power button.

First Printed Iterations:

Next Design and Printed Iteration:

This design uses the TangBlack for the housing of the sensor tag much like previous designs; however the change comes from using the VeroClear material for the access power button as it provides a more effective contact. The VeroClear was also used to make a sealing cap with grooves along the inside of the housing (not shown) for sliding the cap in and out.