Professor

Education

University of Michigan, Ann Arbor, Michigan

Ph.D. at Electrical Engineering & Computer Science, May 2003 – Dec. 2007

   - Dissertation : Exploiting Interactions between Integrated Circuit Design and Manufacturing

M.S. at Electrical Engineering & Computer Science, Apr. 2003

Yonsei University, Seoul, Korea

B.S. in Electrical Engineering, Aug. 1999

   - Thesis : Multi-User Video Conferencing System using TCP/IP (with Visual C++)

Research Experience

Kwangwoon University, Seoul, Korea, Mar. 2015 – Feb. 2019

   Associate Professor, School of Computer and Information Engineering.

UNIST, Ulsan, Korea, Aug. 2009 – Feb. 2015

   Assistant Professor, Nano-System Design and Automation Lab. School of Electrical & Computer Engineering.

Qualcomm Incorporated, San Diego, California, Oct. 2007 – July 2009

   Senior Engineer, Physical Design Team, Qualcomm CDMA Technologies

   - Investigating the 45nm/32nm technology process and design methodologies

   - Investigating low power methodology for Qualcomm’s new digital chips

University of Michigan, Ann Arbor, Michigan, Sep. 2002 – Aug. 2007

   Graduate Student Research Assistant (Full-time), VLSI Design/Automation LAB, SSEL working with Prof. Dennis Sylvester

    - Implemented inductance extraction tool, INDIGO based on the PEEC circuit modeling technique using C++ STL

   - Investigated performance metrics for interconnect stacks in terms of bandwidth and power

   - Minimizing path delay/leakage sensitivity to lithographic focus variations based on iso/dense features

   - Investigated interactions between IC design and manufacturing

   - Post lithography simulation, line end shortening, and diffusion rounding

Blaze-DFM, Sunnyvale, California, Oct. 2006 – Mar. 2007

   Intern, software engineer

   - Involved in investigating Ingra-Gate Biasing

   - Implemented post-lithography sign-off modules

Mentor Graphics Corporation, Wilsonville, Oregon, July 2005 – Oct. 2005

   Intern, Calibre Team, Deep Submicron Division

    - Involved in investigating the impact of the metal dummy-fills

   - Implemented simple metal-fills impact prediction models

Samsung Electro-Mechanics, Suwon, Korea, Aug. 1999 – Oct. 2000

   Researcher, Strategic Technology Team, Digital Group.

    - Involved in PCB design for USB/IEEE 1394 PC camera module

   - Researched CCD and CMOS sensor