The laboratory provides the following technology transfer and contract fabrication services to academic institutions and industrial partners:
Copper electroforming and nickel-cobalt alloy electroforming
Wet chemical etching
Reactive ion etching (RIE)
Photolithography processes (including thick photoresist processes)
DC and RF sputtering (including metal and dielectric layers)
Thermal evaporation of metal materials
Contact angle and surface tension measurements
Optical microscope imaging
Polarographic composition analysis
Dynamic video recording using a long working distance microscope
Ferroelectric and piezoelectric property measurements
Surface profilometry measurement
High-temperature ceramic sintering
Anodic bonding of glass and wafers
Carbon dioxide supercritical drying