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ν΄μΈνμ μ§(International Journal) - SCI(E) indexed
Laser solder ball jetting of SAC305/ENIG joints: Microstructure, kinetics, and reliability under multiple reflow cycles, Seungchan Ka, Deborah Bae, Ashutosh Sharma, Jae Pil Jung, Hyun-Sik Kim, Intermetallics, 189 (2026) 109098, (Available online 28 November 2025), IF 4.8
Acoustic and Mechanical Performance of Cu-Si Alloys for Application in Temple Bells, Chun-Soo Won, Jae Pil Jung, and Daniel Youngmin Park, Metals 2026, 16, 223, IF 2.8Β Β Β
Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging, Chul Hwa Jung, Jae Pil Jung, Ashutosh Sharma , Hyun-Sik Kim, Journal of Alloys and Compounds, 1038 (2025) 182619, IF 6.3
Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging, Jun Ho Ku , Sri Harini Rajendran, Ashutosh Sharma, Jae Pil Jung, Hyun-Sik Kim, J Mater Sci: Mater Electron (2025) 36:1410Β
Lowβmelting and thermalβconducting SnβBiβAg solder enhanced withΒ SnO2 nanoparticles for reliable miniβLED microsystems, Jiwan Kang, Ashutosh Sharma, and Jae Pil Jung,Β J Mater Sci: Mater in Electron (2025) 36:693.Β https://doi.org/10.1007/s10854-025-14658-6Β Β
Electrochemical deposition of Snβ0.7Cu alloy modifed with nanoβWO3 for highβdensity miniβLED packaging, Gyeong Ah Lee, Ashutosh Sharma,Β Jae Pil Jung, Jour. of Mater Sci: Mater. in Electron.,35:953, (2024)Β Β
Β SnβBiβAg Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging, Ashutosh Sharma, HyeJun Kang, Jae Pil Jung, ACS Applied Nano Materials, 7 (2) (2024)
Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging, Ashutosh Sharma, Seung Jun Hwang, Jae Pil Jung, ACS Applied Nano Materials, 7 (2) (2024)
Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil interlayer, Sri Harini Rajendran, Gyeong Ah Lee, Jin Yong Park, Young Su Kang, Jae Pil Jung, Materials Chemistry and Physics 313 (2024) 128732/1-12Β
Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding, Sri Harini Rajendran, Junho Ku, Jiwan Kang, Jae Pil Jung, Materials Today Communications,Β 38(3) (2024) :108250Β
Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb, Sung-joon Hong, Ashutosh Sharma, and Jae Pil Jung, Materials, 17, (2024), 2661/1-14
Recent Advances in High Entropy Alloy Fillers for Brazing Similar and Dissimilar Materials: A Review, Furkan Khan, Sri Harini Rajendran, Jae Pil Jung, Metals and Materials International, 30 (2024), 1145-1169
Intermediate LowβMeltingβTemperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying, YoungβWoo Lee, TaeβKyu Lee, JaeβPil Jung, Journal of Electronic Materials, 52, pp 810β818, 2023
Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0.5Cu solder paste on InGaN LED chip/ENIG joints, Sri Harini Rajendran, Seong Min Seo, Jae Pil Jung,Β Materials Today Communications 35 (2023) 105795/1-16
Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review, Ye Jin Jang, Ashutosh Sharma,Β and Jae Pil Jung, Materials 2023, 16, 7652/1-40
Effect of Surface Pretreatment and Plating Time on Electromagnetic Shielding Reliability of Electroless Plated Copper Layer Conductors, Jung Jae Pil, LeeΒ Jung-Hyun, Sharma Ashutosh, ACS Applied Electronic Materials, Vol. 4, No. 3, pp 1019-1028, 2022
Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment, Sri Harini Rajendran, Do Hoon Cho, Jae Pil Jung, Materials Today Communications, Volume 31, 103814, ISSN 2352-4928, 2022
Welding Properties of Dissimilar Al-Cu Thin Plate by a Single-Mode Fiber Laser, Soon Jae Lee, Kwang Deok Choi, Su Jin Lee, Dong Sik Shin, Jae Pil Jung, Metals, Vol.12, 1957, 2022Β
Technological Insights into the Evolution of Bronze Bell Metal Casting on the Korean Peninsula, Chun Soo Won, Jae Pil Jung, Kwang Sik Won, Ashutosh Sharma, Metals, Vol. 12, 1776, 2022
Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn-3.0Ag-0.5Cu solder using 1608 chip capacitor/ENIG joints, Sri Harini Rajendran, Do Hyun Jung, Jae Pil Jung, Journal of Materials Science: Materials in Electronics, Vol. 33, pp. 3687-3710, 2022
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process, Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung, Metals, 1664, pp. 1-29, 2021
Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring, Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung, Metals, 1537, pp. 1-48, 2021
Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties, Sri Ahrini Rajendran, Hyejun Kang, Jae Pil Jung, Journal of Materials Engineering and Performance, Vol. 8, pp. 3167-3172, 2021
Cu Protrusion of Different through-Silicon via Shapes under Annealing Process, Alireza Eslami Majd, Il Ho Jeong, Jae Pil Jung, Nduka Nnamdi Ekere, Journal of Materials Engineering and Performance, Vol. 30, pp. 4712-4720, 2021
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics, Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung, (2021) Metals 11(2):364Β
Active Brazing of Alumina and Copper with Multicomponent Ag-Cu-Sn-Zr-Ti Filler, Sri Harini Rajendran, Seung Jun Hwang, Jae Pil Jung, Metals, 509, pp. 1-16, 2021
Transient liquid phase bonding of silicon and direct bond copper via electroplating of tin-copper interlayers for power device applications, Hyejun Kang, Austosh Sharma, Jung-Hyun Lee, Jae Pil Jung, Mater. Rex. Express Vol.8, pp. 1 - 22, 2021Β
Recent Low Temperature Solder of SnBi and Its Bonding Characteristics, Hyejun Kang, Bumgye Baek, Jae Pil Jung, Journal of Welding and Joining, Vol. 38, Issue 6, pp 576 β 583, 2020Β
Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles, Sri Harini Rajendran, Seung Jun Hwang, Jae Pil Jung, Metals, Vol. 20, Issue 20, pp. 1 17, 2020
Recent Advances in Active Metal Brazing of Ceramics and Process, Sachinyy MishraMishra, Asutosh Sharma, Do Hyng Jung, Jae Pil Jung, Metals and Materials International, Vol. 26, Issue 8, pp. 1087 β 1098, 2020Β
Liquid metal embrittlement of galvanized TRIP steels in resistance spot welding, Wook-Sang Jeon, Ashutosh Sharma, Jae Pil Jung, Metals, Vol. 10, Issue 6, pp. 1- 23, 2020Β
Electrical and mechanical analysis of different TSV geometries, Il Ho Jeong, Alireza Eslami Majd, Jae Pill Jung, N.N. Ekere, Metals, Vol. 10, Issue 4, 2020Β
Recent progress in transient liquid phase and wire bonding technologies for power electronics, Hyejun Kang, Ashutosh Sharma, Jae Pil Jung, Metals, Vol. 10 Issue 7, pp. 1-21, 2020Β
Al-Cu Electrode Laser Welding for Rechargeable Battery, Seung Jun Hwang, Tae Wan Kim, Wook Sang Jeon, Jae Pil Jung, Volume 26 Issue 4, pp. 1-6, 2019
Transient Liquid Phase Bonding of Copper using Sn Coated Cu MWCNT Composite Powders for Power Electronics, Sri Harini Rajendran, Do Hyun Jung, Wook Sang Jeon, Jae Pil Jung,Β Applied Science, Vol 9, Issue 3, pp. 529-1 - 529-10, Β 2019
Recent Advances in Active Metal Brazing of Ceramics and Process,Β S. Mishra,Β A. Sharma, D. H. Jung, J. P. Jung,Β Metals and Materials International, Vol. 26, pp. 1087-1098, 2019
Effect of different nanoparticles on microstructure, wetting and joint strength of Alβ12Siβ20Cu braze filler,Β Ashutosh Sharma , Di Erick Xu and Jae-Pil Jung , Mater. Res. Express Vol. 6, pp. 056526-1 - 056526-13, 2019Β
Copper-silicon carbide composite plating for inhibiting the extrusion of through silicon via (TSV), So-Ho Kee, Won-Joong Kim, Jae Pil Jung, Microelectronic Engineering, Vol. 2114, Issue 1, pp 5 -14, 2019
Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging, Do Hyun Jung, Jae Pil Jung, Critical Reviews in Solid State and Materials Sciences, Vol. 44, Issue 4, pp 324 β 343, 2019
Influence of Arc Brazing Parameters of Microstructure and Joint Properties of Electro-Galvanized Steel, Soon Jae Lee , Ashutosh Sharma, Do Hyun Jung, Jae Pil Jung, Metals, Vol. 9, Issue 9, pp. 1006-1 - 1006-12, 2019
Liquid Metal Embrittlement of Resistance Spot Welded 1180 TRIP Steel: Effect of Electrode Force on Craking Behavior, Du-Youl Choi, Ashutosh Sharma, Sang-Ho Uhm, Jae Pil Jung, Metals and Materials International, Issue 1, pp 219-228, 2019
Effect of ZrO2 Nanomaterials on Wettability and Interfacial Chracteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing, Do Hyun Jung, Sri Harini Rajendran, Jae Pil Jung, Nanomaterials, Vol 8, Issue 10, pp 784-802, 2018
Influence of Nanozied AIN Powders on the Microstructure, Brazeability, and Tensile Properties of Al-based Filler for Low Temperature Al/Cu Dissimilar Brazig, Do Hyun Jung, Jae Pil Jung, Korean Journal of Metals and Materials, Vol 56, Issue 9, pp 664-673, 2018
Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al2O3 Joint, Jioh Shin, Ashutosh Sharma, Do Hyun Jung, Jae-Pil Jung, Korean Journal of Metals and Materials, Vol 56, Issue 5, pp 366-374, 2018
A Review on Recent Advances in Trasient Liquid Phase (TLP) Bonding for Thermoelectric Power Module, D. H. Jung, A. Sharma, M. Mayer, J. P. Jung, Reviews on Advanced Materials Science, Vol 53, Issue 2, pp 147-169, 2018
Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Alloys and Compounds, Vol 743, pp 300-313, 2018
A review of soft errors and the low Ξ±-solder bumping process in 3-D packaging technology, D. H. Jung, A. Sharma, J. P. Jung, Journal of Materials Science, Vol 52, Issue 1, pp 47-65, 2017
Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications, Ashutosh Sharma, Young-Joo Jang, Jang Baeg Kim, Jae Pil Jung, Journal of Alloys and Compounds, Vol 704, pp 795-803, 2017
Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do-Hyun Jung, Jae Pil Jung, Journal of Materials Science: Materials in Electronics, Vol 28, Issue 11, pp 8116-8129, 2017
Effect of KOH to Na2SiO3 Ratio on Microstructure and Hardness of Plasma Electrolytic Oxidation Coatings on AA 6061 Alloy, Ashutosh Sharma, Yong-Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, Vol 26, Issue 10, pp 5032-5042, 2017
Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder, Do-Hyun Jung, Ashutosh Sharma, Dong-Uk Lim, Jong-Hyun Yun, Jae-Pil Jung, Metallurgical and Materials Transactions A, Vol 48, Issue 9, pp 4372-4384, 2017
Effect of brazing current and speed on the bead characteristics, microstructure, and mechanical properties of the arc brazed galvanized steel sheets, Ashutosh Sharma, Soon-Jae Lee, Du-Youl Choi, Jae Pil Jung, Journal of Materials Processing Technology, Vol 249, pp 212-220, 2017
Application of Surface Protective Coating to Enhance Environment-Withstanding Property of the MEMS 2DWind Direction andWind Speed Sensor, Kyu-Sik Shin, Dae-Sung Lee, Sang-Woo Song, Jae Pil Jung, Sensors (Basel)., Vol 17, 2017
Thermal shock, shear and insulating characteristics of epoxy embedded SAC 305 solder joints, Ashutosh Sharma, Young Joo Jang, Jang Baek Kim, Jae Pil Jung, Journal of Alloys and Compounds, Volume 704, p. 795-803, 2017
Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do Hyun Jung, Jae Pil Jungβ, Journal of Materials Science: Materials in Electronics, in press, Available online March 2017
Effect of AlN Nanoparticle Additions on Microstructure, Solderability and Mechanical Properties of Sn-Ag-Cu solder, Dohyun Jung, Ashutosh Sharma, Dong-Uk Lim, Heung Rak Sohn, Jae Pil Jung, Metallurgical and Materials Transactions A, (Minor Revision 2017)
Effect of KOH to Na2SiO3 ratio on microstructure and mechanical properties of plasma electrolytic alumina coatings, Ashutosh Sharma, Yong Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, Minor Revision 2017
Effect of brazing current and speed on the microstructure, weld characteristics and mechanical properties of the arc brazed hot-dip galvanized steel sheets using Cu3Si filler, Ashutosh Sharma, Soon Jae Lee, Do Youl Choi, Jae Pil Jung, Journal of Materials Processing and Technology, Minor Revision 2017
Radiation induced errors and low alpha solder bumping solder process in 3-D packaging technology, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Materials Science (Minor Revision 2017)
Flexible Nickel braze (BNi2 grade) for stainless steel brazing, Ashutosh Sharma, Soon-Jae Lee, Jae Pil Jung, (Submission in progress 2017)
Effect of ZrO2 nanoparticles on the microstructure of Al-Si-Cu filler for low-temperature Al brazing applications, Metallurgical and Materials Transactions A, Volume47, Number1, p.510-521, 2016
Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu(SAC) alloy, Metallurgical and Materials Transactions A, Volume47, Number1, p.494-503, 2016
Compressive strength evaluation in brazed ZrO2/Ti-6Al-4V joints using finite element analysis, Ashutosh Sharma, Se Ho Kee, Flora Jung, Yongku Heo, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 5, p. 1722-1728, 2016
Microstructure and braze ability of SiC nanoparticles reinforced Al-9Si-20Cu produced by induction melting, Ashutosh Sharma, Dong-Uk Lim, Jae-Pil Jung, Materials Science and Technology, Volume 32, Number 8, p. 773-779, 2016
Effect of La2O3 nanoparticles on the brazeability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, Ashutosh Sharma, Myung Hwan Roh, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 8, p. 3538-3545, 2016
Fabrication and shear strength analysis of Sn3.5Ag/Cu-filled TSV for 3D microelectronic packaging, Ashutosh Sharma, Do Hyun Jung, Myong Hoon Roh, Jae Pil Jung, Electronic Materials Letters, Volume 12, Number 6, p. 856-863, 2016
Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation, 1. Materials Transactions, Vol 56, Issue 12, p.2034-2041, 2015
Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure, Electronic Materials Letters, Vol 11, Issue 6, p.1078-1084, 2015
Electromigration of Composite Sn-Ag-Cu Solder Bumps, Electronic Materials Letters, Vol 11, No. 6, p.1072-1077, 2015
Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging, METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol 46, Issue 5, p.2051-2062, 2015
Effect of current density on morphology of electroplated tin, Surface Engineering, Vol 31, Issue 6, p.458-494, 2015
Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders, Materials and Manufacturing Process, Vol 30, Issue 1, p.127-132, 2015
Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping, J. of Materials Engineering and Performance, Vol 24, Issue 3, p.1107-1115, 2015
Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy, Materials and Design, Vol 87, p.370-379, 2015
High Shear Speed Characteristics of Sub-100 um Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration, J. of Microelectronics and Electronic Packaging, Do Hyun Jung, Shalu Agarwal, Santosh Kumar, Jae Pil Jung, Vol 12, Issue 3, p.161-169, (2015)
Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps, Microelectronics Reliability, Vol 54, Issue 1, p.265-271, January, 2014
Analysis of the Electrical Characteristics and Structure of Cu-Filled TSV with Thermal Shack Test, Electronic Materials Letters, Vol 10, Issue 3, p.649-653, May, 2014
Effect of Aluminium Additions on Wettability and Intermatallic Compound(IMC) Growth of Lead Free Sn(2wt.%Ag, 5wt.%Bi) Soldered Joints), Electron. Mater. Lett, Vol 10, No. 5, p.997-1004, September, 2014
Effect of current density on morphology of electroplated tin, Surface Engineering, 2014
Effect of thermal shock on Cu extrusion of TSV for three-dimensional packaging, Korean J. Met. Mater., Vol. 52, No. 6, pp. 459~465, 2014
Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation, S.Kumar, J.P.Jung, Mater. Sci. and Eng. B, 178, p.10-21, 2013
Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder, J. of Materials Science - Materials in Electronics, Vol. 24, No. 6, June. 2013, p.1748-1757,
High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking, Met. Mater. Int, Vol 19, No.1, pp. 123-128, 2013
Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering, IEEE Transactions on compo., pack. and manuf. tech., Vol.3, No.4, 2013, p.566-573
High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-?m Dimension for Wafer Level Packaging, IEEE Transactions on on compo., pack. and manuf. tech., Vol.3, No.3, 2013, p.441-451
Non-PR Sn3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current, IEEE Transactions on compo., pack. and manuf. tech., Vol. 3, No. 4, April. 2013, p.574-580
Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters, Vol. 9, No. 4 (2013), pp. 389-392
Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering and surface mount technology, Vol25, No.4, 2013
Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um size Solder Bumps, Met. Mater. Int, Vol 19, No.5, 2013
SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, S.Kumar, S.Agarwal, J.P.Jung, REVIEWS ON ADVANCED MATERIALS SCIENCE, 2013, 12, p185-202
Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, S.H.Kee, W.J.Kim. J.P.Jung, Surface & Coatings Technology, 2013, 11, p778-783
SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, REVIEWSON ADVANCED MATERIALS SCIENCE, 34κΆ, 2νΈ, P185-202, December, 2013
Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, Surface & Coatings Technology, 235κΆ, P778-783, November, 2013
Stencil Printing Behavior of LEAD-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um Size Solder Bumps, METALS AND MATERIALS INTERNATIONAL, 19κΆ, 5νΈ, P 1083-1090, September, 2013
Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering & Surface Mount Technology, 25κΆ, 4νΈ, P 209-217, September, 2013
Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters 9κΆ, 4νΈ, P 389-392, July, 2013
Mechanical and electronic of Ag3Sn intermatallic compound in lead free solders using ab initio atomisticcalculation, Mater. Sci. and Eng. B, 178, P 10-21, 2013
Reflectivity and Thermal Shock Properties of Sn-3.5Ag Electroless-plated Deposit for LED Lead Frames, Korean J. Met. Mater,Vol 51, No.2, pp. 89-94, 2013
Effective Cu Filling Method to TSV for 3-dimensional Si Chip Stacking, Korean J. Met. Mater, Vol.50, No.2, pp.152-158, 2012.
Electroplating Characteristics of Eutectic Sn-Cu Ions for Micro-Solder Bump on Si Chip, Journal of Nanoscience and Nanotechnology, Vol.12, p.3582-3588, 2012.
Reflection Characteristics of Displacement Deposited Sn for LED Lead Frame, Materials Transactions, Vol.53, No.5, pp.946-950, 2012.
Characteristics of electroplated Sn bumps fabricated without a PR mould on a Si chip for 3D packaging, Microelectronic Engineering, Vol.93, pp.85-90, May, 2012.Β
Fabrication of Electroplate Sn-Ag Bumps Without a Lithography Process for 3D Packaging, Met.Mater.Int, Vol.18, No.3, pp.487-491, 2012.
Wetting Property and Reflectivity of Sn-3.5Ag Solder by Plating for LED Lead Frame, Korean J. Met. Mater, Vol.50, No.8, pp.563-568, 2012.
Electrodeposition of the Sn-58wt.%Bi Layer for Low-Temperature Soldering, Met. Mater. Int., Vol. 17, No. 1, pp. 117~121, 2011.
Fabrication and Characteristics of Electroplated Sn-0.7Cu Micro-bumps for Flip-Chip Packaging, Korean J. Met. Mater, Vol. 49, No. 5, pp. 411~418., 2011.
Effect of shearing speed and UBMs on high speed shear properties of Sn3.0Ag0.5Cu solder ball, Korean J. Met. Mater, Vol. 49., No. 8, pp. 635~642,Β 2011.
Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking, Microelectronics Reliability, Vol. 51,,pp. 2228-2235., 2011.
New Process of Electroplate Sn Bumping on TSV without a PR Mould for 3D-Chip Stacking, Metals and Materials International, Vol.17, No.4, pp.631~635.,Β 2011.
Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints, Electronic Materials Letters, Vol. 7, No. 4, pp. 365-373, 2011.
A New Non-PRM bumping Process by Electroplating on Si Die for Three Dimensional Packaging, Materials Transactions, Vol.51, No.10, pp.1887-1892, 2010.
Effects of Effects of Steel Coatings on Electrode Life in Resistance Spot Welding of Galvannealed Steel Sheets, Mater. Transactions, Vol. 51, No. 12, p 2236~2242, 2010.
Sn Bumping Without Photoresist Mould and Si dice Stacking for 3-D Packaging, IEEE Transactions on Advanced Packaging, Vo. 33, No. 4, pp 912~917,2010.
Effects of Welding Parameters and Surface Pretreatments on Resistance Spot Welding of AZ31B Mg Alloy, Met.& Mater. Intβl, Vol. 16, No. 6, p.967~974, 2010.
Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer, Soldering & Surface Mount Technology, Vol. 21, No. 1, pp.4-10, 2009
Effects of surface conditions on resistance spot welding of Mg alloy AZ31, Science and Technology of Welding and Joining, VOL 14, No 4, pp.656-661, 2009
Effects of laser parameters on the characteristics of a Sn-3.5wt.%Ag solder joint, Metals and Materials International, Vol15, No1, pp.119-123, 2009
Finite Element Modeling of Simultaneous Ultrasonic Bumping with Au Balls, Journal of Electronic Packaging, Vol. 131 / 1 ~ 5, 2009
Characteristics of high speed shearing for Sn-3.0wt%Ag-0.5wt%Cu solder ball joint, Korean J. Met. Mater, Vol.47, No.9, p580-586, 2009
Effect of Laser Parameter on the Characteristics of a Sn-3.5%Ag Solder Joint, Metals And Materials International, Vol. 15, No. 1, pp. 119-123, 2008
Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature, J. of Materials Processing Technology, 208 (2008), p.179-186Β
Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball, Materials Science Forum, Vols. 580-582, pp.191-196, 2008
Bending Fatigue Characteristic of Sn-3.5Ag Solder bump on Ni-UBM, Materials Science Forum, Vols. 580-582, pp.177-182, 2008Β
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings, Microelectronics Reliability 48, pp.631-637, 2008
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5%wt.%Ag, Jung-Mo Kim, Jae-Pil Jung, Y.Norman Zhou, Joung-Young Kim, J. of ELECTRONIC MATERIALS, Vol. 37, No. 3, pp.324-330, 2008
Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards, J. LEE, J. KOO, S.M.HONG, H. SHIN, Y.MOON, J.P. JUNG, C.YOO,Β S.B.JUNG, Japanese Journal of Applied Physics, Vol. 47, No. 5, pp. 4300-4304, 2008
Study of fracture mechanics in testing interfacial fracture of solder joints, Bang,W.H., Moon, M.-W., Kim, C.-U., Kang, S.H., Jung, J.P., Oh, K.H., Journal of Electronic Materials, volume 37, No. 4, pp. 417 - 428, 2008Β
Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag, Soldering & Surface Mount Technology Vol. 19 pp. 3-8, 2007Β
Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip ; Seok Won Jung, Jae Pil Jung, and Y(Norman) Zhou; IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 1,p.10-16, 2006
Reliability of Sn-8 mass% Zn-3 mass % Bi Lead - free Solder and Zn Behavior, Sun-Yun Cho, Y.W. Lee, K.S. Kim, Y. Moon, J.W. Lee, H.J. Han, M.J. Kim, J.P. Jung, Materials Transactions, Vol. 46. No. 11 (2005) pp. 2322-2328
Application of TLP (Transient liquid phase) bonding method to the high Tm lead free solder, JS Lee, WH Bang, JP Jung, KH Oh, Materials Science Forum, Vol.475-479 (2005), p.1869-1872
Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In Solder by Stencil Printing, Jae-sik Lee, Jae-Pil Jung, Chu-Seon Cheon, Yun hong Zhou and Michael Mayer, Material Transactions, Vol. 46, No. 11 (2005) pp. 2359-2365Β
The Correlation between Stress Relacation and Steady-State Creep of Eutectic Sn-Pb, W.H. BANG, K.H. OH, J.P. Jung, J.W. MORRIS, Jr., and FAY. HUA, Journal of ELECTRONICS MATERIALS, Vol. 34, No. 10, 2005, pp. 1287-1300
Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate, I. Lum, J.P. Jung, and Y. Zhou, Metallurgical and Materials Transactions Vol. 36A (2005), No. 5, pp. 1279-1286
Fluxless Plasma Bumping of Lead-free Solders and the Reliability effects of Under Bump Metallization Thickness, Joon Kwon Moon, Y. Zhou and Jae Pil Jung, Soldering and Surface Mount Technology, Vol 17(2005), No 2
Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer. J.K.Moon, K.I.Kang,J.P. Jung, Y.Zhou. Mater. Trans. Vol.45 No.6. p1880-1885, 2004
Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass% Ag Solder alloy. J.S. Lee, W.Bang, J.P. Jung, K.H. Oh. Material Transactions Vol.45 No.3, p783~798,2004Β Β
Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. Hong, S. M., Kang, C.S., Jung, J. P, IEEE Transactions on Advanced Packaging, Vol 27, No 1,p90~96,2004
Fluxless Wetting Properties of UBM-Coated Si-Wafer to Sn-3.5wt% g Solder. Soon-Min Hong, Jae-Yong Park, Choon-Sikang, and Jae-Pil Jung, IEEE Transaction on Components and packaging technologies, VOL. 26, No 1, March, 2003
Fluxless Plasma soldering of Pb-free Solders on Si-wafer. invited, Jae Pil Jung, Joon-Kwon Moon, Soon-Min Hong, TMS 2003 132nd Annual meeting and exhibition, San diego, USA, p363, 2003
Pb - free solder bumping for flip chip package by electroplating. H.Hwang, S.M. Hong, J.P.Jung, C.S.Kang. Solder.& Surface Mount Tech., Vol. 15 No.2 2003, p10~16
Shear Strength and Interfacial Compound of Sn-Ag-Bi-In Alloy. Moon-Il Kim, Joon-Kwon Moon, and Jae-Pil Jung, Mater. Trans., Vol.43, No8 (2002) pp.1791 to 1796
Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip bonding by Ultra-Sonic Wave. SoonMin Hong, Choonsik Kang, JaePil Jung. Mater. Trans. Vol.43, No6. p1336-1340
Flux-free Direct Chip Attachment of Solder-Bump Flip Chip by Ar+H2 Plasma Treatment, S.M.Hong, C.S. Kang, J.P.Jung, J. of Electron. Mater., Vol.31, No.10, 2002
Fluxless Wetting Properties of One-Side-Coated Under Bump Metallurgy and Top Surface Metallurgy. SOON-MIN HONG, JAE-YONG PARK, JAE-PIL JUNG, CHOON-SIK KANG. Journal of ELECTRONIC MATERIALS, Vol. 30, No.8, 2001
Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis. Young-Eui Shin, Kyung-Woo Lee, Kyung-Ho Chang, Seung-Bu Jung and Jae-Pil Jung. Materials Transactions, Vol.42, No.5, May(2001) pp. 809 to 813
Microstructure and Mechanical Properties of Partial Melted Joint Using off Eutetic Lead-Free Solders. Jun-Suk Ha, Choon-Sik Kang, Jae-Yong Park and Jae-Pil Jung. Materials Transactions, Vol.42, No.5, May(2001) pp. 814 to 819
A Study on the Fluxless Soldering of Si-wafer/glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder. Soon-Min Hong, Jae-Pil Jung, Choon-Sik Kang and Young-Eui Shin. Materials Transactions, Vol.42, No.5, May(2001) pp. 820 to 824
Fluxless Wetting Properties of Top Substrate Metallurgy in Different Pb-Free Solders. S.M. Hong, J.Y. Park, Jae-Pil Jung,Choon-Sik Kang. Materials Transactions,Vol.42, No.7, (2001) p.1423-1427
Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere. Soon-Min Hong, Jae-Yong Park, Choon-Sik Kang and Jae-Pil Jung. Materials Transactions, Vol.42, No.3 (2001) pp. 520 to 527
Study on the Sn-Pb and Sn-Ag Electroplating for Bump Formation in Flip Chip Application. Hyeon Hwang,Soon-Min Hong, Choon-Sik Kang, Jae-Pil Jung. Proceedings of PRICM4. 2001
Analysis of the reaction between Sn-Ag solder and Ni40Fe/Cu/Ta/Si Under Bump Metallization for Flip Chip Application. Jun Seok Ha, Jae Yong Park, Cheol Woong Yang, Sung Jin Um, Choong Un Kim, Choon Sik Kang, Jae Pil Jung. Proceedings of PRICM4. 2001
A Study on the Solderability of Intermediate Melting Pointed Soler Ball. M.I. Kim, J.K. Moon, J.P. Jung, K. Ikeuchi, S.M. Hong and C.S. Kang. Seventh International Welding Symposium. KOBE, JAPAN. Nov, 20-22, 2001
The study on micro soldering using low-residue flux in soldering joint. Myung-Kee Choi, Chang-Yul Lee, Jae Pil Jung, Young-Eui Shin, Chan-Che Shur. Proceedings of 2001 international brazing and soldering conference. pp.115-125, Yangzhong, China. Oct, 29-31, 2001
Aging characteristics and prediction of thermal fatigue life of lead-free BGA solder joints. Young-Eui Shin, Sung-Jin Hwang, Seung-Boo Jung, and Jae Pil Jung. Proceedings of 2001 international brazing and soldering conference. pp46-54, Yangzhong, China. Oct, 29-31, 2001
Role of Bi and On on Sn-Ag lead free solder. Moon-il Kim, Joon-Kwon Moon, Kye-Hwan Kwak and Jae-Pil Jung. Proceedings of 2001 international brazing and soldering conference. pp89-93, Yangzhong, China. Oct, 29-31, 2001
Effect of Oxide Morphology on Bond Strength of Diffusion-Bonded Interfaces of Al-Alloys. K.Kotani, J.P.Jung, K.Ikeuchi, F.Matsuda. Trans. JWRI. Vol. 28, No. 2 (1999), pp.27-37Β Β
The Possibility of Soldering in Partial Melting Zone Using Hyper-Eutectic Sn-Pb alloys. Annual Meet. of TMS, TN, USA, Feb. (2000)
Effect Β ofΒ Β Plasma Β CleaningΒ Β on Β theΒ Β Flip-Chip Β BondingΒ Β Properties Β of Si-Wafer/Bumps/Glass system. Annual Meet. of TMS, TN, USA, Feb. (2000)
Application of Soldering in Partial Melting Zone to Grid Area PackagingΒ Using Pb Free Hyper-Eutectic Solder. Annual Meet. of TMS, TN, USA, Feb. (2000)
Effects of Interfacial Phases on Bond Strength of Diffusion-Bonded Joint of Al-X Binary Alloys (X=Mg, Si, Mn, Zn, Cu)- Diffusion-Bonding Mechanism of Al Alloys by Transmission Electron Microscopy (Report 6), K. KOTANI, J.P. JUNG, K. IKEUCI, F. MATSUDA. Quarter. Jour of Japan Welding Soc. Vol. 18, No. 4 p. 580-589 (2000)
Study on the soldering in partial melting state(1) - Analysis of surface tension and wettability. Jour. of Electronic Materials, Vol. 29, No.11(2000)
Study on Β calculation of Β surface tension Β of solder Β using wetting Β curve and Β itsΒ application to theΒ prediction of BGAΒ solder ball shape.Β 6th sympo. onΒ Microjoin. and Assembly Tech. in Electronics, Yokohama, Japan, pp.45~ 50, Feb. (2000)
TheΒ wetting Β properties of Β UBM-coatedΒ Si-wafer Β toΒ theΒ lead-free Β solders in Si-wafer/bump/glass flip-chipΒ bonding system.Β Proc. OfΒ 5th Int'lΒ Β Joint Sympo. On Microelectronics and Packaging, The IntlΒ Micro. and Pack. Soc., Seoul Korea, pp74-79 , Apr. (2000)
M.K.Choi, C.Y.Lee, J.P.Jung, C.J.Shur : A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux. Journal of Electronics Manufacturing, Vol.8, No.3/4 (1999)Β
The Analysis of the Withdrawal Force Curve of the Wetting, J. Y. Park, J. P. Jung, C. S. Kang, IEEE Trans. Component and Packaging Technology, Vol.22, No.3 (1999)Β
The Analysis of the Withdrawal Force Curve of the Wetting Curve Using 63Sn-37Pb and 96.5Sn-3.5Ag Eutectic Solders, J.Y. Park, C.S. Kang, J.P. Jung, J. of Electron. Materials, Vol.28, No.11 (1999)Β
A Study on the Solderability of QTP Outer Lead Using Nd:YAG Laser, METALS AND MATERIALS, Jae Pil Jung , Vol.5, No.3, pp.317βΌ321 (1999)Β
Transient Liquid Phase process in Ni-B joining. Jae-Pil JUNG, ChoonsikΒ Kang, Material Transactions, JIM Vol.38, No.10 (1997)Β
Interfacial Phases in Diffusion-Bonded Joints of Al-X Alloys (X=Mg, Si, Mn, Zn, Cu)- Diffusion-Bonding Mechanism of Al Alloys by Transmission Electron Microscopy (Report 5)Β . K.Kotani, Jae Pil Jung, K.Ikeuchi, F.Matsuda, Quar. Jour of Japan Weld. Soc. vol.15,no.2, pp.352-358.(1997)Β Β
Liquid phase diffusion bonding of Rene80 using pure boron. Jae Pil JUNG, ChoonsikΒ Kang, Materials Transactions, JIM Vol.37, No.5 (1996)Β
Korean Journals
(SCOPUS) Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging, Chae Yeon Lim, Shin Hui Seon, Hyun-Sik Kim, Jae Pil Jung, Korean J. Mater. Res. Vol. 35, No. 11 (2025), 511-522
Recent Through-Glass Via (TGV) Formation Technologies for AI Semiconductor Packaging, Chae Yeon Lim, Do Hyun Jung, and Jae Pil Jung, J. Microelectron. Packag. Soc., 32(2), pp1-9, (2025). https://doi.org/10.6117/kmeps.2025.32.2.001
Recent Sinter-Bonding Technology of Power Semiconductor Using Silver Particles, Hyeong-Woo Kang and Jae Pil Jung, , Journal of Welding and Joining, Vol.43, pp79-85 (2025). https://doi.org/10.5781/JWJ.2025.43.1.8 Β Β
λ°λ체 μ°μ κ²½μλ ₯ κ°νλ₯Ό μν μ λ΅μ μ κ·Ό, J. Microelectron. Packag. Soc., 32(4), 24-33 (2025)
Recent Progress of TGV Technology for High Performance Semiconductor Packaging, Beom Chang Seok and Jae Pil Jung, Journal of Welding and Joining, Vol.42, No.2, pp155-164 (2024). Β https://doi.org/10.5781/JWJ.2024.42.2.2Β
Recent Advances in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED, JH Ku, JP Jung, Journal of Welding and Joining, Vol.42 No.4(2024) pp428-436, https://doi.org/10.5781/JWJ.2024.42.4.10
Β Recent Research Trends in TGV and Cu-Filling for AI Semiconductor Packaging , Shin Hui Seon, Seong Gyeong Cheon, and Jae Pil Jung, J. Microelectron. Packag. Soc., 31(4), 37-46 (2024), https://doi.org/10.6117/kmeps.2024.31.4.01Β
(SCOPUS) Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor, Chul Hwa Jung,Β Ji Won Park, Sung Jin Kim, and Jae Pil Jung, Korean J. Mater. Res. Vol. 34, No. 11 (2024), https://doi.org/10.3740/MRSK.2024.34.11.529
Artificial Intelligence Semiconductor and Packaging Technology Trend, Hee Ju Kim and Jae Pil Jung, Jour. of the Microelectronics and Packaging Society, 30(3), 1-9 (2023)
Recent Progress of Hybrid Bonding and Packaging Technology for 3D Chip Integration, Chul Hwa Jung, Jae Pil Jung, Jour. of the Semiconductor & Display Technology, Vol. 22, No. 4. (2023), 38-47.Β
Joining Technology of Aluminum Alloys and Automotive Battery, μ€νκ΅, μ΄νκ·, λ¬Έλλ―Ό, μ κ΄ν, λ―Όμμ΄, κΉνμ, Jae Pil Jung, Β Journal of the Microelectronics and Packaging Society, Vol. 29, No. 3, pp 13-23, 2022
Wettability and Intermetallic Compounds of Sn-Ag-Cu-based Solder Pastes with Addition of Nano-additives, μμ±λ―Ό, Sri Harini Rajendran,Jae Pil Jung, Β Journal of the Microelectronics and Packaging Society, Vol. 29, No. 1, pp 1-7, 2022
A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals, Furkan, Hye-Jeong Kim, Gun-hwan Lee, Jae Pil Jung,Β Journal of Welding and Joining, Vol. 40, No. 3, pp 216-224, 2022
Trends of Packaging and Micro-joining Technologies for Car Electronics, μ΄κ²½μ, μ‘°λν, Sri Harini Rajendran, Jae Pil Jung, Β Journal of the Microelectronics and Packaging Society, Vol. 29, No. 1, pp 7-16, 2022
Scallop-free TSV, Copper Pillar and Hybrid Bonding for 3D Packaging , YeJin Jang, Jae Pil Jung,Β Journal of the Microelectronics and Packaging Society, Vol. 29, No. 4, pp 1-8, 2022
Characteristics of SAC305 and Nano-Particle Dispersed Solders, Jang Baeg Kim, Seong Min Seo, Hye Jun Kang, Do Hoon Cho, Sri Harini Rajendran, and Jae Pil Jung, J. Microelectron. Packag. Soc., 28(1), 31-37 (2021)Β
Three-Dimesnional Semi-conductor Stacking using TSV(Through-Si-Via) Technology, Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, and Jae Pil Jung, Journal of Welding and Joining, Vol.39 No.3(2021) pp295-303, https://doi.org/10.5781/JWJ.2021.39.3.8
Recent Low Temperature Solder of SnBi and Its Bonding Characteristics, Hyejun Kang, Bumgyu Baek and Jae Pil Jung, Journal of Welding and Joining, Vol.38 No.6(2020) pp576-583, https://doi.org/10.5781/JWJ.2020.38.6.8
Laser Micro Soldering and Soldering Factors, Seung Jun Hwang, Sung Vin Hwang, and Jae Pil Jung, J. Microelectron. Packag. Soc., Vol.27(3), 1-8 (2020), https://doi.org/10.6117/kmeps.2020.27.3.001
Low temperature Solder of Sn-Bi Series and its Properties, Ji Wan Kang and Jae Pil Jung, Electronics Packaging Technology, Vol.6, 41-50 (2020)
Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications, Journal of Welding and Joining, Vol. 37, Issue 2, pp 7-14, 2019.
Laser Micro-Joining and Soldering, Seung Jun Hwang, Hyejun Kang, Jeng-O Kim, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol. 26, no. 3, pp 7 β 13, 2019.
Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders, Wook Sang Jeon, Sri Harini Rajendran, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol. 26, no. 3, pp. 1 - 6, 2019.
TLP and Wire Bonding for Power Module, Hyejun Kang, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol. 26, no.4, pp 7- 13, 2019.
Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging, J.H.Lee, D.H.Jung, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 4, pp 9-15, 2018
High Technology and Latest Trends of WBG Power Semiconductors, J.H.Lee, D.H.Jung, S.J.Oh, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 4, pp 17-23, 2018
High reliability nano-reinforced solder for electronic packaging, D.H.Jung, B.G.Baek, S.H.Yim, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 2, pp 1-8, 2018
Aluminum alloys and their joining methods, D.H.Jung, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Vol 25, Issue 2, pp 9-18, 2018
Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim, Jae Pil Jung, Journal of the Microelectronics Packaging and Society, 2017
μ루미λμ λΈλ μ΄μ§κ³Ό μ리, Aluminum brazing and its principle, S.J.Lee, D.H.Jung, J.P.Jung, Journal of the Microelectronics Packaging and Society, vol.24, No.4, p.1-7, 2017
AISI 304 Steel Brazing Using A Flexible Brazing Foil Fabricated by Tape Casting Method, Ashutosh Sharma, Soon-Jae Lee, Joo-Hee Oh, Jae Pil Jung, Korean J. Met. Mater. Vol 55, pp 836-844, 2017
Fabrication of Single Capacitive type Differential pressure sensor for Differential Flow meter, Kyu-Sik Shin, Sangwoo Song, Kyungil Lee, Daesung Lee, Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 51-56, 2017
Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation, Do-hyun Jung, Myung-hwan Roh, Jun-hyeong Lee, Kyung-heum Kim, Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 17-25, 2017
Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim and Jae Pil Jung, J. Microelectron. Packag. Soc., Vol 24, pp 9-16, 2017
μ°¨μμ μ λκ³λ₯Ό μ€μ₯μ μν Single Capactive Type Differential μλ ₯ μΌμ κ°λ°, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ννμ§, March 2017, Vol 24, Issue 1, p.51-56
Recent progress in electroless plating of copper, Ashutosh Sharma, Chu-Seon Cheon, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Volume 23, Number 4, p. 1-6, 2016
Effect of various factors on the brazed joint properties in Al brazing technology, Ashutosh Sharma, Seung Hyun Lee, Hyung Oh Ban Y.S. Shin, Jae-Pil Jung, Journal of Welding and Joining, Volume 34, Number 2, p. 30-35, 2016
Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.1 - 5, 2015 (KCI)
μλμ°¨μ© νμ λͺ¨λ ν¨ν€μ§μ μ μμ¬λ₯Ό μ΄μ©ν μ ν© κΈ°μ , λ Έλͺ ν, Hiroshi Nishikawa, μ μ¬ν J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.15-23, 2015 (KCI)
3μ°¨μ μ€μ₯μ μν TSVμ Cu μ ν΄λκΈ λ° λ‘μ°μν μλ λ²ν, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.7-14, 2015 (KCI)
μλμ°¨ μ μ₯μ© λ¬΄μ° μλ κΈ°μ , J. Microelectron. Packag. Soc., Vol 22, Issue 3, p.1-7, 2015 (KCI)
Influence of Various Additional Elements in Al Based Filler Alloys for Automotive and Brazing Industry, J. of Welding and Joining, Vol. 33, Issue5, p.1-8, 2015
Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes, J. Microelectron. Packag. Soc., Vol 24, Issue 4, p.1-7, 2014 (KCI)
Plasma Electrolytic Oxidation in Surface Modification, Journal of Welding and Joining, 32κΆ, 3νΈ, p.27-33, June, 2014
κΈμκ³Ό μΈλΌλ―Ήμ μ ν©κΈ°κ΅¬μ μ ν©κ°λ, Journal of Welding and Joining, Vol.32, No.1, February, 2014
Cu μ ν΄λκΈμ μ΄μ©ν TSV μΆ©μ κΈ°μ , Journal of Welding and Joining, Vol.32, No.3, June, 2014
SiC based Technology ofr High Power Electronics and Packaging Applications, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 1-8, 2014
3μ°¨μ ν¨ν€μ§μ© TSVμ μ΄μλ ₯μ λν μ΄μ μ κΈ°μ νΉμ±, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 23-29, 2014
Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Paste, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 4, p. 1-7, 2014
3μ°¨μ ν¨ν€μ§μ ν TSVμ λ€μν Cu μΆ©μ κΈ°μ , λ Έλͺ ν,μ΄μ€ν,κΉμμ€,μ μ¬ν,κΉνν λνμ©μ μ ν©ννμ§, Vol.31 No.3(2013) pp43-50
Reflectivity and Thermal Shock Properties of Sn-3.5Ag Electroless-plated Deposit for LED Lead Frames, Seho Kee, W.J.Kim, Jae pil Jung νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ννμ§, Vol. 20, No. 2, p. 1-4, 2013
ν립칩곡μ μ λ°μμμ±λ¬Όμ΄ κ³λ©΄λ°μ λ° μ ν©νΉμ±μ΄ λ―ΈμΉλ μν₯, νμ€μ, μ μ¬ν, μ€νμ±, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol.19, No.2(63), pp.35-39, June, 2012.
ZrO2-Tiν©κΈμ νμ±κΈμ λΈλ μ΄μ§, κΈ°μΈνΈ, λ°μμ€, μ μ¬ν, κΉμμ€, λνμ©μ μ ν©ννμ§, pp.38-43, 2012.
λΈλ μ΄μ§ μ¨λ λ³νμ λ°λ₯Έ ZrO2μ Ti-6Al-4Vμ μ ν© νΉμ±, κΈ°μΈνΈ, λ°μμ€, νμꡬ, μ μ¬ν, κΉμμ€, λνμΉκ³Όλ³΄μ² ννμ§, Vol.50, No.3, pp.169-175, 2012.
μ€ν μΈλ¦¬μ€κ°μ© λΈλ μ΄μ§ ν©κΈκ³Ό λΈλ μ΄μ§ 곡μ , λνμ©μ μ ν©ννμ§,Vol.30 No.6(2012) pp501-506
3μ°¨μ μ€μ₯μ© TSV κ³ μ Cu μΆ©μ λ° Non-PR λ²ν, νμ±μ² , κΉμμ€, μ μ¬ν, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ννμ§, Vol. 18, No. 4, 2011Β
νμ±κΈμ λΈλ μ΄μ§μ μ¬μ©ν μΈλΌλ―Ήκ³Ό κΈμμ μ ν©, κΈ°μΈνΈ, νμ¦λ΄, μ μ¬ν, κΉμμ€, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol. 18, No.3(60), pp.1-7., 2011.
3μ°¨μ μ€μ₯μ μν TSVμ Cu μΆ©μ λ° Si μΉ© μ μΈ΅ κΈ°μ , λ Έλͺ ν, λ°μμ€, κΉμμ€, μ μ¬ν, λνμ©μ μ ν©ννμ§, Vol. 29, No. 3, pp. 295-300, 2011.
3μ°¨μ μΉ© ν¨ν€μ§μ μν TSVλ΄ μ λκΈμ μΆ©μ λ° non-PR λ²ν νμ±, νμ±μ² , μ΄μꡬ, λ°μ€κ·, κΉμμ€, μ μ¬ν, λνμ©μ μ ν©ννμ§, Vol. 29, No. 1, pp. 9-13, February, 2011.
κ³ μμ λ¨μνμ νμ€νλ₯Ό μν Sn3.0Ag0.5Cu μλλ³Όμ μ λ¨νΉμ±, μ λν, μ΄μκ³€, μ μ¬ν, νκ΅ λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ ννμ§, Vol. 18,, No. 1., pp. 35-39., 2011,Β
μ€ν μΈλ¦¬μ€κ°μ λΈλ μ΄μ§ νΉμ±,νμ±μ² ,κΉμμ€,μ μ¬ν, vol.29, no.6, p.40-44, λνμ©μ μ ν©ννμ§2011
3μ°¨μ μΉ© ν¨ν€μ§μ μν TSVλ΄ μ λκΈμ μΆ©μ λ° non-PR λ²ν νμ±, νμ±μ² , μ΄μꡬ, λ°μ€κ·, κΉμμ€, μ μ¬ν, λνμ©μ μ ν©ννμ§, Vol. 29, No. 1, pp. 9-13, 2011.
Copper Filling to TSV and Simplification of Bumping Process, νμ±μ€, νμ±μ² , κΉμμ€, μ μ¬ν, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol. 17, No. 3, pp. 79-84, 2010.
High Speed Cu Filling Into TSV by Pulsed Current for 3 Dimensional Chip Stacking,λνκΈμΒ·μ¬λ£ννμ§, Vol. 48, No. 7, pp. 667~673., 2010.
λ°ν κ³ μ νλΌμ¦λ§ λ§λκΈ° μ©μ μμ μ©μ μμλΆμ μ©λ½κ³Ό λ―Έμ©μ΅μ λ―ΈμΉλ μμλΈλ‘κ³Ό μν¬κΈΈμ΄μ μν₯, μΆμ©μ, νμ±μ€, μ μ¬ν, μ‘°μλͺ , λνμ©μ μ ν©ννμ§, Vol. 26, No. 2, pp.92, 2008Β
Sn-1.7Bi-Cu-0.61In μλλ§ νΉμ±μ°κ΅¬, λ°μ§νΈ, μ΄ν¬μ΄, μ μ§ν, μ μ£Όμ , μ μ¬ν λνμ©μ μ ν©ννμ§,26κΆ 5νΈ pp.475-480, 2008Β
ν립 μΉ© λ³Έλ©μ μν μλλ²ν, μ μ¬ν, μ΄ν¬μ΄, μ μ§ν, λνμ©μ μ ν©ννμ§, 26κΆ, 1νΈ, pp. 24-30, 2008Β
Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology, νμ±μ€, μ μ§ν, μ μ¬ν, λνμ©μ μ ν©ννμ§, Vol. 25, No. 2 pp.24-30, 2007
Sn-8Zn-3Bi μλμNi/Au νλ©΄μ²λ¦¬ PCB κΈ°νμ λν νΌμ§μ± μ°κ΅¬, μ΄μμ°, μ μ¬ν, μμΈμ립λνκ΅ μ°μ κΈ°μ μ°κ΅¬μλ Όλ¬Έμ§, February, 2007
Fabrication of fine Sn-Cu Solder Bump with straight wall type Formed By Electroplating, Ki-Ju Lee, Kyoo-seok Kim, Sung-Jun hong, Hee-yul Lee, Ji-Heon Jhun, In-Heo Kim, Jae-Pil Jung, The korean Institute of surface engineering, April
3D ν¨ν€μ§μ© κ΄ν΅μ κ·Ή νμ±μ κ΄ν μ°κ΅¬;κΉλκ³€, κΉμ’ μ , νμμ, μ μ¬ν, μ μμ, λ¬Έμ ν, μ μΉλΆ;λνμ©μ ννμ§ μ 24κΆ2νΈ 2006λ 4μ ,pp64-70
Viaλ₯Ό μ΄μ©ν 3μ°¨μ ν¨ν€μ§ κΈ°μ ; νμ±μ€, κΉκ·μ, λ Έλ§ μ‘°μ°, μ μ¬ν; λνμ©μ ννμ§ μ 24κΆ 2νΈ 2006λ 4μ, pp29-33
μ΄μνλ₯Ό μ΄μ©ν Sn-3.5Ag ν립칩 μ ν©λΆμ μ λ’°μ± νκ°, κΉμ λͺ¨, κΉμν, μ μ¬ν; λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol. 13, No. 1, P. 23-29. 2006 3μ
Sn-8%Zn-3%Bi μλλ§λΆμ μ₯κΈ° μ λ’°μ±κ³Ό Zn μμ λ³ν; μ μ¬ν, μ΄μμ° ;νλ©΄μ€μ₯κΈ°μ Vol.7 No.5 2006λ 5μ, pp36-41
ν¨ν€μ§ κΈ°μ κ³Ό 3μ°¨μ μ€μ₯. κΉμ λͺ¨, μ μ¬ν, κΉμν, λ°μ¬ν. λνμ©μ ννμ§, μ 23κΆ μ 2νΈ, 2005λ 4μ, PP.129~138
Sn-8 wt%Zn-3 wt%Bi무μ°μλμ μ λ’°μ±κ³Ό Znμμ ννλ³ν, μ‘°μ μ°, μ΄μμ°, κΉκ·μ, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§, κΈμμ¬λ£ννμ§ μ 43 κΆ μ 9νΈ, 2005λ 9μ
Sn-Bi λκΈ Sn-3.5%Ag μλλ₯Ό μ΄μ©ν Capacitorμ μ μ¨μλλ§, κΉλ―Έμ§, μ‘°μ μ°, κΉμν, μ μ¬ν, λνμ©μ ννμ§ μ 23κΆ μ 3νΈ, 2005λ 6μ
μ€ν μ€ νλ¦°νΈλ²μΌλ‘ μΈμν Sn-1.8Bi-0.7Cu-0.6In μλμ κ³ μ¨ μν¨ νΉμ±; μ΄μ¬μ, μ‘°μ μ°, μ΄μμ°, κΉκ·μ, μ μ£Όμ , μ μ¬ν;λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol. 12, No. 4, p.301-306, 2005
SnBiμ½ν λ Sn3.5wt%Ag μλμ μ μ‘° λ° μλλ§μ± νκ°. μ΄μ¬μ, λ°©μ νΈ, μ μ¬ν, μ€κ·ν. λν κΈμΒ·μ¬λ£ννμ§ μ 42κΆ μ 5νΈ, 2004λ 5μ
Si-waferμ νλμ€λ¦¬μ€ νλΌμ¦λ§ λ¬΄μ° μλλ§- νλΌμ¦λ§ ν΄λ¦¬λμ μν₯. λ¬Έμ€κΆ, κΉμ λͺ¨, μ μ¬ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§ Vol.11 No.1, 2004λ 3μ, p77~85
Fluxless Soldering Using Rolled Solder. λ°μ°½λ°°, μλͺ μ§, κΉμ λͺ¨, μ‘°μ μ°, νμλ―Ό, μ μ¬ν. μμΈμ립λνκ΅ μ 보기μ μ°κ΅¬μ λ Όλ¬Έμ§. 2004λ 12μ
Bonding Strength of Solder Bump in Fluxless Lead-free Soldering by Using Plasma Treatment. κΉλ―Έμ§, μλͺ μ§, κΉμ λͺ¨, μ μ¬ν. μμΈμ립λνκ΅ μ 보기μ μ°κ΅¬μ λ Όλ¬Έμ§. 2004λ 12μ
κ°ν μ½ν λκ»κ° Al λΈλ μ΄μ§μ λ―ΈμΉλ μν₯. μ΄μ¬μ, κΉλ―Έμ§, μ μ¬ν, κΉμν. μμΈμ립λνκ΅ μ°μ κΈ°μ μ°κ΅¬μ λ Όλ¬Έμ§ μ 11μ§, 2003λ 12μ, p109~112
νλ¦½μΉ©μ© Sn-Cu μ ν΄λκΈ μλλ²νμ νμ± μ°κ΅¬. μ μμ, κ°κ²½μΈ, μ μ¬ν, μ£Όμ΄ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§ Vol10 No4(29), 2003λ , p39~46
Si μ¨μ΄νΌμ UBMμΈ΅ λκΈλκ»μ λ°λ₯Έ 무νλμ€ νλΌμ¦λ§ μλλ§. λ¬Έμ€κΆ, κ°κ²½μΈ, μ΄μ¬μ, μ μ¬ν, μ£Όμ΄ν. νκ΅ νλ©΄ 곡ννμ§36κΆ μ 5νΈ, 2003λ 10μ, p373~378
λ¬΄μ° λκΈ μλμ νΉμ± μ°κ΅¬: Sn-Cu λ° Sn-Pbλ²νμ λΉκ΅. μ μμ, μ μ¬ν. νκ΅ νλ©΄ 곡ννμ§ μ 36κΆ μ 5νΈ, 2003λ 10μ, p386~392
μλμ ν©λΆμ μ λ’°μ± νκ°(I). λ°μ¬ν, κΉμμ, μ μ¬ν. λνμ©μ ννμ§ 21κΆ 3νΈ. 2003
리νλ‘μ° μλλ§κ³Ό μλλ§ μ ν κ²μ¬. μ μμ, μμΉμ, μ μ¬ν. νλ©΄μ€μ₯κΈ°μ , No.5. (2003), p43~49
μλλ§ λΆλκ³Ό 무결μ μλλ§. μ μμ, μμΉμ, μ μ¬ν. νλ©΄μ€μ₯κΈ°μ , No.4. 2003, p73~8
PCBμ μ€κ³μ μλλ§. μ μμ, μμΉμ, μ μ¬ν, νλ©΄μ€μ₯κΈ°μ , No.3. 2003, p23~30
μλλ§μ κ°μ λ° νλμ€ κ³΅μ . μ μμ, μμΉμ, μ μ¬ν. νλ©΄μ€μ₯κΈ°μ No.2, 2003, p42~48
ν립칩μ©Sn-Cu μ ν΄λκΈ μλ λ²νμ νμ± μ°κ΅¬. μ μμ, κ°κ²½μΈ, μ μ¬ν, μ£Όμ΄ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§ Vol10 No4(29), 2003λ , p39~46
Study on the fabrication of Flip Chip Lead-free Solder Bump by Electroplating. ν©ν, νμλ―Ό,κ°μΆμ,μ μ¬ν. λνκΈμ μ¬λ£ννμ§. Vol.40 No.1 2002, p77~81(p195~199)
Sn-3.5Ag μλλ²ν ν립칩μ 무νλμ€μ΄μ΄μν μ ν©. νμλ―Ό, κ°μΆμ, μ μ¬ν. λνκΈμ. μ¬λ£ννμ§ μ 40κΆ μ 6νΈ P700~705. June. 2002
Sn3.5Ag0.7Cuμλμ κ³λ©΄ μμΉμ λ°λ₯Έ κΈμκ° νν©λ¬Όκ³Ό κ°λ μ°κ΅¬. μ κ·μ, λ°μ§νΈ, μ μ¬ν. νκ΅ ν면곡ννμ§ Vol.35.No1.Feb.2002. p47~52Β
A Study on the comparison of Solderability Assessment. B.Salam, N.N. Ekere and J.P. Jung. Journal of the korean institute of Surface Engineering. Vol.35, No2. 2002. p129 ~ 137
μλ λ° μλλ§λΆμ μνκ³Ό κ²μ¬, κ°κ²½μΈ,μ μ¬ν, λ°μ¬ν,μ€μ’ ꡬ, λνμ©μ ννμ§, 20(3), 2002.6, p9-15
Sn-Ag-Xκ³ λ¬΄μ°μλλΆμ νΉμ±μ°κ΅¬(κΈ°ν λκΈμΈ΅μ λ°λ₯Έ Sn-Ag-Bi-Inμλμ μ μ νΉμ±). κΉλ¬ΈμΌ, λ¬Έμ€κΆ, μ μ¬ν. νκ΅ ν면곡ννμ§ Vol.35.No1.Feb.2002 p11~16
μ§μ λΆμκΈ°μμμ λ§μ΄ν¬λ‘ μλλ§ κΈ°μ . μ΅λͺ κΈ°, μ μ¬ν, μ΄μ°½μ΄, μμ°½μ , νλ©΄μ€μ₯Β κΈ°μ (2002). No.7, p49~56
μλ λ° μλλ§λΆμ μνκ³Ό κ²μ¬, νλ©΄ μ€μ₯κΈ°μ (2002), No.6, p49~56
λ μ΄μ κ°κ³΅κΈ°μ μ νλ‘μ μ©νν©, κΉμ μ€, μ΄μ ν, μμ , μ μ¬ν. νκ΅λ μ΄μ κ°κ³΅ννμ§. Vol. 5, No.1 pp7-12.
Sn-Ag-Xκ³ λ¬΄μ°μλ μ ν©λΆμ λ―ΈμΈμ‘°μ§ λ° μ λ¨κ°λμ κ΄ν μ°κ΅¬,κΉλ¬ΈμΌ, λ¬Έμ€κΆ, μ μ¬ν. λνμ©μ ννμ§, Vol. 20, No.2, p195-200,Β 2002.
μλλ§λΆμ κΈμνμ νΉμ± λ° κ°λ νκ°. μ΄μ¬μ, μ μ¬ν, κΉμν, λνμ©μ ννμ§, μ 20κΆμ 4νΈ, pp31~36 (2002.8μ)
u-BGAμμ Sn-Ag-Cu μλμ λκΈμΈ΅μ λ°λ₯Έ μλλ§μ± μ°κ΅¬, μ κ·μ,μ μμ,μ μ¬ν, λνμ©μ ννμ§,Β 20(6), 2002.12, 59-64
Sn-Pb곡μ μλ ν립칩μ μ ν©κ°λμ λ―ΈμΉλ νλΌμ¦λ§ μ²λ¦¬ ν¨κ³Ό. νμλ―Ό, κ°μΆμ, μ μ¬ν. λνμ©μ ννμ§, μ 20κΆ μ 4νΈ. pp92~98. (2002.8μ)
Sn-Ag-Bi-Inκ³ BGAμλλ³Όμ μλλ§ νΉμ± μ°κ΅¬. λ¬Έμ€κΆ, κΉλ¬ΈμΌ, μ μ¬ν. λνμ©μ ννμ§, μ 20κΆ μ 4νΈ pp99~103 (2002.8μ)
νλΌμ¦λ§λ₯Ό μ΄μ©ν 무νλμ€ λ¬΄μ° μλλ§μ κ΄ν μ°κ΅¬. λ¬Έμ€κΆ, κ°κ²½μΈ, μ μ¬ν, μμΈμ립λνκ΅ μ 보기μ μ°κ΅¬μ λ Όλ¬Έμ§ Vol4. Aug. 2002. pp20~23
Sn-3.5Ag μλ λ²ν ν립칩μ 무νλμ€ μ΄μ΄μν μ ν©. νμλ―Ό, κ°μΆμ, μ μ¬ν. λνκΈμ. μ¬λ£ννμ§ μ 40κΆ μ 6νΈ P700~705. June. 2002
N2 λΆμκΈ°μμ Solder μ ν©λΆμ μ μμ± λ° κ²°ν¨ νΉμ±μ κ΄ν μ°κ΅¬. μ΅λͺ κΈ°. ν©μ ν¨, μ΄μ°½λ°°, μ μ¬ν, μμ°½μ . νλ°λνκ΅ λ Όλ¬Έμ§, vol18, p347-358, 2002, 12
Arκ³Ό H2 νΌν© νλΌμ¦λ§ 리νλ‘μ°μ μν 무νλμ€μλλ²νν립칩 ν¨ν€μ§ μ μ‘°μ κ΄ν μ°κ΅¬, νμλ―Ό, κ°μΆμ, μ μ¬ν, λν κΈμμ¬λ£ννμ§, Vol.40, No10(2002), p1097~1103
Si μ¨μ΄νΌ/μλ/μ 리기νμ 무νλμ€ μ ν©μ κ΄ν μ°κ΅¬. λ°μ°½λ°°, νμλ―Ό, μ μ¬ν, N.N.Ekere, κ°μΆμ, μ€μΉμ±. λνμ©μ ννμ§. Vol. 19, No. 3, June(2001) pp. 54 to 59
ꡬ쑰μ©7000κ³ μ루미λ ν©κΈμ TIGμ©μ λΆ νΉμ± μ°κ΅¬ λ°μ±ν, λ°μ§νΈ, μ μ§ν, μμ°½μ , ν©μ νΈ, κΉλν. νλ°λνκ΅ μ°μ κ³ΌνκΈ°μ μ°κ΅¬μ. 2001. 3
μλ νμ΄μ€νΈμ μ©μ΅νμ μ°κ΅¬. κΉλ¬ΈμΌ,μλ³μ©, μ μ¬ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ννμ§. Vol.8, No.1(19)(2001), 5-11
BGAμ© Sn-3.5Ag λ³Όμ 리νλ‘μλλ§ νΉμ±. ννμ£Ό, μ μ¬ν, νλ²μ©, μ μμ, λ°μ¬μ©, κ°μΆμ. λνμ©μ ννμ§ Vol.19, No.2 (2001)
Soldering κΈ°μ΄κΈ°μ κ°μ’ (1), νλ©΄μ€μ₯κΈ°μ ,(2001)
Soldering κΈ°μ΄κΈ°μ κ°μ’ (2), νλ©΄μ€μ₯κΈ°μ ,(2001)
Soldering κΈ°μ΄κΈ°μ κ°μ’ (3), νλ©΄μ€μ₯κΈ°μ ,(2001)
Soldering κΈ°μ΄κΈ°μ κ°μ’ (4), νλ©΄μ€μ₯κΈ°μ ,(2001)
SnAgκ³ λ¬΄μ°μλμ μ°κ΅¬κ°λ°λν₯. κΉλ¬ΈμΌ,μ κ·μ,μ μ¬ν. λνμ©μ ννμ§. 19κΆ1νΈ(2001)
Sn-37%Pb μλ λ° Sn-3.5mass%Ag 무μ°μλλ₯Ό μ΄μ©ν ΞΌBGAμλμ ν©λΆμμ΄νΌλ‘μλͺ μμΈ‘. μ μμ, μ΄μ€ν, νλ²μ©, μ μΉλΆ, μ μ¬ν. λνμ©μ ννμ§, Vol. 19,No. 4, (2001)
In, Biλ₯Ό ν¨μ ν Sn-Agκ³ λ¬΄μ°μλμμλλ§μ± μ°κ΅¬. κΉλ¬ΈμΌ,λ¬Έμ€κΆ, μ μ¬ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§. Vol. 8, No. 3, p43-47. 2001
μ ν΄λκΈμ μν΄ μ μ‘°λ ν립칩μλλ²νμ νΉμ±. ν©ν, νμλ―Ό, κ°μΆμ, μ μ¬ν. λνμ©μ ννμ§, Vol. 19,No.5, 2001 pp. 520-525
λ λΈλ μ΄μ§μμ΄μλΆ μ€κ³,λ°μ§νΈ, μ μμ, μ μ¬ν. J. of Copper Technology Vol, 17 No,2. pp55-61, 2001.
λ λΈλ μ΄μ§μκ°μλ°©λ²κ³Ό κ·Έ νΉμ±, λ°μ§νΈ, μ μμ, μ μ¬ν. Journal of Copper Technology Vol. 17 No2. pp46-54, 2001
κ΅¬μ‘°μ© 7000κ³ μ루미λ ν©κΈμ TIGμ©μ λΆ νΉμ± μ°κ΅¬ λ°μ±ν, λ°μ§νΈ, μ μ§ν, μμ°½μ , ν©μ νΈ, κΉλν. νλ°λνκ΅ μ°μ κ³ΌνκΈ°μ μ°κ΅¬μ. 2001. 3
Si μ¨μ΄νΌ/μλ/μ 리기νμ 무νλμ€ μ ν©μ κ΄ν μ°κ΅¬. λ°μ°½λ°°, νμλ―Ό, μ μ¬ν, N.N.Ekere, κ°μΆμ, μ€μΉμ±. λνμ©μ ννμ§. Vol. 19, No. 3, June(2001) pp. 54 to 59
BGAμ© Sn-3.5Ag λ³Όμ 리νλ‘ μλλ§ νΉμ±. ννμ£Ό, μ μ¬ν, νλ²μ©, μ μμ, λ°μ¬μ©, κ°μΆμ. λνμ©μ ννμ§ Vol.19, No.2 (2001)
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A study on the wetting properties of UBM coated Si-wafer.λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ ννμ§, μ 7κΆ, 2νΈ, (2000)Β
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μ μ¬ν,κ°μΆμ: Ni/B/Ni νμ°μ ν©λΆμ μ‘μμμ±κΈ°κ΅¬.λνκΈμννμ§ Vol.33, No.10 (1995)Β
μ μ¬ν,κ°μΆμ: Ni/B/Niκ³μ μ‘μνμ°μ ν©κ³μ μ‘μνμ κ΄ν μ°κ΅¬.λνμ©μ ννμ§ Vol.13, No.4 (1995 ), 147-154Β
μ μ¬ν,κ°μΆμ: Rene80/B/Rene80μ‘μνμ°μ ν©λΆμ κΈ°κ³μ μ±μ§.λνμ©μ ννμ§ Vol.13, No.3 (1995) , 125-133
μ μ¬ν,κ°μΆμ: Rene80/B/Rene80κ³μ μ‘μνμ° μ ν©κ³Όμ .λνμ©μ ννμ§ Vol.13, No.2 (1995), 132-138Β
Cu/Ni/Au λκΈμΈ΅μμμ μλλ§ νΉμ±. νκ΅ν면곡ννμ§. Vol.33, No.6,(2000)
μ μ¬ν,κ°μΆμ,λ°μμ‘°,ν©μ ν¨: μΌλ³Έμμμ λΈλ μ΄μ§ κΈ°μ κ³Ό λν₯(1)-μ루미λ λΈλ μ΄μ§.λνμ©μ ννμ§ Vol.12, No.4 (1994)Β
λ°μ±ν,μ μ¬ν,μμ°½μ : 7000κ³μ΄μ μ€μ¬μΌλ‘ ν μ루미λ ν©κΈμ μ©μ νΉμ±(β ’).λνμ©μ ννμ§ Vol.12, No.3 (1994) , 41-47
λ°μ±ν,μ μ¬ν,μμ°½μ : 7000κ³μ΄μ μ€μ¬μΌλ‘ ν μ루미λ ν©κΈμ μ©μ νΉμ±(β ‘).λνμ©μ ννμ§ Vol.12, No.2 (1994) , 64-75
λ°μ±ν,μ μ¬ν,μμ°½μ : 7000κ³μ΄μ μ€μ¬μΌλ‘ ν μ루미λ ν©κΈμ μ©μ νΉμ±(β ).λνμ©μ ννμ§ Vol.12, No.1(1994) , 38-43
R.Killing,ν©μ ν¨,μ μ¬ν,λ°μμ‘°: MAGμ©μ μ 보νΈκ°μ€ μ‘°μ±λ³νμ μν μ©μ νΉμ± λ³ν λ° μκ°μ κ°.λνμ©μ ννμ§ Vol.12, No.1 (1994)Β
ννμ£Ό, μ μ¬ν, μ μμ, λ°μ¬μ©, κ°μΆμ :μ μμ°μ μμμ λ§μ΄ν¬λ‘ μλλ§ κΈ°μ , λνμ©μ ννμ§, Vol.12, No.6. (1994)
μ μ¬ν,μ΄μΆ©λ,κ°μΆμ: Bλ₯Ό μ½μ μ¬λ‘ μ¬μ©ν STS 304κ°μ λ±μ¨μκ³ νμ°μ ν©.λνκΈμννμ§ Vol.31, No.3 (1993)Β
μ΄μ°μ²,κ°μΆμ,μ μ¬ν,μ΄λ³΄μ: λ-μ€ν μΈλ μ€ κ° λΈλ μ΄μ§ μ ν©λΆμ κ³λ©΄μ‘°μ§κ³Ό μ ν©κ°λμ κ΄ν μ°κ΅¬(β ‘).νκ΅μ¬λ£ννμ§ Vol.3, No.6 (1993)Β
μ΄μ°μ²,κ°μΆμ,μ μ¬ν,μ΄λ³΄μ : TiCκ³ μ΄κ²½ν©κΈκ³Ό 304μ€ν μΈλ μ€κ°μ λΈλ μ΄μ§μ±.λνκΈμννμ§ Vol.30, No.9 (1992)
μ μ¬ν, κ°μΆμ,μ΄λ³΄μ, Rene 80 μ΄ν©κΈμ λ³΄λ‘ λν¬λ²μ μ΄μ©ν μ‘νμ λνμ°μ ν©λ²μ μ°κ΅¬, λνμ©μ ννμ§ Vol.9, No.3 (1991), 26-33
λ°μ£Όμ©, μ μ¬ν, μ΄λ³΄μ, μ©μ λ°μ΄ν° μμ€ν , λνμ©μ ννμ§ Vol.5, No.3 (1987), 1-10
μ μ¬ν,κ°ν¬μ¬.μ΄λ³΄μ,ν©μ ν¨,μν¬μ©μ μ κΈμμ΄ννμ μ°κ΅¬μ κ΄νμ¬ , λνμ©μ ννμ§ 4(1), 1986.3, 1-16
Β μ μ¬ν,μ΄λ³΄μ,μ΄μ°μ²,κ°μΆμ, κ°κ³Ό μ€ν μΈλ μ€κ° brazing λΆμ μ λ¨ κ°λμ λ―ΈμΉλ Sn, Pμ μν₯ μ°κ΅¬, λνμ©μ ννμ§ 7(3), 1989.9, p.36-43
Cuμ AISI410κ° brazingλΆμ μ λ¨κ°λμ μν₯μ λ―ΈμΉλ μΈμμ κ΄ν μ°κ΅¬, μ λ°ν΄μ곡νμ°κ΅¬, vol.2, p.53-62 (1989)
μ μ¬ν,κΉκ²½μ€,ν©μ ν¨, Self-Shielded Flux Cored Arc Weldingμ κ°μ€ λ°μμ κ° μ©μ μ΄ν νμμ λ―ΈμΉλ μν₯, λνμ©μ ννμ§ 3(1), 1985.3, 40-45
κ΅μ νμ λν λ Όλ¬Έ λ°ν
A Study on the Trend and Competitiveness of Domestic defense Semiconductor Industry, Chang Ho Kim, Il Ho Jeong, Jae Pil Jung, Suk Jae Jeong, 6th International conference on nanojoininig and microjoining (NMJ2025), Nov.17-21, 2025, Yeongju, South Korea
Microstructural Evolution and Reliability of Laser Solder Ball Jetted SAC305/ENIG Joints Subjected to Multiple Reflow Cycles, Seungchan Ga,, Deborah Bae, Junsu Kim, Jun-Kyo Seo, Ashutosh Sharma, Gi-Jung Nam, Hyun-Sik Kim, Jae Pil Jung, 6th International conference on nanojoininig and microjoining (NMJ2025), Nov.17-21, 2025, Yeongju, South Korea
Effects of Dy2O3 Nanoparticle Addition on the Mechanical and Physical Properties of SnβBi Based Solder, Junsu Kim, Jun-Kyo Seo, Ashutosh Sharma, Jae Pil Jung, Hyun-Sik Kim, 6th International conference on nanojoininig and microjoining (NMJ2025), Nov.17-21, 2025, Yeongju, South Korea
Electroplating of Copper for Through-Glass Via Filling, JunKyo Seo, Junsu Kim, Β Β Chul Hwa Jung, Ashutosh Sharma, Jae Pil Jung, Hyun-Sik Kim, 6th International conference on nanojoininig and microjoining (NMJ2025), Nov.17-21, 2025, Yeongju, South Korea
Properties of Nano-material Reinforced and Hybrid Solders for Low Temperature Soldering, 2024 International Conference on Brazing, J P Jung, H.J Kang, SH Rajendran, keynote, Diffusion Bonding and Micro-Nano Joining (BDB-MNJ 2024), Hangzhou, China, October 20 to 23, 2024Β (Conference cochair, keynote)
Effect of Nano-Particles on the Brazing Properties of Cu/Al Joint for Low Temperature Battery Bonding, J P Jung et al., invited,Β 5th International Conference onΒ Emerging Advanced Nanomaterials ICEAN 2024 The NEX, Newcastle, Australia,Β November 4-8, 2024Β
Dissimilar Brazing of Al2O3 Ceramic and Copper Using AgCu-(Sn, Ti, Zr) Interlayer, JP Jung, SH Rajendran et al., invited, CMCEE14. 14th International Conference on Ceramic Materials and Components for Energy and Environmental Systems 18β22 August 2024. Budapest Congress CenterΒ
Characteristics of Type 8 Solder Paste for Mini LED Assembly, ISMP 2023(The 21st International Symposium on Microelectronics and Packaging), 2023.11.06.,
Mechanical and Thermal properties of Insulated Solder for car electronics, ISMP 2023(The 21st International Symposium on Microelectronics and Packaging), 2023.11.06.,
Microstructure and Mechanical Properties of Nanoparticle-Reinforced Al-Si-Cu Alloys for Brazing, THERMEC 2023(International Conference on PROCESSING&MANUFACTURING OF ADVANCED MATERIALS), 2023.07.03,
Effect of Nanoparticle on Microstructure and Mechanical Properties of Aluminum Alloy for Vehicles, TANNβ23(7th International Conference of theoretical and applied nanoscience and nanotechnology), 2023.06.01., Ottawa, Canada
Ultrasonic dispersion of nanocomposite solder for microelectronic packaging, Sri Harini Rajendran, Hyejun Kang, Seong Min Seo, Jae Pil Jung, 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp. 1-4, (2022)
Al/Cu Interface analysis of ceramic nanoparticle reinforced Al brazing filler, ICCCI 2022 (7th International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials and the 57th Summer Symposium on Powder Technology), 2022.11.03., Β Fujiyoshida, The society of powder technology, Japan
Microstructure and mechanical properties of Sn-Bi solder reinforced with SnO2 nanoparticles, ICCCI 2022, 2022.11.03. Fujiyoshida, Japan
Low-temperature Sn58Bi-SiC fiber nanocomposite solder for flexible electronics, IWJC 2022(International Welding/Joining Conference), Jeju, Korea 2022.10.5 (Conference chair)
Effects of nanoparticle on Shear strength and Failure Mode of Hybrid Sn-Bi/SAC joints, Β IWJC 2022, Jeju, Korea 2022.10.5
Effect of Dispersed La2O3 Nano-particles in Sn-Ag Solder Bumps of Flip Chip Package by Electroplating, Β Β IWJC 2022, Jeju, Korea 2022.10.5
Welding Characteristics of Al-Cu Thin Plate Dissimilar Metal Welding Using Single-Mode Fiber Laser,Β IWJC 2022, Jeju, Korea 2022.10.5
Intermediate low melting temperature solder thermal cycling performance enhancement using Indium and Bismuth microalloying,Β IWJC 2022, Jeju, Korea 2022.10.5
Behavior of pull strength and fracture mode by elevated temperature condition in Bi additive solder systems,Β IWJC 2022, Jeju, Korea 2022.10.5
Adapting nanocomposite micro-solder ball process to next-gen advanced packaging, ISMP2021(The 19th International Symposium on Microelectronics and Packaging), 2021.11.03, KMEPS
Characteristics of Low-Temperature Sn-58Bi Hybrid Solder, ICAE 2021(Hybrid conference 6th International Conference on Advanced Electromaterials), 2021.11.09., KIEEME (νκ΅μ κΈ°μ μμ¬λ£νν)
Nanocomposite Sn-Ag-Cu solders for the reliable soldering technology: ZrO2-added Sn-3.5Ag-0.5Cu, IIW 2020 on-line annual assembly, 2020.7.22, International Institute of Welding
SiC reinforced Sn-Bi solder; A study on structural, mechanical and soldering characteristics, S.H.Rajendran, B,K.Baek, J.P.Jung, Int'l conf. on Materials Sci. & Eng., Dec.26-28, 2019, Kyoto, Japan
Β Microstructure and mechanical properties of Sn-Bi solder reinforced with SnO2 nanoparticles, Hye Jun Kang, J.W.Kang, Song H.Yim, J.P.Jung, Int'l conf. on Materials Sci. & Eng., Dec.26-28, 2019, Kyoto, Japan
Approaches towards rapid low temperature trasient liquid phase (TLP) bonding technologies, Β S.H.Rajendran, Hye Jun Kang, J.P.Jung, East-WJ 2019, Nov 21-23, 2019, Dagu, Korea
Transient liquid phase bonding of copper using carbon nanotube incorporated Sn-Bi and Sn-Cu solder,Β S.H.Rajendran, Hye Jun Kang, J.P.Jung, Β Int'l conf. on Materials Sci. & Eng., Dec.26-28, 2019, Kyoto, Japan
Structural and mechanical properties of Sn-Bi-Te low temperature solder, The 18th International Symposium on Microelectronics and Packaging (ISMP-EMAP 2019) , 2019.11.13.-15
Effect of graphene nanoplatelets on the mechanical properties of SAC alloy, The 18th International Symposium on Microelectronics and Packaging (ISMP-EMAP 2019) , 2019.11.13.-15
Mechanical properties of Al2O3/Cu active metal brazing for Electric Vehicle, The 18th International Symposium on Microelectronics and Packaging (ISMP-EMAP 2019) , 2019.11.13.-15
Fabrication of SiC Power Module by TLP Solders and Its Characteristics, The 18th International Symposium on Microelectronics and Packaging (ISMP-EMAP 2019) , 2019.11.13.-15
Effect of Sn-Ni Solder on TLP Joint Properties of SiC For Power Module, The 18th International Symposium on Microelectronics and Packaging (ISMP-EMAP 2019) , 2019.11.13.-15
Mechanical Properties of SiC and DBC bonding joint using Sn-Cu solder, International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT 2019), 2019.10.23-25, Taiwan
Transient liquid phase bonding of SiC to Cu using Sn-Ni solder for power module,International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT 2019), 2019.10.23-25, Taiwan
Low Temperature transient liquid phase joining for thermoelectric skutterudites junction, 4th International Conference on Nanojoining and Microjoining 2018, Nara, Japan,December, 2018
Ultra-low alpha particle solder for high density electronics packaging, key note, 4th International Conference on Nanojoining and Microjoining 2018, Nara, Japan, December, 2018
Active Brazing Properties of Alumina to Copper Joint for Electric Automobile Application, 3rd Global Summit&Expo on Materials, Photonics&Optical Instruments, November, 2018
Characteristics of Active Metal Brazed Joint of Al2O3/Cu Applicable to Electric Vehicle, Proceedings of the 2nd International Conference of Energy Harvesting, Storage, and Transfer(EHSTβ18), July, 2018
Zirconia Nanoparticle Reinforced Al-Si-Cu Alloy Based Co,posite for Low Temperature Brazing Application, Advances and Trends in Engineering Materials and their Applications, Toronto, Canada, August, 2015Β
Development of Pb-free Solder Paste for Automotive Electronics, ISMP 2015 the 14th International Symposium notice, ISMP, October, 2015
Microstructure and Sheer Strength of lead-free Solder Joint for Automotive Application, ISMP 2015 the 14th International Symposium notice, ISMP, October, 2015
Properties of Surfactant in Aluminum Brazing Flux for Automobile, ISMP 2015 the 14th International Symposium notice, October, ISMP, 2015
Influence of current density on surface morphology of electrodeposition tin coatings from acidic stannous sulphate electrolyte, 67th IIW Annual Assembly & International Conference, July, 2014Β
Electroplating of Cu in TSV and characteristics of low alpha solder bump, J.P.Jung et al,International Conference on Soldering and Reliability, May, Toronto, Canada, 2013
Active metal brazing of ZrO2 to Ti-alloy and joint properties, CAMJ international workshop on advanced materials joining and processing, Nov.1, 2013, Canada
Mechanical Properties of Weld-bonded and Resistance Spot Welded Joints for Dissimilar Materials of Mg alloy and HSLA steel, J.P.Jung et al, Intβl Weld/JoinConf, Jeju, Korea, p.80, May 2012.
A study of Acoustic Wave Sensor for Lifetime Estimation of GIS, J.P.Jung et al, International Welding/Joining Conference, Jeju, Korea, p.163, May 2012.
The reflectance of displacement deposition Sn and SnAg for LED lead frame, J.P.Jung et al, International Welding/Joining Conference, Jeju, Korea, p.310, May 2012.
A study on the Interfacial Reaction and Bond strength in Zirconia and Titanium alloy using Ag-Cu-Sn-Ti, J.P.Jung et al, International Welding/Joining Conference, Jeju, Korea, p.327, May 2012.
Sn-3.5Ag Bumping without Lithography and Si Chip Stacking, J.P.Jung et al, ECO-MATES 2011, Osaka, Japan, Vol.1, pp.155-156., November 2011
Electroplating of Eutectic Sn-Bi Bumps on Si-Chip for R2R Process, J.P.Jung et al, ECO-MATES 2011, Osaka, Japan, Vol.2, pp.223-224., November 2011
Analysis on High Speed Shear Characteristics of Sn3.0Ag0.5Cu Solder Ball, J.P.Jung et al, ECO-MATES 2011, , Osaka, Japan,Β Vol.2, pp.227-228., November 2011
High Speed Cu Filling into TSV by Electroplating for 3D Stacking of Si ChipsJ.P.Jung et al, ECO-MATES 2011, Osaka, Japan, Vol.2, pp.229-230., November 2011
Plating Characteristics of Sn3.5Ag Solder to Improve Reflectivity of LED Lead Frame, J.P.Jung et al,ECO-MATES 2011, Osaka, Japan, Vol.2, pp.283-284., November, 2011
Characteristics of Eutectic Sn-Bi Micro-bumps by Electroplating for Roll-to-Roll Processing, J.P.Jung et al, ENGE 2010, Jeju, Korea, p. 370., November, 2010.
Electroplating characteristics of eutectic Sn-Cu micro solder bump, J.P.Jung et al,ENGE 2010, Jeju, Korea,Β p. 380., November, 2010.
Fabrication and aging properties of Sn-Ag micro bumps by new non-PR process for 3D packaging, J.P.Jung et al, ENGE 2010, Jeju, Korea, p. 513., November, 2010.
Electroplating Characteristics of Sn and Sn-Ag Bumps Formed without PR for 3D Chip Stacking, J.P.Jung et al,Materials Science & Technology, Pittsburg, USA, October 2009
Non-PR Bumping and Wafer Stacking by Microsoldering for Electronics, J.P.Jung et al,Materials Science &Technology, Pittsburg, USA, 2008
Various phases formation and reliability of Sn-8Zn-3Bi solder, J.P.Jung et al,SMTA International Conference on Soldering and Reliability, April 17-19, 2007, Toronto, Canada.
Ultrasonic soldering of Si-wafer for flip chip with Sn-3.5Ag, J.S.Lee, J.P.Jung, N.Zhou, SMTA International Conference on Soldering and Reliability, April 17-19, 2007, Toronto, Canada
Reliability of Sn-8Zn-3Bi Solder Joint and Low Melting Point Phase Y. W. Lee, S. J. Hong, K. J. Lee, and J. P. Jung, IWJC2007 p.155, Seoul, Korea, May 2007
Ultrasonic Bonding of FPCB and Rigid PCB at Ambient Temperature, K.S. Kim, K.J. Lee, S.J. Hong, and J.P. Jung, IWJC2007 pp.164-165, Seoul, Korea, May 2007
Bending Fatigue Characteristic of Sn-3.5Ag Solder bump on Ni-UBM, Kyong-In Kang, Jea-Pil Jung, Woong-Ho Bang, Ji-Ho Park, K.H. Oh, IWJC2007 p.151, Seoul, Korea, May 2007
Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball, J.P.Jung et al, IWJC2007 pp.496-497, Seoul, Korea, May 2007
Formation of Metal Electrode by Electroless Plating on BLU for LCD, SeongJoon Hong, Chu SeonCheon, and Jae Pil Jung, IWJC2007 pp.502-503, Seoul, Korea, May 2007
Pb-free Solder-Bumping for Flip Chip and 3D Packaging, Jae-Pil Jung, International Workshop on Urban Environmental Science and Technology pp.64-66, December 2007
Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In Pb-free Solder by Stencil Printing, Jae-sik Lee, Young Woo Lee, Jae Pil Jung, Chu-Seon Cheon, Korea-japan Joint Symposium on Microjoining Technology, Β Busan, Korea, Aug. 29, 2006,Β
Ultrasonic Bonding of Si/SnAg/FR4 at Ambient Temperature, JM Ki, KS Kim,J.P.Jung, Korea-Japan Joint Symposium on Microjoining Technology, Busan, Korea, August 29, 2006
Environment-Friendly fluxless Soldering with lead-free solder, Jae Pil Jung, Intl Conf. on Smart Processing Technology, Vol 1,pp147-153, High Temp. Soc. Japan, Osaka, Japan, March 2006
Experimental Study of Ultrasonic Wedge Bonding with Copper Wire, 6th Intβl Conf. on Electron.Pack. Tech.Β IEEE & China Electron. Pack. Soc., Y.H. Tian,Β S. J. Won, S. H. Park, J. P. Jung, M. Mayer, Y. Zhou,Β Shenzhen, China Aug 31-Sept 2, 2005 (Philips best paper award)
Lower Temperature Soldering of Sn-3.5%Ag solder by Sn-Bi Coating, J.P.Jung et al,International Conference on Lead-free Soldering, May 24~26, 2005, Toronto, Canada
Fluxless Plasma Soldering of Pb-free Solders, J.K.Moon, J.P.Jung, Y.Zhou, K.I.Kang, J.S.Lee. Proceeding of 85th American Welding Society Annual Meeting, pp.46-47, Apr.6-8, 2004, Chicago, IL, USAΒ
Characteristics and Reliability of SnBi Coated Lead-free Solder Ball.J.S. Lee, J.P.Jung, W.H.Bang, K.H.Oh, Y.Zhou. 134th Annual meeting of TMS, Mar. 14-18, 2004, Charlotte, NC, USA
Evalution of the solerability and joint properties of a new Sn-Cu-Bi-In solder, J.P.Jung et al,ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
Analysis of Stress Relaxation Characteristic of Chilled Eutectic Sn-Pb Solder, J.P.Jung et al, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
Possibility of Partial melting soldering process with off-Eutectic Lead free solder alloys, C-S, kang, J-S, Ha, J-Y,Park, J-P,Jung, Proceedings of the international welding/joining Conference-Korea 2002, Oct, 28~30, 2002
Flux-Free Direct Chip Attachment of Flip Chip with Lead-Free Solder Bump. Choon-sik Kang, Soon-Min Hong, Jae-Pil Jung. TMS 2002 131st Annual Meeting and Exhibition.
Fluxless bonding of solder bump flip chip to glass substrate using ultrasonic wave, SM Hong, CS Kang, JP Jung, Mate 2002, Feb, Yokohama, JapanΒ
A study on Electroplating of Sn-Pb and Sn-Ag for Flip Chip Bumping Application. Hyeon Hwang, Soon-Min Hong, Choon-sik Kang, Jae-Pil Jung. TMS 2002 131st Annual Meeting and Exhibition.
The influence of intermetallic compounds on the interfacial reaction and wetting property in flip chip package, J.Ha, JP Jung, CS Kang, p34-45, Innovative Materials Processing, Hoam convention centre, Aug. 21, 2002, Seoul, Korea
Fluxless flip chip bonding of Si-wafer/bump/glass by plasma treatment. Feb. (2001). New Oleans, USA
Computer simulation of time dependent wetting behavior in the wetting balance. Feb. (2001). New Oleans,USA
Fluxless Solder Bumping in Flip Chip Package by Plasma Reflow.Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung.2001 International Symposium on Electronic Materials and Packaging(EMAP2001), Hayatt Hotel, Jeju, Korea 2001.11.19-22 IEEE-CPMT, Kaist.Advances in Electronic Materials and Packaging ,pp.139-145, 2001.
Measurement of Surface Tension and Contact Angle Using Wetting Balance with 63Sn-37Pb and 96.5Sn-3.5Ag Eutectic Solders. JAE YONG PARK, JAE PIL JUNG, HYUN JOO HAN, CHOON SIK KANG, SEUNG BOO JUNG. Y2nd Int'l Japan-Korea Symposium on Advance Eng.Β Sci., Yokohama Nat'l Univ. Conference. p.189-198, Yokohama, Japan, 2000.Nov.30-Dec.1
Oxide film at diffusion bonded interface of Al alloys, K.Ikeuchi, K.Kotani, JP Jung, F.Matsuda, The 1st Korea-Japan Joint workshop on Joining Technology,Univ. of Seoul, Korea,Β (2000. Nov.24th), p81-88
Reaction of alloying element with superficial oxide film ofΒ Al-alloys during Al-diffusion bonding. Proc. of Int'l Brazing and Soldering Conf., Amer. Weld. Soc. New Mexico, USA, Apr. (2000)
Soldering of micro-BGA and Si-wafer using Pb-free solders, Korea-japan Joint Symposium on Joining Technology, Nov.24, 2000, Univ. of Seoul, p.51-62
Improvement in Bond Strength of Diffusion-Bonded Al-Alloy Joint through Mg Addition. Keiko Kotani, Jae-Pil Jung, Kenji Ikeuchi, and Fukuhisa Matsuda :Β 5th IIW,July 19thβΌ24th, Lisbon, Portugal (1999)
Analysis of upper peak in the wetting balance curve, Jae Yong Park, Jae Pil Jung, Choon Sik Kang, Annual of TMS, Sandiago. 1999.3
Jae Yong Park, Jae Pil Jung, Choon Sik Kang, Young Eui Shin : Analysis of wetting balance test - Part1 : The Effect of Immersion Depth, 5th symposium on Microjoining and Assembly Technology in Electronics, February 4-5, Yokohama(1999)
Keiko Kotani, Jae-Pil Jung, Kenji Ikeuchi, and Fukuhisa Matsuda : Improvement in Bond Strength of Diffusion-Bonded Al-Alloy Joint through Mg Addition. 5th IIW,July 19thβΌ24th, Lisbon, Portugal (1999)
μ μμ,μ μ¬ν,Nakada,μ μΉλΆ : Stress Analysis and Life Improvement of Solder Joint in TSOP with Clad Lead Frame.4th Symposium on Microjoing and Assembly in Electronics, Japan Welding Society, .(1998 )
Keiko Kotanii,Jae Pil Jung,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Joints of Al-X(X=Si,Mn,Zn,Cu) Binary Alloys Diffusion-Bonded with Al-Mg Filler Sheet. Japan Welding Society, μΌλ³Έμ©μ ννμ κ΅λνλ Όλ¬Έμ§ No.59 256-257 (1996)
Keiko Kotanii,Jae Pil Jung,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Diffusion-Bonded Joints of Al-Ca Binary Alloys Filler Sheet. Β Japan Welding Society, μΌλ³Έμ©μ ννμ κ΅λνλ Όλ¬Έμ§ No.59 258-259 (1996)
J.P.Jung, C.S.Kang, B.Y.Lee, Liquid phase diffusion bonding of Rene80 superalloy using boron as an as insert metal, First Int'l conference on processing materials for properties, Mining & materials Processing Institute of japan and the Minerals, Metals & Materials Society (TMS), Hilton Hawaiian Village, Honolulu, Hawaii, USA, Nov. 7-10, (1993)
J.P.Jung, C.S.Kang, B.Y.Lee, Liquid phase diffusion bonding using high diffusivity- and high melting point-element as insert material, The 3rd Int'l conference on trends in welding research, ASM international & AWS, Gatlinburg, Tennessee, USA, June 1-5, (1992)
Database for welding fabrication, B.Y.Lee, J.P.Jung, E.J.Lee, B.H.Lee, 4th codata in asian, oceanic contries, 31 Jan.-2 Feb, 1991, Seoul, KoreaΒ
Brazing of copper to stainless steel using Cu-P-Sn powders, Int'l conference on new advances in welding and allied processes, p.317-320, China Inst. of Mech. Eng. and German Weld. Soc., Beijing China, May 8-10, (1991)
κ΅λ΄νμ λν λ Όλ¬Έ λ°ν
Functionalizing Sn-Bi-Ag solder with SnO2 nanoparticles promotes the microjoining of mini-LED microsystems, Jiwan Kang, Jun Ho Ku, Ashutosh Sharma, Hyun-Sik Kim, Jae Pil Jung, λνμ©μ μ ν©ννμΆκ³λν, 2025. 5. 8~9, μ¬μμμ€ν¬μ»¨λ²€μ μΌν° Β
Application of Through-Glass Via (TGV) and Low-Temperature Solder Bumping for 3D Electronics Packaging. Chul-Hwa Jung, Chaeyeon Lim, Ashutosh Sharma, Hyun-Sik Kim, Jae Pil Jung, λνμ©μ μ ν©ννμΆκ³λν, 2025. 5. 8~9, μ¬μμμ€ν¬μ»¨λ²€μ μΌν°Β
Flux-free Laser Solder Ball Jetting of SAC305/Cu-ENIG Assemblies for Reliable 3D Electronics Packaging, Seungchan Ga, Deborah Bae, Ashutosh Sharma, Gi-Jung Nam, Hyun-Sik Kim,Ji-Hoon Lee, Jae Pil Jung, λνμ©μ μ ν©ννμΆκ³λν, 2025. 5. 8~9, μ¬μμμ€ν¬μ»¨λ²€μ μΌν°
Low melting and thermal conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems, Jiwan Kang, Ashutosh Sharma, Hyun-Sik Kim, Jae Pil Jung,Β νκ΅λ§μ΄ν¬λ‘λ°μ μν¨ν€μ§νν μΆκ³λν, 2025Β
Advanced Through-Glass Via (TGV) Electro-filling and Solder Bumping for Miniaturized 3D MEMS packaging, Chul-Hwa Jung, Ashutosh Sharma, Hyun-Sik Kim , Jae Pil Jung, νκ΅λ§μ΄ν¬λ‘λ°μ μν¨ν€μ§νν μΆκ³λν, 2025Β
Joint Reliability in SAC305/Cu-ENIG Assemblies Fabricated by Laser Solder Ball Jetting, Seungchan Ga, Deborah Bae, Ashutosh Sharma, Gi-Jung Nam, Hyun-Sik Kim, Ji-Hoon Lee, Jae Pil Jung, νκ΅λ§μ΄ν¬λ‘λ°μ μν¨ν€μ§ννΒ μΆκ³λν, 2025Β
μ ν΄λκΈμ ν΅ν λλ Έμμ΄μ΄ 첨κ°μ λ°λ₯Έ FPCBμ© μ μ¨μλ λ²νμ νΉμ±, 2023.04.05., νκ΅λ§μ΄ν¬λ‘λ°μ μν¨ν€μ§νν μΆκ³λν
ZrO2 λλ Έλ³΅ν©μ²΄ SnBi λκΈμΈ΅κ³Ό SAC305 μλλ³Όμ μ¬μ©ν νμ΄λΈλ¦¬λλ²νμ νΉμ±, 2023.10.12., λνμ©μ μ ν©ννμΆκ³λν
μ ν΄λκΈμ ν΅ν λλ Έμμ΄μ΄ 첨κ°μ λ°λ₯Έ FPCBμ© SnBi λ²νμ νΉμ±, 2023.05.12., λνμ©μ μ ν©νν μΆκ³λν
μ ν΄λκΈμ ν΅ν λλ Έλ³΅ν© Sn-0.7Cu 무μ°μλμ μ μ‘° λ° νΉμ±, 2023.05.12., λνμ©μ μ ν©νν μΆκ³λν
λ§μ΄ν¬λ‘/λ―Έλ LEDμ© μ μ° κΈ°νμ μν λ―ΈμΈ μ ν©κ³Ό ν¨ν€μ§, Β 2023.05.12., λνμ©μ μ ν©νν μΆκ³λν
μλμ°¨ μ μ₯νμ© μ μ° μλμ κΈ°κ³μ νΉμ±, 2023.10.12., λνμ©μ μ ν©νν μΆκ³λν
λ€μ±λΆ νλ¬λ₯Ό μ΄μ©ν κΈμ/μΈλΌλ―Ή κ²½λ© μ ν©λΆμ κ³λ©΄ λ―ΈμΈκ΅¬μ‘° λ° μ ν©κ°λμ λν μ°κ΅¬, 2022λ λ λνμ©μ μ ν©νν μΆκ³νμ λν, 2022.05.12
Nanoparticles dispersion strategies on the reliability of BGA solder joints for 3D integration packaging, 2022λ λ λνμ©μ μ ν©νν μΆκ³νμ λν, 2022.05.12
TLP μ ν©μ μ΄μ©ν μ κΈ° μλμ°¨μ© Sn-Cu/MWCNT 볡ν©μ²΄μ Cu κ°μ IMC μμ, 2022λ λ λνμ©μ μ ν©νν μΆκ³νμ λν, 2022.05.12
μ΄μΆ©κ²© μνμ ν΅ν νλ©΄ μ€μ₯ μ μν¨ν€μ§μ© κ³ μνΈλ‘νΌ ν©κΈ μ²¨κ° SAC305μ μ λ’°μ± μ°κ΅¬, 2022λ λ λνμ©μ μ ν©νν μΆκ³νμ λν, 2022.05.12
High entropy alloy reinforced solder for Bi2Te3 thermoelectric bonding, 2022λ λ λνμ©μ μ ν©νν μΆκ³νμ λν, 2022.05.12
κ³ μ±λ₯ μ μ ν¨ν€μ§μ© ZnO λλ Έ μ μ λΆμ° SAC305 μλ νΉμ±, μΆκ³νμ λν, 2021.05.20-21, (μ¬)νκ΅λ°λ체λμ€νλ μ΄κΈ°μ νν, Jeju, Nanta hotel
λλ Έλ³΅ν© SAC305 μλμ νΉμ± λ° λ―Έλ LEDμ μ ν©, μΆκ³νμ λν, 2021.05.20., (μ¬)νκ΅λ°λ체λμ€νλ μ΄κΈ°μ νν,Β Jeju, Nanta hotel
New High Entropy Alloy (HEA) Reinforced SAC 305 Solder, μΆκ³νμ λν, 2021.05.27, λνμ©μ μ ν©νν
Nanocomposite SAC Solders for Improving Reliability of Soldering Technology, μΆκ³νμ λν, 2021.05.27, λνμ©μ μ ν©νν
ZnO Nano-particle-reinforced Sn58Bi Low Temperature Solder for Flexible Display Application, μΆκ³νμ λν, 2021.05.27, λνμ©μ μ ν©νν
Inconle X-750κ³Ό λμΌ ν©κΈ λ° μ€ν μΈλ¦¬μ€μ νμ΄λ² λ μ΄μ μ©μ λΆ λ―ΈμΈκ΅¬μ‘°μ κΈ°κ³μ νΉμ±, μΆκ³νμ λν, 2021.05.27, λνμ©μ μ ν©νν
Microstructure and Bonding Strength of Alumina/Cu Brazed Joint, μΆκ³νμ λν, 2021.11.03., νκ΅μΈλΌλ―Ήνν, μ μ£Ό
Properties of low-temperature nanocomposite Sn-58Bi-Ta2O5 solder for mini LED bonding on flexible electronics,μΆκ³νμ λν, 2021.11.11., λνμ©μ μ ν©νν
Ultrasonic-dispersed SAC 305 nanocomposite solder for mini LED bonding with high-temperature aging resistance, μΆκ³νμ λν, 2021.11.11., λνμ©μ μ ν©νν
μ κΈ°μλμ°¨ μ μ° λΆνμ© μ루미λ ν©κΈμ 곡μ 쑰건μ λ°λ₯Έ νλΌμ¦λ§ μ ν΄ μ°ν(PEO) μκ·Ήμ°ννΌλ§μ λ―ΈμΈκ΅¬μ‘°μ κΈ°κ³μ μ±μ§, μΆκ³νμ λν, 2021.11.11., λνμ©μ μ ν©νν
λ―Έλ LED λ―ΈμΈμ κ·Ή μ ν©μ μν Tb4O7 λλ Έλ³΅ν© λ¬΄μ°μλμ νΉμ±μ°κ΅¬ λ° μ λ’°μ± νκ°, μΆκ³νμ λν, 2021.11.11., λνμ©μ μ ν©νν
Flexible Electronicsμ© Sn-58Bi μ μ¨ μλ νΉμ±μ λ―ΈμΉλ W λλ Έ μ μμ μν₯, μΆκ³νμ λν, 2021.11.11., λνμ©μ μ ν©νν
μ κΈ°μλμ°¨μ© μ루미λ ν©κΈ νλΌμ¦λ§ μ ν΄ μ°ν(PEO) νΌλ§μ 곡μ 쑰건μ λ°λ₯Έ λ―ΈμΈκ΅¬μ‘° λΆμ, μμ§λμ΄λ§ μΈλΌλ―Ήμ€ μ¬ν¬μ§μ, 2021.12.02., νκ΅μΈλΌλ―Ήνν
Effect of ZrO2 nanoparticles on the aging shear strenght of SAC305 solder, μ κΈ°νμ λν λ° 6G/5G μ μ ν¨ν€μ§κΈ°μ νΉλ³ μ¬ν¬μ§μ, 2020λ 11μ 12μΌ, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν
μλμ°¨ μ μ₯μ© ZrO2 κ°ν SAC305 μλ νμ΄μ€νΈμ μν¨ μ λ¨κ°λ νΉμ±, μΆμΆκ³ ν΅ν©νμ λ°νλν, 2020.11.26-27, λνμ©μ Β·μ ν©νν
Flexible LED displayμ© κ³ μ°μ± λλ Έλ³΅ν© Sn-Bi μ μ¨μλμ κ°λ° λ° κ·Έ νΉμ±, μΆμΆκ³ ν΅ν©νμ λ°νλν, 2020.11.26-27, λνμ©μ Β·μ ν©νν
μ§κ³΅κ²μ΄μ§μ© μΈμ½λ¬κ³Ό μ΄μ€κΈμμ κ³ μΆλ ₯ λμ€ν¬ λ μ΄μ μ©μ νΉμ±, 2020.11.26-27,λνμ©μ Β·μ ν©νν
Bi ν¨λμ λ°λ₯Έ Sn-Ag-Cuκ³ μλμ μ΄μΆ©κ²© μ λ’°μ±λ³ν, μΆμΆκ³ ν΅ν©νμ λ°νλν, 2020.11.26-27,λνμ©μ Β·μ ν©νν
STD11 κΈνκ°μ μ§κ³΅μ΄μ²λ¦¬ μ΄μΈμ΄ν΄ λ° μλͺ ν₯μ μ°κ΅¬μ κΈ°μλμ°¨μ© νμλͺ¨λμ μ μ¨ TLPμ ν© νΉμ±, μΆμΆκ³ ν΅ν©νμ λ°νλν, 2020.11.26-27, λνμ©μ Β·μ ν©νν
Fabrication of SiC Power Module Using Electroplated Sn-X TLP Solders, λνμ©μ Β·μ ν©νν MPC μΆκ³νμ λν, 2019.10.01, μμΈ
Al2O3/Cu νμ±κΈμ λΈλ μ΄μ§ κ°λ°, λνμ©μ Β·μ ν©νν MPC μΆκ³νμ λν, 2019.10.01, μμΈ
Active metal brazing of Al2O3/Cu using dual active Ag-Cu-Sn-Ti-Zr filler for electric vehicles, λνμ©μ Β·μ ν©νν MPC μΆκ³νμ λν, 2019.10.01, μμΈ
λκΈλ λλ Έ κ²°μ 립μ μ μ©μ ν΅ν νμλͺ¨λμ μ μ¨ TLP μ ν©, μΆκ³νμ λν, λνμ©μ Β·μ ν©νν, 2019.11.21-22
High Power Disk Laser Welding of Inconel to Austenitic Stainless Steel, μΆκ³νμ λν, λνμ©μ Β·μ ν©νν, 2019.11.21-22
Approaches towards rapid low-temperature transient liquid phase bonding technologies for joining SiC power modules, μΆκ³νμ λν, λνμ©μ Β·μ ν©νν, 2019.11.21-22
λλ Έν μ€ν κ°ν SAC-305μλμ λ―ΈμΈμ‘°μ§κ³Ό κΈ°κ³μ νΉμ± λ° λλ Έμλμ κ°νμ΄λ‘ , μΆκ³νμ λν, λνμ©μ Β·μ ν©νν, 2019.11.21-22
μ€μ»€ν°λ£¨λ€μ΄νΈ μ ν©μ μν μ μ¨ TLP μ ν© λ°©λ² κ°λ°, 2018 μΆκ³ μ κΈ°νμ λν, April, 2018
Ag-Cu-Ge-Ti Filler Metal for Active Brazing of Al2O3 to Copper, MPC 2018 μΆκ³μ»¨νΌλ°μ€, October, 2018
Effects of Nanoparticle Addition on the Microstructure, Solderability and Tensile Characteristics of SAC Alloy, MPC 2018 μΆκ³μ»¨νΌλ°μ€, October, 2018
νμ λͺ¨λ μ ν©μ μν Cu/Sn/Cu λ³Έλ©, 2018λ λ μΆκ³ νμ λ°νλν, November, 2018
λλ ΈλΆλ§ 첨κ°μ λ°λ₯Έ SAC ν©κΈμ λ―ΈμΈμ‘°μ§, μλλ§μ± λ° μΈμ₯ νΉμ± ν₯μ, 2018λ λ μΆκ³ νμ λ°νλν, November, 2018
TWIP κ°μ μμ° μ·¨νμ λν ν©κΈ μμ, 2018 μΆκ³ νμ λ°νλν, November, 2018
μ ν΄λκΈμ μ΄μ©ν νμλͺ¨λ μ ν©μ© μ ν©μ¬ λ° μ ν©λ°©λ² κ°λ°, 2018λ λ μΆκ³ νμ λ°νλν, November, 2018
Fabrication of hard ceramic coating by plasma electrolytic oxidation from sodium silicate electrolyte, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ μ κΈ°νμ λν, April, 2017
μλμ°¨ μ μ₯λΆνμ© EMI μ μν μ°¨ν λ°λ§ μ μ‘°κΈ°μ , νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ μ κΈ°νμ λν, April, 2017
μλμ°¨ μ μνμ© μ΄λ°ν μ μν μ°¨νλ§ μ μ‘°κΈ°μ κ°λ°, 2017 KAMP μΆκ³ κ΅μ μ¬ν¬μ§μ, λ§μ΄ν¬λ‘μ μν¨ν€μ§ μ°κ΅¬μ‘°ν©(KAMP), April, 2017
μλμ°¨ μ μ₯μ© μ μν μ°¨ν Ni λκΈλ§ νΉμ± νκ°, 2017λ λ λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, April, 2017
Al-Si-Cuκ³ μ μ΅μ μ©κ°μ¬λ₯Ό μ¬μ©ν μ΄κ΅νκΈ°μ© μ루미λ λΈλ μ΄μ§μμ 첨κ°μ μ κ΄ν μ°κ΅¬, 2017λ λ μΆκ³ νμ λν, November, 2017
Al-Si-Cuκ³ μ©κ°μ¬λ₯Ό μ¬μ©ν μ μ΅μ μ루미λ λΈλ μ΄μ§μμ 첨κ°μ κ° μ ν©μ‘°μ§μ λ―ΈμΉλ μν₯, 2017λ λ λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, October, 2017
Al-Si-Cu κ³μ΄ μ μ΅μ λΈλ μ΄μ§ ν©κΈμ μ ν©μ±λ₯ κ°μ μ μν λλ Έμ²¨κ°μμ λ²μ μ μ μ κ΄ν μ€νμ μ°κ΅¬, 2015λ λ λνμ©μ Β·μ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 63κΆ, November, 2015
Effect of La2O5 nanoparticles on the braze ability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, 2015λ λ λνμ©μ Β·μ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 63κΆ, November, 2015
μλμ°¨μ°¨μ²΄μ© μμ°λκΈκ°νμ μ©μ νΉμ± λ° ν μ°κ΅¬, 2015λ λ λνμ©μ μ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 63κΆ, November, 2015
Effect of bath conditions and pulse parameters on tin surface finish for microelectronic packaging applications, 2015λ λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, November, 2015
μλμ°¨ μ μ₯νμ© λ¬΄μ° μλ νμ΄μ€νΈμ νΉμ±, μλμ°¨μ μ₯ν μ΅μ μ ν©κΈ°μ , September, 2015
μλμ°¨ μ μ₯μ© μ루미λ λΈλ μ΄μ§ νλμ€μ 첨κ°μ λ³ μ ν©νΉμ±, μλμ°¨μ μ₯ν μ΅μ μ ν©κΈ°μ , September, 2015
Effect of ZrO2 nanoparticles on the microstructure of Al-Si-Cu filler for low temperature Al brazing applications, 2015λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ νμ λν μΌμ μ§, April, 2015
Electroplated Sn finish on Cu substrates for 3D microelectronic packaging, 2015λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ νμ λν μΌμ μ§, April, 2015
μλμ°¨ μ μ₯νμ© λ¬΄μ° μλ νμ΄μ€νΈ κ°λ° λ° νΉμ±νκ°, 2015λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ νμ λν μΌμ μ§, April, 2015
λκΈμκ° λ° μ λ₯λ°λμ λ°λ₯Έ TSV λ΄ Cu μΆ©μ λ° λ‘μ°μν μλ λ²ν, 2015λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) μΆκ³ νμ λν μΌμ μ§, April, 2015
Development of Al-Si-Cu Filler Metal for Low Temperature Al-Brazing Process, 2015λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, April, 2015
μλμ°¨μ© λ¬΄μ° μλ νμ΄μ€νΈ μ μ‘° λ° νΉμ±νκ°, 2015λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, April, 2015
μ΄κ³ μ νΈλνΌμ€λ₯Ό μ΄μ©ν μΉκ³Όμ© μ§λ₯΄μ½λμ μνλνΈ κ°κ³΅ λ° νΉμ±, 2014λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν, 2014λ 4μ
TSV λ΄ Cu μ ν΄λκΈμ μ 기첨κ°μ μ ννμ μ¬μ©μ λ°λ₯Έ μΆ©μ κ±°λ, 2014λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν, 2014λ 4μ
μ루미λ λΈλ μ΄μ§μ© νλμ€μ λ€μ΄κ°λ κ³λ©΄ νμ±μ μ νΉμ±, 2014λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν, 2014λ 10μ
κ³ μλ μ루미λλ°μ νλΌμ¦λ§ μ ν΄μ°νλ₯Ό μ΄μ©ν μ°ννΌλ§ νμ±, 2014λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν, 2014λ 10μ
TSV λ΄ Cu μ ν΄λκΈμ© λκΈμ‘μ ννμ λ° μ 기첨κ°μ μ μ λ₯ννμ λ°λ₯Έ κ±°λ, 2014λ λ λνμ©μ γμ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 60κΆ, 2014λ 5μ
Electrodeposition of tin coatings from acidic sulphate bath, 2014λ λ λνμ©μ γμ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 60κΆ, 2014λ 5μ
νλΌμ¦λ§ μ ν΄μ°νλ₯Ό μ΄μ©ν μ루미λνμ μ°ννΌλ§ μ±λΆλΆμ, 2014λ λ λνμ©μ γμ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 61κΆ, 2014λ 11μ
μ루미λ λΈλ μ΄μ§ νλμ€μ© κ³λ©΄νμ±μ μ νΉμ±, 2014λ λ λνμ©μ γμ ν©νν μΆκ³νμ λ°νλν μ΄λ‘μ§, μ 61κΆ, 2014λ 11μ
3D packagingμ μν TSVμ Cu μΆ©μ κΈ°μ [Cu-filling in TSV for 3D packaging], 2014λ KMPA μΆκ³ κ΅μ μ¬ν¬μ§μ, 2014λ 4μΒ
μ΄κ³ μ νΈλνΌμ€λ₯Ό μ΄μ©ν μΉκ³Όμ© μ§λ₯΄μ½λμ μνλνΈ κ°κ³΅ λ° νΉμ±, 2014λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, 2014λ 5μ
νλΌμ¦λ§ μ ν΄μ°νμ μν κ³ μλ μ루미λλ°μ μ°ννΌλ§ νμ±, 2014λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, 2014λ 5μ
μΉκ³Όμ© νΈλνΌμ€ λ² μ΄λ§ νλ©΄μΉ¨ν λ° μ΄μ²λ¦¬μ κ΄ν μ°κ΅¬, 2014λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, 2014λ 5μ
Electrodeposition property of copper with different through silicon via pitch, 2014λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, 2014λ 5μ
μ루미λ νμ νλΌμ¦λ§ μ ν΄μ°νλ₯Ό μ΄μ©ν μ°ννΌλ§ νμ± λ° λ―ΈμΈκ΅¬μ‘° λΆμ, 2014λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§, 2014λ 11μΒ
μ루미λ μ ν©μ© νλμ€ λ΄ κ³λ©΄νμ±μ μ νΉμ± μ°κ΅¬, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν Β νμ λν μ΄λ‘μ§, 2014λ 11μ
νλΌμ¦λ§ μ ν΄μ°ν 곡μ μ μ΄μ©ν μ루미λ νμμμ μ°ννΌλ§ νμ±, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν Β νμ λν μ΄λ‘μ§, 2014λ 11μ
μ€ν μΈλ μ€ λΈλ μ΄μ§μ© μΉνκ²½ λμΌκ³ νμ΄μ€νΈμ μ μμ±κ³Ό μ ν©νΉμ±, λνμ©μ μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.58, p.153, May, 2013
Β Effect of organic additives on Cu filling and surface of TSV for three dimensional packaging(3μ°¨μ μ€μ₯μ μν TSVμ Cu μΆ©μ λ° νλ©΄μ μ 기첨κ°μ κ° λ―ΈμΉλ μν₯ ), λ Έλͺ ν, μ΄μμ¬,μ μ¬ν, νκ΅ν면곡νν νμ λ°νν μ΄λ‘μ§ 2013λ μΆκ³ p. 141Β Β
Wafer levelμμμ 3D ν¨ν€μ§μ© TSVμ κ³ μμΆ©μ , The high speed filling of TSV for 3D packaging in Wafer level packaging, Jun-Hyeong Lee Myong-Hoon Roh, Soon-Jae Lee Jae-Pil Jung Hyeong-Tea Kim, λνμ©μ νν νΉλ³κ°μ° λ° νμ λ°νλν κ°μμ§ 2013λ (2013.11), p. 151Β
μ΄μΆ©κ²© μνμ μν TSVμ Cu λμΆ λ° νλ©΄ κ±°μΉ κΈ° λ³ν, Effect of thermal shock test on Cu pumping and surface roughness,Β λ Έλͺ ν μ΄μ€ν μ μ¬ν, νκ΅ν면곡νν νμ λ°νν μ΄λ‘μ§ 2013λ μΆκ³ p. 140Β Β Β Β Β
3μ°¨μ μ€μ₯μ μν μμ§ν/κ²½μ¬ν TSVμ ν¨κ³Όμ μΈ Cu μΆ©μ λ°©λ², Effective Cu filling of straight and tapered TSV for 3-dimensional packaging,Β λ Έλͺ ν μ μ ν μ΄μ€ν μ μ¬ν κΉμμ€ κΉνν κΉμ’ λ―Ό , λνμ©μ νν νΉλ³κ°μ° λ° νμ λ°νλν κ°μμ§ 2013λ (2013,05), p. 170Β Β
3μ°¨μ ν¨ν€μ§μ© TSVμ μ΄μΆ©κ²© μνμ μν Cu λμΆκ³Ό λ―ΈμΈμ‘°μ§, Cu pop up and microstructure on TVS during thermal shock test for 3-dimensional packaging, λ Έλͺ ν μ΄μμ¬ μ μ¬ν, κΉμμ€, λνμ©μ νν νΉλ³κ°μ° λ° νμ λ°νλν κ°μμ§ 2013λ (2013,11), p. 143Β Β
3μ°¨μ μ€μ₯μ μν Si μ¨μ΄νΌ Cu μ ν΄λκΈ λ° λ‘μ°μνμλλ³Όμ μ λ’°μ± νκ°, μ λν, Kumer Santosh, μ΄μ€ν, μ μ¬ν, 2012λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν μ΄λ‘μ§, pp.196, October, 2012.
TSV(Through Silcon Via) chip μμ Sn-Cu λ²νμ μ μ‘° λ° νΉμ±, λ Έλͺ ν, λ°μμ€, λ°μ€κ·, μ μ¬ν, 2012λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν μ΄λ‘μ§, pp.196-197, October, 2012.
μ€ν μΈλ μ€ λΈλ μ΄μ§μ© μΉνκ²½ λμΌκ³ νμ΄μ€νΈμ νΉμ±, λ°μμ€, λ Έλͺ ν, λ°μ€κ·, νμ±μ€, μ€μ£Όν¬, μ μ¬ν, 2012λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν μ΄λ‘μ§, pp.304, October, 2012.
LED 리λνλ μμ© Cu νμ§λκΈμ λκΈμκ°μ λ°λ₯Έ λ°μ¬νΉμ± λ³νμ κ΄ν μ°κ΅¬, κΈ°μΈνΈ, κΉμμ€, μ μ¬ν, 2012λ λ λνκΈμγμ¬λ£νν μΆκ³νμ λν μ΄λ‘μ§, pp.304, October, 2012.
[κ°μ°]Low Alpha Lead Free Soldersμ νΉμ± νκ°, Jae Pil Jung, Santosh Kumar, Hyun Kyu Lee, Yong Cheol Chu, pp.5-41, October, 2012.
리νλ‘μ° μκ° λ³νμ λ°λ₯Έ μ ν΄λκΈ eutectic Sn-Bi μλ λ²νμ λ―ΈμΈμ‘°μ§κ³Ό μ λ¨κ°λ νΉμ±, λ Έλͺ ν, λ°μμ€, μ μ¬ν, κΉμμ€, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.181, October, 2012.
3μ°¨μ μ€μ₯μ μν Si μ¨μ΄νΌ Cu μ ν΄λκΈ λ° λ‘μ°μν μλλ³Όμ μ λ¨ νΉμ±, μ λν, Kumar Santosh, μ΄μ€ν, μ μ¬ν, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.183. October, 2012.
μ ν΄λκΈλ²μ μ΄μ©ν Si-wafer μμ Sn-58wt%Bi λ²νμ μ μ, λ°μμ€, λ Έλͺ ν, μ μ¬ν, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.185, October, 2012.
TSV(Through Silicon Via) wafer μμ Sn-Cu λ²νμ μ μ‘° λ° νΉμ±, λ°μμ€, λ Έλͺ ν, μ΄μμ¬, μ μ¬ν, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.187. October, 2012.
Cu νμ§λκΈ μκ°μ λ°λ₯Έ LED 리λνλ μμ λ°μ¬ νΉμ±, κΈ°μΈνΈ, κΉμμ€, μ μ¬ν, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.189. October, 2012.
μνμ μ μκ° μ κ±°λ κ³ μλ μ£Όμμ νΉμ±νκ°, λ°μ€κ·, λ°μμ€, κ³½μ μ±, μ μ¬ν, MPC 2012 μΆκ³ μ¬ν¬μ§μ μ΅μ λ§μ΄ν¬λ‘ μΌλ νΈλ‘λμ€ ν¨ν€μ§ κΈ°μ , pp.191, October, 2012.
LED 리λνλ μμ© Sn-3.5Ag 무μ ν΄λκΈμ μ΄ μΆ©κ²© νΉμ±μ κ΄ν μ°κ΅¬, κΈ°μΈνΈ, κΉμμ€, μ μ¬ν, 2012λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μ κΈ° νμ λν μ΄λ‘μ§, pp.45. November, 2012.
3μ°¨μ μ€μ₯μ μν TSV κ³ μμΆ©μ λ° non-PR λ²ν νμ±, λ Έλͺ ν, νμ±μ² , μ μ¬ν, κΉμμ€, 2012λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μ κΈ° νμ λν μ΄λ‘μ§, pp.46. November, 2012.
μ ν΄λκΈλ²μ μ΄μ©ν TSV(Through Silicon Via) chip μμ Sn-Cu λ²νμ νμ± λ° νΉμ±, λ°μμ€, λ Έλͺ ν, μ΄μμ¬, μ μ¬ν, 2012λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μ κΈ° νμ λν μ΄λ‘μ§, pp.47. November, 2012.
3μ°¨μ μ€μ₯μ© TSV μ ν΄λκΈ λ° λ‘μ°μν μλλ³Ό μ ν©λΆμ μ λ’°μ± νκ°, μ λν, μ΄μ€ν, μ΄νκ·, μ΄μΉμ§, μ μ¬ν, 2012λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μ κΈ° νμ λν μ΄λ‘μ§, pp.48. November, 2012.
3μ°¨μ μ€μ₯μ μν TSV μ ν΄λκΈ λ° λ‘μ°μν μλλ²νμ κ³ μμ λ¨ νΉμ±, μ λν, μ΄μ€ν, μ΄νκ·, μ΄μΉμ§, μ μ¬ν, 2012λ λ νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μ κΈ° νμ λν μ΄λ‘μ§, pp.49. November, 2012.
3μ°¨μ μ€μ₯μ© μ€λ¦¬μ½ μ¨μ΄νΌ Cu μ ν΄λκΈ λ° λ‘μ°μνμλ λ²νμ μ λ’°μ± νκ°, μ λν, μ΄μ€ν, μ μ¬ν, 2012λ λ νκ΅ν면곡νν μΆκ³μ΄ν λ° νμ λν λ Όλ¬Έμ§, pp.123, November, 2012.
μ€ν μΈλ μ€ λΈλ μ΄μ§μ μν 무λ μ± λμΌκ³μ΄ νμ΄μ€νΈμ νΉμ±, μ΄μ€ν, μ΄μμ¬, μ€μ£Όν¬, μ μ¬ν, 2012λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.57, pp.157, November, 2012.
LED 리λνλ μ λ°μ¬μ¨ ν₯μμ μν Sn-3.5Ag 무μ ν΄λκΈμ μ΄ μΆ©κ²© νΉμ± μ°κ΅¬, κΈ°μΈνΈ, κΉμμ€, μ μ¬ν, 2012λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.57. pp.170, November, 2012.
3μ°¨μ μ€μ₯μ© μ€λ¦¬μ½ μ¨μ΄νΌ Cu μ ν΄λκΈ λ° λ‘μ°μνμλ μ ν©λΆμ μ λ’°μ± νκ°, μ λν, μ΄μ€ν, μ μ¬ν, 2012λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.57, pp.171, November, 2012.
μ ν΄λκΈλ²μ μ΄μ©ν TSV(Through Silicon Via) wafer μμ Sn-Cu μλ λ²νμ νμ± λ° νΉμ±, λ°μμ€, λ Έλͺ ν, λ°μ€κ·, μ΄μμ¬, μ μ¬ν, 2012λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.57, pp.175, November, 2012.
3D packagingμ μν TSV chip μμ Cu via filling λ° Sn-Ag λ²ν νμ±, λ Έλͺ ν, λ°μμ€, μ μ¬ν, 2012λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol.57, pp.176, November, 2012.
High-speed Cu filling into TSV and non-PR Sn-Ag bump formation for 3-dimensional Chip Stacking, νμ±μ² , μ λν, λ°μμ€, μ΄μꡬ, κΉμμ€, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 55, p. 50., April, 2011.
Characteristics of MEMS anemometer sensor as passivation layer, μ κ·μ, μ΄λμ±, λ°μ€κ·, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 55, p. 55., April, 2011.
Electroplating characteristics of eutectic Sn-Cu ions for micro-solder bump on a Si chip, λ°μ€κ·, λ°μμ€, μ΄κΈ°μ£Ό, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 55, p. 56., April, 2011.
High-speed Cu filling into TSV by Elecroplating for 3-dimensional Chip Stacking, μ λν, νμ±μ² , μ΄μꡬ, λ°μ€κ·, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 55, p. 169., April, 2011.
Plating characteristics of Sn3.5Ag solder to improve reflectivity of LED lead frame, κΈ°μΈνΈ, Zengfeng Xu, κΉμμ€, μ μ¬ν, 2011λ λ νκ΅λ°λ체λμ€νλ μ΄κΈ°μ νν μΆκ³νμ λν λ Όλ¬Έμ§, p. 209., June, 2011.
A Study on the reflectivity of plated Sn for LED leadframe, Zengfeng Xu, κΈ°μΈνΈ, μ λν, μ μ¬ν, 2011λ λ νκ΅λ°λ체λμ€νλ μ΄κΈ°μ νν μΆκ³νμ λν λ Όλ¬Έμ§, p. 216., June, 2011.
Characteristics of displacement-deposited Sn-Ag alloy for LED lead frame, Xu Zengfeng, Santosh Kumar, Jae Pil Jung, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.223., October, 2011.
Sn3.0Ag0.5Cu μλλ³Όμ κ³ μμ λ¨ νΉμ±μ λν μ°κ΅¬, μ λν, Kumar Santosh, μ μ¬ν, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.224, Octoboer, 2011.
μ ν΄λκΈμ μ΄μ©ν Si-chip μμ Sn-Bi λ²ν νμ±, λ°μμ€, λ Έλͺ ν, μ΄μ°½μ°, μ μ¬ν, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.225., October, 2011.
Sn-3.5Ag μλ μ©μ΅λκΈμ μ΄μ©ν LED 리λνλ μμ λ°μ¬νΉμ± κ°μ , κΈ°μΈνΈ, Xu Zengfeng, κΉμμ€, μ μ¬ν, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.226., October, 2011.
High Speed Cu Filling into TSV for 3-dimensional Si Chip Stacking by Current Waveform control, νμ±μ² , μ λν, κΉμμ€, μ μ¬ν, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.227., October, 2011.
λ‘μ°μν κ³ μλ μ£Όμμ μ μ νΉμ±νκ°, λ°μ€κ·, λ°μμ€, κ³½μ μ±, μ μ¬ν, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.228., October, 2011.
Properties of low alpha Sn and SAC Solder for reduction of alpha radiation induced soft error in microelectronics, Santosh Kumar, Dohyun Jung, Seung Jin Lee, Jae-Pil Jung, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.229., October, 2011.
μ§λ₯΄μ½λμμ ν°νλν©κΈμ λΈλ μ΄μ§ νΉμ±, λ Έλͺ ν, λ°μμ€, μ μ¬ν, κΉμμ€, MPC 2011 μΆκ³ μ¬ν¬μ§μ λ°νμ΄λ‘, p.230., October, 2011.
κ³ μλ μ£Όμκ³μ΄ μλμ μ μνΉμ± νκ°, λ°μ€κ·, μ μ¬ν, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, pp.164-165., October, 2011.
Ag-Cu-Sn-Tiκ³ νλ¬κΈμμ μ΄μ©ν Ti-6Al-4V/ZrO2 μ ν©κ³λ©΄μ λ―ΈμΈμ‘°μ§ λΆμ, λ°μμ€, λ Έλͺ ν, μ μ¬ν, κΉμμ€, κΉμΈνΈ, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.196., October, 2011.
μ©κ°μ¬ μ’ λ₯μ λ°λ₯Έ μ§λ₯΄μ½λμμ ν°νλ ν©κΈ λΈλ μ΄μ§μ²΄μ κΈ°κ³μ νΉμ± κ³ μ°°, λ Έλͺ ν, λ°μμ€, μ μ¬ν, κΉμμ€, κΉλ³μ, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.196., October, 2011.
Ag-Cu-Sn-Tiκ³ ν©κΈ νλ¬λ₯Ό μ΄μ©ν ZrO2/Ti-6Al-4V λΈλ μ΄μ§μμ Snμ μμ΄ λ―ΈμΈκ΅¬μ‘°μ λ―ΈμΉλ μν₯, λ Έλͺ ν, λ°μμ€, μ μ¬ν, κΉμμ€, κΉμΈνΈ, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.197., October, 2011.
3μ°¨μ μ€μ₯μ© TSVμ μ ν΄λκΈμ μ΄μ©ν Cu κ³ μμΆ©μ λ° Sn-Ag non-PR λ²ν νμ±, μ λν, νμ±μ² , Kumar Santosh, λ°μ€κ·, λ°μμ€, μ μ¬ν, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.228., October, 2011.
Investigation of Structural, Electronic and Thermodynamic Properties of Silver-tin Intermetallic(Ag3Sn) from First Principal Calculation, Kumar Santosh, Jung Dohyun, Lee Hyun-Kyu, Xu Zengfeng, Jung Jaepil, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.231., October, 2011.
Solderabililty and Elastic Properties of Low Alpha Emitter Sn and SAC Alloy Solder, Kumar Santosh, Lee Hyun-Kyu, Jung Dohyun, Jung Jaepil, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, pp.231-232., October, 2011.
3μ°¨μ μ€μ₯μ© TSVμ Cu μΆ©μ λ° Bottom-up Ratioμμ κ΄κ³, νμ±μ² , μ λν, κΉμμ€, μ μ¬ν, Jung Jaepil, 2011λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, p.234., October, 2011.
νμ±κΈμμ μ΄μ©ν μ§λ₯΄μ½λμμ ν°νλ ν©κΈμ λΈλ μ΄μ§ νΉμ±, λ Έλͺ ν, μ μ¬ν, κΉμμ€, νμꡬ, κΉμΈνΈ, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 50., November, 2011.
μ 1μ리λ²μ μν μ£Όμ-μ 무μ°μλ κΈμκ°νν©λ¬Όμ κΈ°κ³μ μ±μ§ λ° μ ν© νΉμ±μ λν μ°κ΅¬, Santosh Kumar, μ λν, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 144., November, 2011.
μ€ν¬λ¦° νλ¦°ν λ²μ μ΄μ©ν 50 γκΈ μλ λ²ν νμ±, μ λν, Kumar Santosh, Ndy Ekere, Sabuj Mallik, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 146., November, 2011.
Si-chip μμ μ μ¨ μλλ§μ μν Sn-Bi λ²νμ μ μ‘° λ° νΉμ±, λ°μμ€, λ Έλͺ ν, λ°μ€κ·, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 147., November, 2011.
κ³ μλ 무μ°μλμ λ―ΈμΈμ‘°μ§ λΆμ λ° νΉμ±μ λν μ°κ΅¬, μ λν, Kumar Santosh, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 149., November, 2011.
LED 리λνλ μμ© Sn μΉν λκΈ νΉμ± λΆμ, Zenfeng Xu, Santosh Kumar, κΈ°μΈνΈ, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 150., November, 2011.
λ‘μ°μν κ³ μλ μ£Όμμ μ λ’°μ± νκ°, λ°μ€κ·, λ°μμ€, μ΄μΉμ§, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 151., November, 2011.
μ λ₯λ°λ μ‘°μ μ ν΅ν μν₯μ μΆ©μ λ°©λ²μ κ΄ν μ°κ΅¬, νμ±μ² , μ λν, λ°μμ€, κΉμμ€, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 153., November, 2011.
μ κΈ° λκΈλ²μ μ΄μ©ν non-PR Sn-3.5Ag λ²ν νμ±μ κ΄ν μ°κ΅¬, νμ±μ² , μ λν, λ°μμ€, κΉμμ€, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 154., November, 2011.
λΈλ μ΄μ§ μ¨λμ λ°λ₯Έ μ§λ₯΄μ½λμμ ν°νλ ν©κΈμ μ ν©κ³λ©΄ νΉμ±, λ Έλͺ ν, λ°μμ€, μ μ¬ν, κΉμμ€, νμꡬ, κΉμΈνΈ, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 169., November, 2011.
LED 리λνλ μ λ°μ¬μ¨ κ°μ μ μν Sn3.5Ag μλ μ©μ΅λκΈ, κΈ°μΈνΈ, Zengfeng Xu, κΉμμ€, μ μ¬ν, 2011λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν λ°ν μ΄λ‘μ§, Vol. 56., p. 170., November, 2011.
Bottom-up Filling of Cu into TSV by Current Waveform Control, νμ±μ² , μ λν, κΉμμ€, μ μ¬ν, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.10., November, 2011.
Sn-3.5Ag μλ λκΈμ μ΄μ©ν LED 리λνλ μμ λ°μ¬μ¨, κΈ°μΈνΈ, νμ¦λ΄, κΉμμ€, μ μ¬ν, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.22., November, 2011
Electroplating of near-eutectic Sn-Bi micro bumps on Si-Chip, λ°μμ€, λ Έλͺ ν, λ°μ€κ·, μ μ¬ν, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.29., November, 2011.
Comparative Analysis on Mechanical Properties and Microstructures of Low Alpha Lead-free Solder, μ λν, Kumar santosh, μ μ¬ν, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.33., November, 2011
Study of Fracture Behavior of SAC-305 solder joint under High Speed Shear Test, Santosh Kumar, Dohyun Jung, Jaepil Jung, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.35., November, 2011
Reliability test of high purity Sn reduced alpha particle, λ°μ€κ·, λ°μμ€, κ³½μ μ±, μ μ¬ν, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.44., November, 2011.
Micro structure analysis of displacement deposited Sn for LED lead frame, Zengfeng Xu, Santosh Kumar, Seho Kee, Jaepil Jung, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.48., November, 2011.
Study of Properties of Intermetallic Compound Cu6Sn5 in Lead free solder by First Principles Method, Santosh Kumar, Xu Zengfeng, Dohyun Jung, Jaepil Jung, 2011λ λ νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν μ κΈ° νμ λν μ΄λ‘μ§, p.49., November, 2011
UBMμΈ΅ λ° μ λ¨μλμ λ°λ₯Έ Sn3.0Ag0.5Cu μλλ³Όμ κ³ μμ λ¨νΉμ±, μ λν, Kumar Santosh, λ°λ―Έμ§, μ μ¬ν, 2011λ λ μ 1ν νκ΅κ΄μ μνν νμ λν, November, 2011
The optical properties and solderability of displacement deposition SnAg for LED lead frame, Zengfeng Xu, Santosh Kumar, μ€μΈλ―Έ, μ μ¬ν, κΉκ²½κ΅, 2011λ λ μ 1ν νκ΅κ΄μ μνν νμ λν, November, 2011
LED 리λ νλ μμ λ°μ¬ νΉμ± κ°μ μ μν Sn-3.5Ag μλμ μ©μ΅λκΈ, κΈ°μΈνΈ, Zengfeng Xu, κΉμμ€, μ μ¬ν, 2011λ λ μ 1ν νκ΅κ΄μ μνν νμ λν, November, 2011
3μ°¨μ TSV κ³ μ Cu μΆ©μ λ° 3μ°¨μ μ μΈ΅ μ€μ₯, μ μ¬ν, 2010λ KMJA μΆκ³ μ¬ν¬μ§μ, April, 2010.
Fabrication of 30~50um Sn-3.5wt%Ag bump on Si wafer, μ΄μꡬ, λ°μ€κ·, μ μ¬ν, 2010λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol. 53, p. 108., May, 2010.
The Characteristics of stacked Si-wafer by eutectic Sn-Ag solder; λ°μ€κ·, μ΄μꡬ, μ μ¬ν, 2010λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol. 53, p. 109., May, 2010.
Characteristics of Sn-Bi Micro-bumps fabricated using Electroplating for Roll-to-Roll Processing: Myung Hoon Roh, Jae-Pil Jung, woojoong Kim, Junkyu Park, Chang-Woo Lee, 2010λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, November, 2010.
Fabrication of an Electroplate Sn Bump without Photoresist Mould and Si Dice Stacking for 3D Packaging, νμ±μ² , λ°μ€κ·, μ μ¬ν, κΉμμ€, 2010λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, November, 2010.
3-D packageλ₯Ό μν Si-wafer-via μμ Sn-3.5Ag λ²ν νμ±, μ΄μꡬ, 2010λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, November, 2010.
3μ°¨μ ν¨ν€μ§λ₯Ό μν μ ν΄λκΈ μ΄λ―ΈμΈ Sn bump νμ±, λ°μ€κ·, μ΄μꡬ, μ μ¬ν, 2010λ λ λνκΈμΒ·μ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§, November, 2010.
Fabrication of Low-melting Sn-Bi Micro Solder Bump by Electroplating for R2R Processing, μ μ¬ν, λ Έλͺ ν, λ°μ€κ·, μ΄μ°½μ°, 2010λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol. 54, p. 39., November, 2010.
Reliability of 3D stacked Si chips using TSV, λ°μ€κ·, νμ±μ² , μ΄μꡬ, μ μ¬ν, 2010λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol. 54, p. 168., November, 2010.
High Speed Cu Filling into TSV for 3-dimensional Chip Stacking, νμ±μ² , λ°μ€κ·, κΉμμ€, μ μ¬ν, 2010λ λ λνμ©μ Β·μ ν©νν μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol. 54, p. 226., November, 2010.
Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process, νμ±μ€, νμ±μ² , κΉμμ€, μ μ¬ν, λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§, Vol. 17, No. 3, pp. 79-84., September, 2010.
νλ¦½μΉ©μ© 20γκΈ λ―ΈμΈνΌμΉμμμ μ λ¨μν λ° μΈλν μΆ©μ§, Hee-Yul Lee, Young-Gon Lee, In-Rak Kim, Hyung-Il Choi, Wang-Gu Lee and Jae-Pil Jung, λνκΈμ,μ¬λ£νν μΆκ³νμ λ°νλν, 2009, 4μ
3D packagingμ μν κ²½μ¬λ²½μ κ°λ Via ν νμ±μ°κ΅¬, In-Rak Kim, Hee-Yul Lee, Young-Gon Lee, Wang-Gu Lee, Hyung-Il Choi and Jae-Pil Jung, λνκΈμ,μ¬λ£νν μΆκ³νμ λ°νλν, 2009, 4μ
3μ°¨μ μ€μ₯μ μν Cu μΆ©μ λ°©λ² μ°κ΅¬, Young-Gon Lee, In-Rak Kim, Hee-Yul Lee, Hyung-Il Choi, Wang-Gu Lee and Jae-Pil Jung, λνκΈμ,μ¬λ£νν μΆκ³νμ λ°νλν, 2009, 4μ
Effect of the pad geometry to high-speed shear strength, In-Rak Kim, Hee-Yul Lee, Young-Gon Lee, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, λν μ©μ νν μΆκ³νμ λ°νλν, 2009, 5μ
Study of high speed shear test for SnAgCu solder ball joint with variable UBM, Young-Gon Lee, In-Rak Kim, Hee-Yul Lee, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, λν μ©μ νν μΆκ³νμ λ°νλν, 2009, 5μ
Study of high speed shear test for SnAgCu solder joint with variable pad finishes, Young-Gon Lee, In-Rak Kim, Wang-Gu Lee, Jae-Hyun Park, Jung-Tak Mun and Jae-Pil Jung, νκ΅ν면곡νν μΆκ³νμ λν, 2009, 5μ
Fabrication of tapered Via hole on Si wafer for non-defect Cu filling In-Rak Kim, Young-Gon Lee, Wang-Gu Lee and Jae-Pil Jung, νκ΅ν면곡νν μΆκ³νμ λν, 2009, 5μ
Sn-3.0wt%Ag-0.5wt%Cu μλ λ³Ό μ ν©λΆμ κ³ μμ λ¨νΉμ±, Young-Gon Lee, Hee-Yul Lee, Jeong-Tak Moon, Jae-Hyun Park, Shin-Shik Han and Jae-Pil Jung, λνκΈμ_μ¬λ£ννμ§, Vol.47, No.9, September 2009
Study of Cu filling characteristic on Silicon wafer via according to seed layer, κΉμΈλ½, μ΄μꡬ, μ΄μκ³€, μ μ¬ν, 2009λ λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§. p-20, pp.171 october 2009
Effect of high speed shear test for Sn-1.0wt%Ag-0.5wt%Cu solder joint with ENIG, ENEPIG and finishes, μ΄μκ³€, κΉμΈλ½, μ΄μꡬ, λ°μ€κ·, μ보μ, λ°μ¬ν, λ¬Έμ ν, μ μ¬ν, 2009λ λ νκ΅ν면곡νν μΆκ³νμ λν λ Όλ¬Έμ§. p-26, pp.179 october 2009
μ€ν¬λ¦° μΈμλ²μ μν Si-wafer μμ SAC305 μλλ²ν νμ±μ°κ΅¬, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, λ°μ€κ·, μ μ¬ν, 2009λ λ λνκΈμμ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§ P02-35, pp.163 october, 2009
Si-wafer via μμ seedμΈ΅ μ’ λ₯μ λ°λ₯Έ CuμΆ©μ νΉμ±μ°κ΅¬, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, λ°μ€κ·. μ μ¬ν, 2009λ λ λνκΈμμ¬λ£νν μΆκ³ νμ λνμ΄λ‘μ§ P02-37, pp.164 october, 2009
λΉμ€λ¬΄μ€λ₯Ό κΈ°λ°μΌλ‘ ν λ°λ체 λ΄λΆ μ κ·Ήμ© λ¬΄μ°μλμ λν μ°κ΅¬, λ°μ€κ·, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, μ μ¬ν, 2009λ λ λνκΈμμ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§ P02-41, pp.165 october, 2009
ENEPIG νλ©΄ μ²λ¦¬ν Sn-1.0wt%Ag-0.5wt%Cu μλ μ ν©λΆμ κ³ μμ λ¨κ°λ μ°κ΅¬, μ΄μκ³€, κΉμΈλ½, μ΄μꡬ, λ°μ€κ·, λ°μ¬ν, λ¬Έμ ν, μ μ¬ν, 2009λ λ λνκΈμμ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§ P02-44, pp.166 october, 2009
ENEPIG νλ©΄ μ²λ¦¬ν Sn-3.0wt%Ag-0.5Wt%Cu μλ λ³Ό μ ν©λΆμ κ³ μ μ λ¨κ°λ μ°κ΅¬, μ΄μꡬ, μ΄μκ³€, κΉμΈλ½, λ°μ€κ·, μ μ¬ν, μ보μ, λ°μ¬ν, λ¬Έμ ν, 2009λ λ λνκΈμμ¬λ£νν μΆκ³ νμ λν μ΄λ‘μ§ P02-46, pp.167 october, 2009
Development of Sn solder for LCD target manufacture, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, κΉμμ£Ό, κΉλ³λ―Ό, μ μ¬ν, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν 2009λ λ μΆκ³ νμ λν μ΄λ‘μ§, pp.36 November, 2009
Fabrication of 70um Sized Solder Bump by Paste Printing, κΉμΈλ½, μ΄μꡬ, Sabuj Mallik, Ndy Ekere, κΉμ² ν¬, μΆμ©μ² , μ μ¬ν, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν 2009λ λ μΆκ³ νμ λν μ΄λ‘μ§, pp.37 November, 2009
Study on characteristic of the speed shear test for SnAgCu solder ball, μ΄μꡬ, μ΄μκ³€, κΉμΈλ½, μ μ¬ν, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν 2009λ λ μΆκ³ νμ λν μ΄λ‘μ§, pp.44 November, 2009
Development of Non-PR Electroplating Bump Tech for 3D Dimensional Stacking, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, λ°μ€κ·, μ μ¬ν, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν 2009λ λ μΆκ³ νμ λν μ΄λ‘μ§, pp.54 November, 2009
Study on Laser drilling method for Si-wafer via formation, κΉμ μ€, μ λμ, μμ , μ΄μꡬ, μ μ¬ν, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν 2009λ λ μΆκ³ νμ λν μ΄λ‘μ§, pp.36 November, 2009
3μ°¨μ μ€μ₯μ μν wafer level μ΄λ―ΈμΈ μμ¬ λ° TSV κ³ μμΆ©μ , Jae Pil Jung, Micro-Joining & Packaging Committee 2009μΆκ³μ¬ν¬μ§μ, pp.133 October, 2009
Study on high speed shear characteristics of Lead free solder ball for mechanical reliability test, μ΄μꡬ, μ΄μκ³€, κΉμΈλ½, μ μ¬ν, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.178, November 2009
Fabrication of Sn-58wt%Bi Deposit Layer for Flexible Packaging, μ΄μκ³€, κΉμΈλ½, μ΄μꡬ, λ°μ€κ·, μ΄μ°½μ°, μ μ¬ν, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.180, November 2009
Study of High Speed Cu-Bi Filling on Si-via for Three Dimensional Packaging, μ΄μκ³€, κΉμΈλ½, μ΄μꡬ, μ μ¬νΌ, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.181, November 2009
Development of filler metal and bonding technique for LCD sputtering target, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, κΉμμ£Ό, κΉλ³λ―Ό, μ μ¬ν, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.182, November 2009
Study of Cu-Ni alloy filling on TSV for three dimensional packaging, κΉμΈλ½, μ΄μκ³€, μ΄μꡬ, μ μ¬ν, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.183, November 2009
Development of High Temperature Lead-free Solder, λ°μ€κ·, μ΄μκ³€, κΉμΈλ½, μ΄μꡬ, μ μ¬ν, λνμ©μ μ ννν 2009λ λ μΆκ³ νμ λ°νλν μ΄λ‘μ§, Vol52, pp.187, November 2009
μ ν΄λκΈκ³Ό κΈμμΉνμ μ΄μ©ν Sn-Ag μλμΈ΅μ νμ±, μ μ§ν, μ΄ν¬μ΄, μ΄μκ³€, μ μ¬ν, νμ μ, λνκΈμμ¬λ£νν, 2008
λκΈλ²μ μν Flip Chip μ© Sn-Cu μ΄λ―ΈμΈ λ²νμ νμ±, μ΄ν¬μ΄, μ μ§ν, κΉμΈλ½, μ μ¬ν, κΉμΈν, λνκΈμμ¬λ£νν, 2008
νλ¦½μΉ©μ© Sn-Cu μ΄λ―ΈμΈ λ²νμ νμ± νΉμ± μ°κ΅¬, μ΄ν¬μ΄, κΉμΈλ½, μ μ§ν, μ μ¬ν, λνμ©μ μ ν©νν, 2008
3D packagingμ μν Via ν νμ±μ°κ΅¬, μ μ§ν, κΉμΈλ½, μ΄ν¬μ΄, μ μ¬ν, λνμ©μ μ ν©νν, 2008
ν립 μΉ© λ³Έλ©μ μν μλ λ²ν, μ μ¬ν, μ΄ν¬μ΄, μ μ§ν, λνμ©μ μ ν©νν, μ 26κΆ, μ 1νΈ, pp. 24-30, 2008
Sn-1.7Bi-Cu-0.61In μλλ§ νΉμ±μ°κ΅¬, λ°μ§νΈ, μ΄ν¬μ΄, μ μ§ν, μ μ£Όμ , μ μ¬ν λνμ©μ μ ν©νν μ 26κΆ 5νΈ pp.475-480, 2008
μ μλΆνμ μ΄μν μ ν©, μ μ¬ν, 2008λ λ μΆκ³ νμ λ°νλν κ°μ°, pp.7-9, 2008
Sn/Sn-Agκ³ μ ν΄λκΈ λ²νλ₯Ό μ΄μ©ν Si-Waferμ μ μΈ΅ μ€μ₯, μ μ§ν, κΉμΈλ½, μ΄ν¬μ΄, μ΄μκ³€, μ μ¬ν, 2008λ λ μΆκ³νμ λ°νλν, pp.13, 2008
νλ¦½μΉ©μ© 10umκΈ Sn-Cu μ ν΄λκΈ λ²ννμ±, μ΄ν¬μ΄, μ μ§ν, μ΄μκ³€, κΉμΈλ½, μ μ¬ν, 2008λ λ μΆκ³νμ λ°νλν, pp.24, 2008
3-D packageλ₯Ό μν Si-via μμ Sn-3.5Ag λ²ν νμ±, κΉμΈλ½, μ μ§ν, μ΄ν¬μ΄, μ΄μκ³€, μ μ¬ν, 2008λ λ μΆκ³νμ λ°νλν pp. 174, 2008
Sn-3.0Ag-0.5Cu μλ λ³Όμ κ³ μ μ λ¨ κ°λ μ°κ΅¬, μ΄μκ³€, μ΄ν¬μ΄, μ μ§ν,κΉμΈλ½, μ μ¬ν, 2008λ λ μΆκ³νμ λ°νλν pp. 175, 2008
μ λ¨ νμ λμ΄κ° κ³ μμ λ¨μνμ λ―ΈμΉλ μν₯ , μ΄μκ³€,κΉμ λͺ¨, μ΄ν¬μ΄, λ°μ¬ν, λ¬Έμ ν, μ λ³μ±, μ΄μ¬ν₯, μ μ¬ν, 2008λ λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, pp.181 , 2008
μ λ¨μλκ° κ³ μμ λ¨ μνμ λ―ΈμΉλ μν₯, μ΄ν¬μ΄, μ΄μκ³€, κΉμ λͺ¨, λ°μ¬ν, λ¬Έμ ν,μ λ³μ±, μ΄μ¬ν₯, μ μ¬ν, 2008λ λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, pp.181, 2008
3μ°¨μ μ€μ₯μμ TSVμμ νμ±λ Snb λ²νμ μ λ¨κ°λ νκ°, μ μ§ν, κΉμΈλ½, κΉμ λͺ¨, μ μ¬ν, 2008λ λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, pp.192, 2008
3μ°¨μ μ€μ₯μμ μ ν΄λκΈμ μν Sn-3.5Ag λ―ΈμΈλ²νμ νμ±, κΉμΈλ½, μ μ§ν, κΉμ λͺ¨, μ μ¬ν, 2008λ λ λνκΈμ μ¬λ£νν μΆκ³νμ λν, pp.192, 2008
λ°ν κ³ μ νλΌμ¦λ§ λ§λκΈ° μ©μ μμ μ©μ μμλΆμ μ©λ½κ³Ό λ―Έμ©μ΅μ λ―ΈμΉλ μμλΈλ‘κ³Ό μν¬κΈΈμ΄μ μν₯, μΆμ©μ, νμ±μ€, μ μ¬ν, μ‘°μλͺ , Journal of KWJS, Vol. 26, No. 2, pp.92, April, 2008
Study of through hole formation and electroconductive material filling for three dimensional stack packaging, Sung-Jun Hong, Ki-Ju Lee, and Jae-Pil Jung, Korean Society of Machine Tool Engineers, KSMTE spring conference2007 pp42-47, May
3-Diemensional Stack Packaging -Direct Bumping without PR-, Sung-Jun Hong, Jae-Pil Jung (Univ. of Seoul, Korea), KWJS, MPC2007, Octorber
Non-PR direct bumping for 3D wafer stacking, Ji-Heon Jhun, Sung-Jun Hong, Ki-Ju Lee, Hee-Yul Lee, Jae-Pil Jung (Univ. of Seoul, Korea), IMAPS-Korea, 2007 Fall Meeting Abstracts p.55, Octorber
The effect of clamping condition on melting efficiency of high speed plasma arc welding for EGI sheet, Sung-Jun Hong, Jae-Pil Jung, Young-Duk Moon, Sang-Myoung Jho, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 88-90, Octorber
Fabrication of fine Sn-0.7wt%Cu Solder Bump Formed by Electroplating, Ki-Ju Lee, Hee-Yul Lee, Ji-Heon Jhun, In-Hoe Kim, Jae-Pil Jung, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 227-228, Octorber
Non-PR direct bumping for 3D wafer stacking, Ji-Heon Jhun, Sung-Jun Hong, Ki-Ju Lee, Hee-Yul Lee, Jae-Pil Jung, KWJS, Proceeding of the 2007 Autumn Annual Meeting of Korean Welding and Joining Society Vol. 48 pp. 229-231, Octorber
FPCB / Rigid PCBμ μ΄μν μ ν© νΉμ±. κΉκ·μ μ΄μμ°, νμ±μ€, μ΄κΈ°μ£Ό, μ μ¬ν, νκ΅ λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ νν 2006 μΆκ³ κΈ°μ μ¬ν¬μ§μ
FPCBμ PCB μ μμ¨ μ΄μν μ ν©, κΉκ·μ, μ΄μμ°, νμ±μ€, μ΄κΈ°μ£Ό , μ μ¬ν, 2006 λν μ©μ νν μΆκ³νμ λ°νλν, 10μ
κ΅μ°Β·μΈμ° Sn-8Wt%Zn-3Wt%Bi μλ νμ΄μ€νΈλ₯Ό μ΄μ©ν 1608μΉ© μ ν©λΆμ μ΄μΆ©κ²© μ λ’°μ± νκ°; μ΄κΈ°μ£Ό, μ΄μμ°, νμ±μ€, κΉκ·μ, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό; λν μ©μ νν μΆκ³ νμ λν λ°ν, 2006λ 5μ
Au λκΈμΈ΅ λκ»μ λ°λ₯Έ Sn-8Zn-3Bi μλμ νΌμ§μ± μ°κ΅¬; μ΄μμ°, κΉκ·μ, νμ±μ€, μ΄κΈ°μ£Ό, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό; λν μ©μ νν μΆκ³ νμ λν λ°ν, 2006λ 5μ
3μ°¨μ μ€μ₯μ μν Si-waferμ via hole λ₯ν μΆ©μ ; νμ±μ€, μ΄μμ°, κΉκ·μ, μ΄κΈ°μ£Ό, κΉμ μ€, λ°μ§νΈ, μ μ¬ν; λν μ©μ νν μΆκ³ νμ λν λ°ν, 2006λ 5μ
κ΅μ°Β·μΈμ° Sn-8Wt%Zn-3Wt%Bi μλ νμ΄μ€νΈλ₯Ό μ΄μ©ν QFP μλ μ ν©λΆμ μ΄μΆ©κ²© μ λ’°μ± νκ°; κΉκ·μ, μ΄μμ°, νμ±μ€, μ΄κΈ°μ£Ό, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό; λν μ©μ νν μΆκ³ νμ λν λ°ν, 2006λ 5μ
Ultrasonicμ μ΄μ©ν 3μ°¨μ μ μΈ΅μ€μ₯; νμ±μ€, κΉκ·μ, μ΄μμ°, μ΄κΈ°μ£Ό, μ μ¬ν; λνκΈμνν μΆκ³νμ λ°νλν, 2006, 4μ
Sn-8Zn-3Bi μλμ Ni/Au νλ©΄μ²λ¦¬ PCB κΈ°νμ λν νΌμ§μ± μ°κ΅¬; μ΄μμ°, κΉκ·μ, νμ±μ€, μ΄κΈ°μ£Ό, μ μ¬ν; λνκΈμνν μΆκ³νμ λ°νλν, 2006λ 4μ
3D ν¨ν€μ§μ© κ΄ν΅μ κ·Ή νμ±μ κ΄ν μ°κ΅¬;κΉλκ³€, κΉμ’ μ , νμμ, μ μ¬ν, μ μμ, λ¬Έμ ν, μ μΉλΆ ;λνμ©μ ννμ§ μ 24κΆ2νΈ 2006λ 4μ ,pp64-70
Viaλ₯Ό μ΄μ©ν 3μ°¨μ ν¨ν€μ§ κΈ°μ ; νμ±μ€, κΉκ·μ, λ Έλ§ μ‘°μ°, μ μ¬ν; λνμ©μ ννμ§ μ 24κΆ 2νΈ 2006λ 4μ, pp29-33
Sn8Zn3Bi μλλ₯Ό μ΄μ©ν 1608 μΉ© μλλ§λΆμ μ΄μΆ©κ²© μ λ’°μ± νκ°, μ΄μμ°, κΉκ·μ, νμ±μ€, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§, λνμ©μ νν μΆκ³ νμ λ°νλν, 2005λ 11μ
νκ΄΄μνλ²μ μν μλ λ²νμ μ λ¨νκ΄΄μμμ κ³λ©΄νκ΄΄ ν΄μ, κ°μν, λ°©μ νΈ, μ€κ·ν, μ μ¬ν, MPC μΆκ³μ¬ν¬μ§μ, μμΈμ립λ, 2005.10.14
Sn-3.5Ag μλλ₯Ό μ΄μ©ν Si-μ¨μ΄νΌμ μ΄μν μ ν©λΆμ μ λ¨κ°λ, κΉκ·μ, νμ±μ€, μ΄μμ°, μ‘°μ μ°, κΉμ λͺ¨, μ μ¬ν, λνκΈμμ¬λ£νν μΆκ³νμ λν, 2005λ 10μ
Sn-8Zn-3Bi μλλ₯Ό μ΄μ©ν 1608μΉ¨μ κ°λ νκ°, μ΄μμ°, κΉκ·μ, μ‘°μ μ°, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§, λνκΈμμ¬λ£νν μΆκ³νμ λν, 2005λ 10μ
Si-Wafer μ FR-4 κΈ°νμ μ΄μν μ ν©λΆμ λ―ΈμΈμ‘°μ§ κ΄μ°°, νμ±μ€, κΉκ·μ, κΉμ λͺ¨, μ΄μμ°, μ μ¬ν, μ‘°μ μ°, λνκΈμμ¬λ£νν μΆκ³νμ λν, 2005λ 10μ
Bonding Mechanism of Ultrasonic Gold Ball Bonds on Copper Substrate at Ambient Temperature, L. Lum, S. Y. Cho, Y, Zhou, J. P. Jung, λν κΈμμ¬λ£νν μΆκ³νμ λν, 2005λ 10μ
Sn-8mass%Zn-3mass%Bi λ¬΄μ° μλμ μ λ’°μ±κ³Ό Znμ κ±°λ, μ‘°μ μ°, μ΄μμ°, κΉκ·μ, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§, λνμ©μ νν μΆκ³ νμ λ°ν λν, 2005λ 6μ
Characteristic of copper wire wedge bonding, μ μ¬ν, μ‘°μ μ°, Y.Tian, Y. Zhou, M. Mayer, μμ±μ€, μ΄μ±μ€, λνμ©μ νν μΆκ³νμ λ°νλν, 2005λ 6μ
Sn-3.5Ag λ¬΄μ° μλλ₯Ό μ΄μ©ν Si-waferμ FR-4 κΈ°νμ μμ¨μ ν©, κΉμ λͺ¨, μ‘°μ μ°, κΉκ·μ, μ΄μμ°, μ μ¬ν, λνμ©μ νν μΆκ³νμ λ°νλν, 2005λ 6μ
QFP 리λμ λκΈ μ’ λ₯μ λ°λ₯Έ μλλ§λΆ μ΄μΆ©κ²© νΉμ±. μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§. νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μΆκ³ κΈ°μ μ¬ν¬μ§μ, 2004λ 11μ
Sn-3.5Agκ³ μλμ μ μ¨ μλλ§ μ°κ΅¬. κΉλ―Έμ§, μ΄μ¬μ, μ μ¬ν. νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μΆκ³ κΈ°μ μ¬ν¬μ§μ, 2004λ 11μ
Sn-8Zn-3Bi μλμ μ λ’°μ± νκ° λ° Znμμ κ±°λ. μ‘°μ μ°, μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§. νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν μΆκ³ κΈ°μ μ¬ν¬μ§μ, 2004λ 11μ
Sn3Ag0.5Cu μλλ₯Ό μ΄μ©ν QFP μλλ§λΆμ μ΄μΆ©κ²© μ λ’°μ± νκ°. μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§. λν μ©μ νν μΆκ³ νμ λ°νλν, 2004λ 11μ
κΈ°ν μ²λ¦¬μ λ°λ₯Έ μ μ¨κ³ μλ(Sn-8Zn-3Bi) μ ν©λΆμ κ°λ νκ°, μ‘°μ μ°, μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, κΉλ―Έμ§. λν κΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 10μ
μ μ΅μ μλ(Sn-8Zn-3Bi)μ κ° PCB λκΈκ°μ μλ μ ν©μ μ΄μΆ©κ²©μ΄ λ―ΈμΉλ μν₯. μλͺ μ§, μ‘°μ μ°, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό. λν κΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 10μ
Sn-bi-Cu-In μλ μ ν©λΆμ κ°λ νκ°. κΉμ λͺ¨, μ‘°μ μ°, κΉλ―Έμ§, μ μ¬ν, μ μ£Όμ . λν κΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 10μ
SnBiμ½ν λ Sn-3.5wt%Ag μλλ₯Ό μ΄μ©ν SMT μλλ§λΆμ μ λ’°μ± μ°κ΅¬. κΉλ―Έμ§, μ΄μ¬μ, μ μ¬ν. λν κΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 10μ
λκΈμΈ΅μ΄ Sn-3Ag-0.5Cuμλμ μ λ’°μ±μ λ―ΈμΉλ μν₯. κΉλ―Έμ§, μλͺ μ§, κ°κ²½μΈ, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό. λνμ©μ νν μΆκ³ νμ λν, 2004λ 5μ
Sn λ° Ni/Au PCB κΈ°νλκΈκ³Ό SnAgCuμλκ°μ μ΄μΆ©κ²© νΉμ±μ κ΄ν μ°κ΅¬. μλͺ μ§, κΉλ―Έμ§, μ‘°μ μ°, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό. νκ΅ ν면곡νν μΆκ³ νμ λ°νν, 2004λ 5μ
Sn-3Ag-0.5Cuμλμ PCB νλ©΄μ²λ¦¬μ λ°λ₯Έ μ λ’°μ± νκ°, κΉλ―Έμ§, μλͺ μ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό. λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 4μ
Sn-3.5Ag μλλ²νμ λ²€λ©νΌλ‘μνμ κ΄ν μ°κ΅¬, κΉμ λͺ¨, κ°κ²½μΈ, μ μ¬ν, λ°©μ νΈ, μ€κ·ν, λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 4μ
SnAgCu μλμ QFP리λ μλλ§λΆμ μ΄μΆ©κ²© νΉμ±, μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 4μ
μ΄μΆ©κ²©μ μν SnAgCuμλμ Chip λκΈκ°μ μ λ’°μ± νκ°, μλͺ μ§, κΉλ―Έμ§, μ μ¬ν, λ¬Έμμ€, μ΄μ§μ, ννμ£Ό, λνκΈμΒ·μ¬λ£νν μΆκ³νμ λν, 2004λ 4μ
Stress relaxation testμ μν solderμ viscosity νκ°μ κ΄ν μ°κ΅¬. λ°©μ νΈ, μ€κ·ν, μ μ¬ν. λν κΈμΒ·μ¬λ£ νν μΆκ³ νμ λν 10μ 23~24μΌ, 2003
SnBiμ Bi μ½ν λ Sn-3.5%Ag μλμ κ°λ λ° λ―ΈμΈκ΅¬μ‘°. μ΄μ¬μ, μ μ¬ν, λ°©μ νΈ, μ€κ·ν. λν κΈμΒ·μ¬λ£ νν μΆκ³ νμ λν 10μ 23~24μΌ, 2003 (ν¬μ€ν° μ°μμ)
λ²€λ© μ€νμ ν΅ν μλ λ²νμ νΌλ‘μλͺ νκ° λ° λ²€λ© λ³μμ μν₯. κ°κ²½μΈ, μ μ¬ν, λ°©μ νΈ, μ€κ·ν. λν κΈμΒ·μ¬λ£ νν μΆκ³ νμ λν 10μ 23~24μΌ, 2003
μ§μ λΆμκΈ°μ λ°λ₯Έ Sn-Agκ³ λ¬΄μ° μλμ μ μμ± λ° κΈ°κ³μ νΉμ±μ κ΄ν μ°κ΅¬. κΉλ―Έμ§, κΉμ λͺ¨, μ μ¬ν. λν κΈμΒ·μ¬λ£ νν μΆκ³ νμ λν 10μ 23~24μΌ, 2003
μΉ¨μ§ κΉμ΄ λ° μλμ λ°λ₯Έ λ¬΄μ° μλμ μ μμ± λΉκ΅νκ°. μλͺ μ§, μ΄μ¬μ, μ μ¬ν,μ€μ’ ꡬ, μ΄μ€ν¬. λν κΈμΒ·μ¬λ£ νν μΆκ³ νμ λν 10μ 23~24μΌ, 2003
Sn - Bi - Cu - In μλ μ ν©λΆμ κ°λ λ° λ―ΈμΈκ΅¬μ‘°. κ°κ²½μΈ, μ΄μ¬μ, μ μ¬ν. λν μ©μ νν μΆκ³ νμ λ°ν λν May 22~23, 2003
μ μ΅μ Sn - Bi μλ λκΈλ Sn - Ag μλμ μλλ§μ± νκ°. μ΄μ¬μ, λ°©μ νΈ, μ μ¬ν. λν μ©μ νν μΆκ³ νμ λ°ν λν May 22~23, 2003
νλΌμ¦λ§λ₯Ό μ΄μ©ν 무νλμ€ μλλ§μ μλμ νΌμ§νΉμ±μ κ΄ν μ°κ΅¬. κ°κ²½μΈ, μ μ¬ν, λ¬Έμ€κΆ. λν κΈμ,μ¬λ£ νν μΆκ³ νμ λν 4μ 24~25μΌ, 2003
μ€ν μ€ νλ¦°ν λ Sn - Bi - Cu - In μλ μ ν©λΆμ κ°λνκ°. μ΄μ¬μ, κ°κ²½μΈ, μ μ¬ν. λν κΈμβ’μ¬λ£ νν μΆκ³ νμ λν 4μ 24~25μΌ, 2003
νλΌμ¦λ§λ₯Ό μ΄μ©ν 무νλμ€ μλλ§μ κ΄ν μ°κ΅¬, λ¬Έμ€κΆ, κ°κ²½μΈ, κ³½κ³ν, μ μ¬ν, μΆκ³ νκ΅ λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ νν Nov, 8, 2002
SnCuXκ³ μλλ₯Ό μ΄μ©ν λ¬΄μ° μλλ§μμμ κ³λ©΄κ΅¬μ‘°μ κΈ°κ³μ νΉμ±, μ΄μ¬μ, λ°μ§νΈ, λ¬Έμ€κΆ, μ μ¬ν, μΆκ³ νκ΅ λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ νν Nov, 8, 2002
μ ν΄λκΈμ μν νλ¦½μΉ©μ© Sn-Cuμλ λ²νμ νΉμ±μ κ΄ν μ°κ΅¬, μ μμ, ν©ν, μ μ¬ν, κ°μΆμ, μΆκ³ νκ΅ λ§μ΄ν¬λ‘ μ μ λ° ν¨ν€μ§ νν Nov, 8, 2002
Sn-Cu-Xκ³ λ¬΄μ°μλ μ ν©λΆμ νΉμ±μ°κ΅¬, μ΄μ¬μ, λ°μ§νΈ, μ μ¬ν, κΈμνν μΆκ³λ°νλν, Oct 25~26, 2002
μ κΈ°λκΈμ μ΄μ©ν νλ¦½μΉ©μ© μλλ²νμ μ μμ κ΄ν μ°κ΅¬, μ μμ, ν©ν, νμ€μ, μ μ¬ν, κΈμνν μΆκ³λ°νλν, Oct 25~26, 2002
Pb-free μλλ§μ μν λκΈ κ°νμ© fluxμ κΈ°μ΄ νΉμ±, κ°κ²½μΈ, μ μ¬ν, κΉμν, κΈμνν μΆκ³λ°νλν, Oct 25~26, 2002
UMBμ’ λ₯μ λ°λ₯Έ νλΌμ¦λ§ 무νλμ€ μλ리μ λ―ΈμΈμ‘°μ§μ κ΄ν μ°κ΅¬, λ¬Έμ€κΆ, νμ€μ, κ³½κ³ν, μ μ¬ν,κΈμνν μΆκ³λ°νλν, Oct 25~26, 2002
ν립칩 μ ν©μ μμ±λλ κ³λ©΄λ°μλ¬Όμ΄ μ΄νΌλ‘ μ λ’°μ±μ λ―ΈμΉλ μν₯, νμ€μ, λ¬Έμ€κΆ, κ°μΆμ, μ μ¬ν, μ€νμ±, κΈμνν μΆκ³λ°νλν, Oct 25~26, 2002
ν립칩 μ ν©μ μμ±λλ κΈμκ°νν©λ¬Όμ΄ μ μνμκ³Ό κ³λ©΄λ°μμ λ―ΈμΉλ μν₯, νμ€μ, κ°μΆμ, λ¬Έμ€κΆ, μ μ¬ν, κΈμνν μΆκ³λ°νλν. Oct 25~26, 2002
ν립칩 μλλ§μ μμ±λλ κΈμκ° νν©λ¬Όμ΄ μ μμ±κ³Ό κΈ°κ³μ μ±μ§μ λ―ΈμΉλ μν₯. νμ€μ, μ μ¬ν, κ°μΆμ. κΈμμ£Όμ‘° μ©μ κΈ°μ μ¬ν¬μ§μ. pp 136~147 (2002.8μ)
무μ°μλλ₯Ό μ΄μ©ν 무νλμ€ ν립칩 ν¨ν€μ§μμ νλΌμ¦λ§ μ²λ¦¬μ λ°λ₯Έ μ ν© λ―ΈμΈμ‘°μ§μ κ΄ν μ°κ΅¬, λ¬Έμ€κΆ, μ μ¬ν, νμ€μ, κ°μΆμ. μ©μ νν μΆκ³νμ λ°νλν. 5,2~3, 2002.
Sn-Cuκ³ λ¬΄μ°μλμ κ°λ°, λ°μ§νΈ, λ¬Έμ€κΆ, μ μ¬ν, νμ€μ, μ΄μ¬μ₯. μ©μ νν μΆκ³νμ λ°νλν, 5.2~3. 2002.
무μ°μλλ₯Ό μ΄μ©ν ν립칩 ν¨ν€μ§μμμ 무νλμ€ μ ν© λ―ΈμΈμ‘°μμ κ΄ν μ°κ΅¬, λ¬Έμ€κΆ, μ μ¬ν, νμ€μ, ν©ν, κ°μΆμ. μΆκ³νμ λν(κΈμνν) April 26, 2002.
Develpment of Sn-Cu base Pb-Free solder, λ°μ§νΈ, λ¬Έμ€κΆ, μ μμ, μ μ¬ν, μ΄μ¬μ₯, λ°μ’ μ°, μΆκ³νμ λν(κΈμνν) April 26, 2002
Fluxless Bonding of Solder Bump Flip Chip to Glass Substrate Using Ultrasonic Wave. Soon-Min Hong, Choon-Sik Kang, and Jae-Pil Jung. 8th Symposium on "Microjoing and Assembly Technology in Electronics" Jan 31~Fab 1, 2002, Yokohama, p137~140
A study on the solderability of Sn-Ag-Bi solder bump to Ni/Cu. λ¬Έμ€κΆ, κΉλ¬ΈμΌ, μ μ¬ν, κ³½κ°ν, κ°μΆμ λν μ©μ νννν μΆκ³ νμ λ°ν ν κ°μμ§ Oct 25 - 26 p156 to 159
Effect of plating later on the solderability of Sn-3.5Ag-0.7Cu ball. μ μμ, μ κ·μ, μ μ¬ν. μΆκ³ νμ λ°νλν κ°μμ§(λνμ©μ νν) Oct 25-26. p159 to 164.
In, Biλ₯Ό ν¨μ ν Sn-Agκ³ λ¬΄μ°μλμ μλλ§μ± μ°κ΅¬. κΉλ¬ΈμΌ,λ¬Έμ€κΆ, μ μ¬ν. λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ ννμ§. Vol. 8, No. 3, p43-47. 2001
μ ν΄λκΈμ μν΄ μ μ‘°λ ν립칩 μλ λ²νμ νΉμ±. ν© ν, νμλ―Ό, κ°μΆμ, μ μ¬ν. λνμ©μ ννμ§, Vol. 19,No.5, Oct, 2001 pp. 520 to 525
Sn-37mass%Pb μλ λ° Sn-3.5mass%Ag 무μ°μλλ₯Ό μ΄μ©ν ΞΌBGA μλμ ν©λΆμ μ΄νΌλ‘μλͺ μμΈ‘. μ μμ, μ΄μ€ν, νλ²μ©, μ μΉλΆ, μ μ¬ν. λνμ©μ ννμ§, Vol. 19,No. 4, Aug(2001)
In, Biλ₯Ό ν¨μ ν Sn-Agκ³ λ¬΄μ°μλμ μλλ§μ± μ°κ΅¬. κΉλ¬ΈμΌ, λ¬Έμ€κΆ, μ μ¬ν, κ³½κ³ν. IMAPS-KOREA. July 13~14, (2001) pp. 161 to 164
Sn-Ag-Bi-Inκ³ λ¬΄μ°μλμ μλλ§μ± μ°κ΅¬. λ¬Έμ€κΆ, κΉλ¬ΈμΌ, μ μ¬ν, κ³½κ³ν, μ μΆ©μ. λνμ©μ νν μΆκ³νμ λν κ°μμ§. May. (2001)
Sn-Agκ³ solderμ wetting νΉμ±κ³Ό κ³λ©΄λ°μμ κ΄ν μ°κ΅¬. μ κ·μ, μ μ¬ν, νμ€μ, κ°μΆμ. λνκΈμνν μΆκ³νμ λν κ°μμ§. Apr. (2001)
λ μ΄μ 리νλ‘μ°λ₯Ό μ΄μ©ν ν립칩 ν¨ν€μ§ μλ λ²ν νμ±μ κ΄ν μ°κ΅¬. νμλ―Ό, κ°μΆμ, μ μ¬ν. λνκΈμνν μΆκ³νμ λν κ°μμ§. Apr. (2001)
ν립칩 λ²ν νμ±μ μν Sn-Pb, Sn-Ag μ κΈ°λκΈμ κ΄ν μ°κ΅¬. ν©ν, νμλ―Ό, κ°μΆμ, μ μ¬ν. λνκΈμνν μΆκ³νμ λν κ°μμ§. Apr. (2001)
Sn-Ag-Bi-In μλλ₯Ό μ΄μ©ν ν립칩 ν¨ν€μ§μ© μλλ²ν νμ±μ κ΄ν μ°κ΅¬. κΉλ¬ΈμΌ, μ μ¬ν, νμλ―Ό, κ°μΆμ. λνκΈμνν μΆκ³νμ λν κ°μμ§. Apr. (2001)
Sn-Ag-Bi-Inκ³ μλμ BGAμ ν© νΉμ±. λ¬Έμ€κΆ, κΉλ¬ΈμΌ, μ μ¬ν, νμλ―Ό, κ°μΆμ. λνκΈμνν μΆκ³νμ λν κ°μμ§. Apr. (2001)
Sn-Ag-Cu solderλ₯Ό μ΄μ©ν micro-BGA μ ν©μμμ κ³λ©΄ μμΉμ λ°λ₯Έ λ―ΈμΈμ‘°μ§ λ³νμ λν μ°κ΅¬, λνμ©μ νν μΆκ³νμ λ°νλν κ°μμ§, μ 36κΆ, pp. 281-283(2000)
Plasma Cleaningμ μ΄μ©ν Si-wafer/Glass κΈ°νμ fluxless soldering, λνμ©μ νν μΆκ³νμ λ°νλν κ°μμ§, μ 36κΆ, pp. 284-286(2000)
μμ°μλλ₯Ό μ΄μ©ν 무νλμ€ μλλ§μ κ΄ν μ°κ΅¬, λνκΈμνν μΆκ³νμ λν κ°μμ§, Oct.(2000)
Wetting Balance λ²μ μ΄μ©ν Pb-freeμλμ UBMκ³Ό TSM μ½ν μΈ΅μ μ μ΄κ° κ³μ°, λνκΈμνν μΆκ³νμ λν κ°μμ§, Oct.(2000)
Flip Chip ν¨ν€μ§μ μ μ©λλ Au/Cu/Cr κΈμμΈ΅κ² Snκ³ μλμμ κ³λ©΄λ°μμ λν AEM μ°κ΅¬, λνκΈμνν μΆκ³νμ λν κ°μμ§, Oct.(2000)
Wettability analysis of liquid phase in partial melted solders using wetting balance. Proc. Of 5th Intl Joint Sympo. on Microelectronics and Packaging, The Intl Micro. and Pack. Soc., Seoul Korea, pp81-86, Apr. (2000)
Si-wafer/Glass ν립칩 ν¨ν€μ§μμ UBM λ° TSM μ½ν μΈ΅μ λ¬΄μ° solderμ λν μ μνΉμ± λνμ©μ νν μΆκ³νμ λ°νλν κ°μμ§, μ 35κΆ, pp.170-173, (2000)
λΆλΆμ©μ΅μνμμμ μλλ§μ κ΄ν μ°κ΅¬ -νλ©΄μ₯λ ₯ λ° μ μμ± νΉμ± λΆμ- λνμ©μ νν μΆκ³νμ λ°νλν κ°μμ§, μ 35κΆ, pp.199-202, (2000)
λΆλΆμ©μ΅μνμμμ μλλ§μ κ΄ν μ°κ΅¬ -λ―ΈμΈμ‘°μ§κ³Ό μμ±κΈ°κ΅¬ ν΄μ- λνμ©μ νν μΆκ³νμ λ°νλν κ°μμ§, μ 35κΆ, pp.203 - 206, (2000)
λ°μ°½λ°°, νμλ―Ό, μ μ¬ν,κ°μΆμ, Si-wafer/Glass κΈ°νμ 무νλμ€ μλλ§μ λ―ΈμΉλ νλΌμ¦λ§ μ²λ¦¬μ μν₯, νκ΅λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§νν(KEMPS) 2000λ λ μΆκ³ κΈ°μ μ¬ν¬μ§μ λ Όλ¬Έμ§, pp.75-78, μμΈ, λ¨κ΅λ, 2000.11.3 (2000)
과곡μ Sn-Pbν©κΈμ μ΄μ©ν λΆλΆ μ©μ΅ μνμμμ μλλ§. λνκΈμνν μΆκ³ νμ λν κ°μμ§, Apr. (2000)
과곡μ Pb free μλλ₯Ό μ΄μ©ν λΆλΆ μ©μ΅ μν μλλ§μ Grid Area Packageμμ μ μ© λνκΈμνν μΆκ³ νμ λν κ°μμ§, Apr. (2000)
UBM μ¦μ°©λ Si-waferμ λν λ¬΄μ° solderμ μ μνΉμ±μ λ―ΈμΉλ λΆμκΈ°μ μν₯. λνκΈμνν μΆκ³ νμ λν κ°μμ§, Apr. (2000)
Jae Yong Park, Jae Pil Jung, Choon Sik Kang, Young Eui Shin : Analysis of wetting balance test - Part1 : The Effect of Immersion Depth, 5th symposium on Microjoining and Assembly Technology in Electronics, February 4-5, Yokohama(1999)
Analysis of wetting balance test-Part 1, 5th symposium on microjoining in electronics. Yokohama.1999.2
μ μμ,μ μ¬ν,Nakada,μ μΉλΆ : Stress Analysis and Life Improvement of Solder Joint in TSOP with Clad Lead Frame.μΌλ³Έ μ©μ νν(4th Symposium on Microjoing and Assembly in Electronics).(1998 )
Keiko Kotanii,μ μ¬ν,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Joints of Al-X(X=Si,Mn,Zn,Cu) Binary Alloys Diffusion-Bonded with Al-Mg Filler Sheet.μΌλ³Έμ©μ ννμ κ΅λνλ Όλ¬Έμ§ No.59 256-257 (1996)
Keiko Kotanii,μ μ¬ν,Kenji Ikeuchi,Fukuhisa Matsuda : Interfacial Phases in Diffusion-Bonded Joints of Al-Ca Binary Alloys Filler Sheet.μΌλ³Έμ©μ ννμ κ΅λνλ Όλ¬Έμ§ No.59 258-259 (1996)
λ°μ°½λ°°, κΉλ―Έμ§, μ μ¬ν : Sn-37Pbμλ λκΈ Cuλ°νμ μ ν μ μ©μ μ κ΄ν μ°κ΅¬. λν κΈμνν 1999λ λ μΆκ³νμ λν κ°μμ§, pp.125
ννμ£Ό, μ μ¬ν, λ°μ¬μ©, κ°μΆμ, νλ²μ©, μ μμ : BGA processμμμ 곡μ λ³μμ λ°λ₯Έ Sn-Pb/Sn-Ag 곡μ μλλ³Όμ μΌκΈνμ νΉμ±. λνκΈμνν 1999λ λ μΆκ³νμ λν κ°μμ§, pp. 139
λ°μ¬μ©, κ°μΆμ, ννμ£Ό, μ μ¬ν : Meniscographλ²μ μ΄μ©ν Sn-Pb/Sn-Ag 곡μ solderμ νλ©΄μ₯λ ₯ μΈ‘μ . λνκΈμνν 1999λ λ μΆκ³νμ λν κ°μμ§ pp. 139
ννμ£Ό, μ μ¬ν, νλ²μ©, μ μμ, λ°μ¬μ©, κ°μΆμ : Sn-Pb, Sn-Ag solder pasteμ QFPμ 리νλ‘ μ ν©νΉμ±μ κ΄νμ°κ΅¬, 1999λ λ λνκΈμνν μΆκ³νμ λν κ°μμ§, p.213.
λ°μ°½λ°°, μ μ¬ν, νμλ―Ό, κ°μΆμ : Snκ³ μλλ₯Ό μ΄μ©ν Si-wafer/Glass μ ν©μ κ΄ν μ°κ΅¬, 1999λ λ λνκΈμνν μΆκ³νμ λν κ°μμ§, p.211.
λ°μ¬μ©, κ°μΆμ, ννμ£Ό, μ μ¬ν : wetting balance testμμμ μ μλ ₯ ν΄μμ κ΄ν μ°κ΅¬, 1999λ λ λνκΈμνν μΆκ³νμ λν κ°μμ§, p.210.
νμλ―Ό, λ°μ¬μ©, κ°μΆμ, λ°μ°½λ°°, μ μ¬ν : Si GlassκΈ°νμ λν Siκ³ μλμ μ μ νΉμ±μ κ΄ν μ°κ΅¬, 1999λ λ λνκΈμνν μΆκ³νμ λν κ°μμ§, p.211.
μ μ¬ν,μ΅λͺ κΈ°,μ μμ,μμ°½μ ,μμΉμ : μΈμ μ© λ° λ¬΄μΈμ μ© νλμ€λ₯Ό μ¬μ©ν μ¨μ΄λΈ μλλ§ νΉμ±λΉκ΅ .νκ΅ λ§μ΄ν¬λ‘μ μ λ° ν¨ν€μ§ νν 1998λ λ μΆκ³ κΈ°μ μ¬ν¬μ§μ λ Όλ¬Έμ§ 57~60(1998)
ννμ£Ό,μ μ¬ν,μνκΈ°,μ μμ,κ°μΆμ,λ°μ¬μ© : Sn-Pb λ° Sn-Ag 곡μ μλλ₯Ό μ΄μ©ν 리νλ‘ μλλ§ νΉμ±.λνμ©μ νν μΆκ³λν κ°μ°μ§ 141~142 (1998)
μ κ·ν,μμ°½μ ,μ΅λͺ κΈ°,μ μ¬ν : κΈ°νμ 건쑰μκ°μ λ°λ₯Έ Solderabilityκ΄ν μ°κ΅¬.λνμ©μ νν μΆκ³λν κ°μ°μ§ 147~150 (1998)
μ μμ,κΉμ’ λ―Ό,μ μ¬ν : νλΌμ€ν± ICν¨ν€μ§ μ ν©λΆμ μλͺ μμΈ‘ λ° νμ§ν₯μμ κ΄ν μ°κ΅¬.λνμ©μ νν μΆκ³λν κ°μ°μ§ 147~150 (1998)
ννμ£Ό,μ μ¬ν,μνκΈ°,μ μμ,λ°μ¬μ©,κ°μΆμ,μ΄λ³ν : Sn-37Pb/Sn-3.5Agλ₯Ό μ΄μ©ν BGAμλλ§μ κ΄ν μ°κ΅¬.λνκΈμνν μΆκ³λν κ°μ°μ§ 84 (1998)
μ₯μ ν,μ₯μΈμ² , μ μμ,μ΅λͺ κΈ°,μμ°½μ ,μ μ¬ν,ν©μ ν¨ : μ μμ¬ νλμ€λ₯Ό μ¬μ©ν Wave Solderingμ μ΄κΈ° μ ν©κ°λμ κ΄ν μ°κ΅¬.λνμ©μ νν μΆκ³νμ λ°ν κ°μμ§ 29~32 (1997)
μ΅λͺ κΈ°,κΉμ’ νΈ,μ΄μ°½μ΄,μμ°½μ ,μ μ¬ν,μ μμ : Solderμ ν©λΆμ κ²°ν¨κ±°λ κ³ μ°° λ° μ ν©λΆμ νΉμ±μ κ΄ν μ°κ΅¬.λνμ©μ νν μΆκ³νμ λ°ν κ°μμ§ 5~8 (1997 )
νμ ν¬,κΉμΈμ ,μ μ¬ν : QFP leadμ laser solderingκΈ°μ κ°λ°μ°κ΅¬.λνμ©μ νν μΆκ³λν κ°μ°μ§ 165~167 (1997 )
μ₯μΈμ² ,μ₯μ ν,μ μμ,μ μ¬ν,μ΅λͺ κΈ°,μμ°½μ : μ μμ¬ fluxμ¬μ©μ Wave Solderingμ λν μ°κ΅¬(2).λνμ©μ νν μΆκ³λν κ°μ°μ§ 162~164 (1997 )
κΉμ’ νΈ,μ΅λͺ κΈ°,μ μ¬ν,μ μμ,μμ°½μ : μ μμ¬ fluxμ¬μ©μ Wave Solderingμ λν μ°κ΅¬(1).λνμ©μ νν μΆκ³λν κ°μ°μ§ 159~161 (1997 )
μ μ°¬ν,κΉλͺ ν,μ μ¬ν,μ‘°ννΈ : OCCλ²μ μν near-shape Al-Siν©κΈ Welding rod μ£Όμ‘° λ° νΉμ±μ‘°μ¬.λνμ£Όμ‘°νν μΆκ³νμ λ°νλν.(1996)
νμ ν¬,κΉμ μ€,μ μ ,μ μ¬ν,κΉμΈμ ,λ°μ νΈ : λ μ΄μ λ° μ μλΉ μ©μ μμ©μ¬λ‘.μ 6ν λ μ΄μ κ°κ³΅κΈ°μ μ¬ν¬μ§μ. pp.49~68(1995)
λ³΄λ‘ λν¬λ²μ μ΄μ©ν μ‘νμ λνμ°μ ν©λ²μ κ²ν , λνμ©μ νν μΆκ³νμ λνΒ κ°μ°μ§, (1990), p
λκ³Ό μ€ν μΈλ μ€κ° brazingλΆμ μ λκ°λμ λ―ΈμΉλ Sn,Pμ μν₯μ°κ΅¬ (II), λνμ©μ νν μΆκ³νμ λνΒ κ°μ°μ§, (1990), p92-97
μΈλκ³ brazing ν©κΈκ°λ°μ κ΄ν μ°κ΅¬, λνμ©μ νν μΆκ³νμ λνΒ κ°μ°μ§, (1991), p91-93
λκ³Ό μ€ν μΈλ μ€κ°μ Cu-P-Sn λΆλ§μ μ΄μ©ν brazingμ°κ΅¬, λνμ©μ νν μΆκ³νμ λν Β κ°μ°μ§, (1989), p76-80
μ μ¬ν,μ΄λ³΄μ, μ©μ λΆμ κΈ°κ³μ μ±μ§μ λ―ΈμΉλ Niκ³Ό Mnμ 볡ν©ν¨κ³Ό, λνκΈμνν μ¬λ£κ°λλΆκ³Ό μ¬ν¬μ§μ, μμΈ, p59-65 (1988)
Self-shielded flux cored arc weldingμ κ°μ€ λ°μμ κ° spatter λ°μμ λ―ΈμΉλ μν₯, λνμ©μ νν μΆκ³νμ λν, p.13-17, 1985, 4.13
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