*Corresponding authors

†The authors equally contributed

Lab member names in bold

International Conference Proceedings

[015] Active BSCDN benchmark framework with backside-compatible CNFET logic technology 

Yehyun Shin†, Ikkyum Kim†, Minho Park† (Presenter), Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanghyeon Kim, Haksoon Jung, Seongju Kim*, Heechun Park*, Jimin Kwon*

2025 71th IEEE International Electron Devices Meeting (IEDM) - Accepted

[014] Monolithic 3D integration of III-V HEMTs on glass using ultra-thin dielectric bonding layer: a high-frequency and low-loss active glass platform for sub-THz applications 

Jaeyoung Jeong†, Yurim Choi†, Seongju Kim, Hyeongjun Kim, Jimin Kwon*, Sanghyeon Kim*

2025 71th IEEE International Electron Devices Meeting (IEDM) - Accepted

[013] Thermal evaluation and comparison of CAA and GAA indium tin oxide vertical channel transistors 

Young Suh Song†, Jimin Kang†, Hyeonho Gu†, Haotian Su, Yuan-Mau Lee, Shan X. Wang, Jimin Kwon*, H.-S. Philip Wong*, Eric Pop*

2025 71th IEEE International Electron Devices Meeting (IEDM) - Accepted

[012] Quasi-coaxial through-hole integrated additively manufactured antenna-in-package lid substrates 

Nahyeon Kim (Presenter), Haksoon Jung*, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon*

2025 75th IEEE Electronic Components and Technology Conference (ECTC)

[011] 3D printed fanout interposer substrates with curved through-holes for rapid prototyping of advanced packaging

Haksoon Jung (Presenter), Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon*

2025 75th IEEE Electronic Components and Technology Conference (ECTC)

[010] Future of memory: massive, diverse, tightly integrated with compute – from device to software

Shuhan Liu, Robert M. Radway, Xinxin Wang, Jimin Kwon, Caroline Trippel, Philip Livis, Subhasish Mitra, H.-S. Philip Wong

2024 70th IEEE International Electron Devices Meeting (IEDM)

[009] Micro-3D-printed packaging substrates with embedded through holes for organic inteposers

Nahyeon Kim (Presenter), Haksoon Jung, Yongwoo Lee, Sungmin Eum, Yechan Han, Hyunjin Park, Yunsik Park, Jimin Kwon*

2024 74th IEEE Electronic Components and Technology Conference (ECTC)

[008] Bias stress stability of ITO transistors and its dependence on dielectric properties

Lauren Hoang, Alwin Daus, Sumaiya Wahid, Jimin Kwon, Jung-Soo Ko, Shengjun Qin, Mahnaz Islam, Krishna C Saraswat, H-S Philip Wong, Eric Pop*

2022 Device Research Conference (DRC)

[007] First demonstration of top-gated ITO transistors: effect of channel passivation

Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Krishna C Saraswat, H-S Philip Wong, Eric Pop*

2022 Device Research Conference (DRC)

[006] 8-layer 3D vertical Ru/AlOxNy/TiN RRAM with mega-Ω level LRS for low power and ultrahigh-density memory

Shengjun Qin, Maryann Tung, Emma Belliveau, Shuhan Liu, Jimin Kwon, Wei-Chen Chen, Zizhen Jiang, S Simon Wong, H-S Philip Wong*

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI)

[005] The future of hardware technologies for computing: N3XT 3D MOSAIC, illusion scaleup, co-design

RM Radway, K Sethi, W-C Chen, Jimin Kwon, S Liu, TF Wu, E Beigne, MM Shulaker, H-SP Wong, S Mitra*

2021 IEEE International Electron Devices Meeting (IEDM)

[004] Printed 2-V dual-gate CNFETs with an enhanced depletion behavior

Jimin Kwon, Haksoon Jung, Dongseob Ji, Sungjune Jung, Yong-Young Noh*

2020 Device Research Conference (DRC)

[003] A phase-separated polymer blocking layer for enhancing data retention in flexible printed nonvolatile organic memories

Woojo Kim, Jimin Kwon, Yongwoo Lee, Sungjune Jung*

2019 IEEE International Flexible Electronics Technology Conference (IFETC)

[002] Flexible printed top-contact organic thin-film transistors

 Yongwoo Lee, Jimin Kwon, Woojo Kim, Sungjune Jung*

2019 IEEE International Flexible Electronics Technology Conference (IFETC)

[001] Technology development for direct-printed dual-gate organic TFT circuit fabrication with 3-D integration

Jimin Kwon, Woojo Kim, Yongwoo Lee, Sungjune Jung*

2019 IEEE International Flexible Electronics Technology Conference (IFETC)

Invited Talks

(Tutorial) Advanced packaging and new opportunities for additive manufacturing

Jimin Kwon

International Conference On Consumer Electronics Asia (ICCE-Asia / 4 Nov, 2024)

(Invited Talk) Additively manufactured packaging substrates for fan-out interposers

Jimin Kwon

International SoC Design Conference (ISOCC / 8 Aug, 2024)

(Invited Talk) Heterogeneous integration technology development: monolithic 3D integration and advanced packaging

Jimin Kwon

Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD / 8 Jul, 2024)

(Invited Talk) Direct-printing more components onto large-area and 3D electronics

Jimin Kwon

The 21th International Symposium on the Physics of Semiconductors and Applications (ISPSA / 5 Jun, 2024)

(Invited Talk) 단일3차원집적, 이종집적을 위한 반도체소자·패키지 제작

Jimin Kwon

한국세라믹학회 추계학술대회 (2024 Fall Meeting of Korean Ceramic Society / 20 Oct, 2023)