Publications

• Junghyun Yoon and Heechun Park, "SMT-Based Optimal Transistor Folding and Placement for Standard Cell Layout Generation", IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), 2026

• Yehyun Shin†, Ikkyum Kim†, Minho Park†, Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanghyeon Kim, Haksoon Jung, Seongju Kim*, Heechun Park*, and Jimin Kwon*, "Active BSCDN Benchmark Framework with Backside-Compatible CNFET Logic Technology", IEEE International Electron Devices Meeting (IEDM), 2025

• Gyumin Kim and Heechun Park, "A Unified Design Flow for Homogeneous and Heterogeneous 3D Integration with Fine-Pitch Hybrid Bonding", IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2025

• Hyunmin Jo and Heechun Park, "Priority-Aware Routing Optimization with Full-Path Delay Prediction Using Machine Learning", ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD), 2025

• Gangmin Jeon and Heechun Park, "Timing-Driven Macro Placement with Connectivity-Aware Clustering", IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2025

• Junghyun Yoon and Heechun Park, "Mitigating Routability Problems in Complementary-FET-based VLSI Designs", IEEE/ACM Design Automation Conference (DAC), 2025

• Dhoui Lim and Heechun Park, "Timing-Driven Detailed Placement with Unsupervised Graph Learning", IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2025

• Gyumin Kim and Heechun Park, "Clustering-Driven Bonding Terminal Legalization with Reinforcement Learning for F2F 3D ICs", IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), 2025

• Eunsol Jeong, Taewhan Kim, and Heechun Park, "PPA-Aware Tier Partitioning for 3D IC Placement with ILP Formulation", IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), 2025

• Ikkyum Kim and Heechun Park, "Memristive Logic-in-Memory Implementation with Area Efficiency and Parallelism", IEEE International Conference on Computer Design (ICCD), 2024

• Ikkyum Kim and Heechun Park, "3T1R Memristor Crossbar Architecture for Diverse Logic Implementation", IEEE International SoC Design Conference (ISOCC), 2024

• Yoonjae Lee and Heechun Park, "Double-Row Flip-flop Design Under Advanced Technology and Its IC-Level Effects", IEEE International SoC Design Conference (ISOCC), 2024

• Dho Ui Lim and Heechun Park, "Graph Neural Network-Based Detailed Placement Optimization Framework", IEEE International Symposium on Quality Electronic Design (ISQED), 2024

• Junghyun Yoon and Heechun Park, "Design-Technology Co-Optimization with Standard Cell Layout Generator for Pin Configurations", IEEE International Symposium on Quality Electronic Design (ISQED), 2024

• Sojung Park and Heechun Park, "Timing-Aware Tier Partitioning for 3D ICs With Critical Path Consideration," IEEE/IEIE International Conference on Electronics, Information, and Communication (ICEIC), 2024

• Kyungjoon Chang, Jaehoon Ahn, Heechun Park, Kyu-Myung Choi, and Taewhan Kim, "DTOC: integrating Deep-learning driven Timing Optimization into the state-of-the-art Commercial EDA tool," IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2023

• Suwan Kim, Sehyeon Chung, Taewhan Kim, and Heechun Park, "Tightly Linking 3D via Allocation towards Routing Optimization for Monolithic 3D ICs," IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2022

• Eunsol Jeong, Heechun Park, and Taewhan Kim, "A Systematic Removal of Minimum Implant Area Violations under Timing Constraint," IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2022

• Seyoung Kim, Heechun Park, and Jaeha Kim, “Safety Verification of AMS Circuits with Piecewise-Linear System Reachability Analysis,” IEEE International System-on-Chip Design Conference (ISOCC), 2021

• Heechun Park, Kyungjoon Chang, Jooyeon Jeong, Jaehoon Ahn, Ki‐Seok Chung and Taewhan Kim, “Challenges on DTCO Methodology Towards Deep Submicron Interconnect Technology,” IEEE International System-on-Chip Design Conference (ISOCC), 2021

• Eunsol Jeong, Heechun Park, Jooyeon Jeong, and Taewhan Kim, “Minimum Implant Area-Aware Threshold Voltage Refinement in Pre-Placement,” IEEE International Midwest Symposium on Circuits and Systems (MWSCAS), 2021

• Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, and Sung Kyu Lim, "Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs," ACM International Symposium on Physical Design (ISPD), 2020

• Jinwoo Kim, Heechun Park, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Mark Nelson, Krishnendu Chakrabarty, Saibal Mukhopadhyay, and Sung Kyu Lim, "RTL-to-GDS Design Tools for Monolithic 3D ICs Built with Carbon Nanotube Transistors and Resistive Memory," Government Microcircuit Applications and Critical Technology Conference (GOMACTech), 2020

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• Heechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, and Sung Kyu Lim, "RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs," IEEE/ACM Design Automation Conference (DAC), 2019 (Invited Paper)

• Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, and Sung Kyu Lim, "Architecture, Chip, and Package Co-design Flow for 2.5D Integration of Reusable IP Chiplets," IEEE/ACM Design Automation Conference (DAC), 2019

• Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, and Sung Kyu Lim, "Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs," IEEE European Test Symposium (ETS), 2019

• Hakki Mert Torun, Nihar Dasari, Arvind Singh, Minah Lee, Jinwoo Kim, Heechun Park, Hyouk Joon Kwon, Eric Qin, Tushar Krishna, Sung Kyu Lim, Saibal Mukhopadhyay, and Madhavan Swaminathan, "Design Space Exploration of Power Delivery in Heterogeneous Integration," Government Microcircuit Application and Critical Technology Conference (GOMACTech), 2019

• Jinwoo Kim, Eric Qin, Heechun Park, Hakki Mert Torun, Madhavan Swaminathan, Tushar Krishna, and Sung Kyu Lim, "Enabling Heterogeneous IP Reuse with Interposer-based 2.5D ICs and Custom Interface Protocol," Government Microcircuit Application and Critical Technology Conference (GOMACTech), 2019

• Heechun Park and Taewhan Kim, “Structure Optimizations of Neuromorphic Computing Architectures for Deep Neural Networks,” IEEE/ACM Design, Automation and Test in Europe (DATE), 2018

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• Heechun Park and Taewhan Kim, “Synthesizing Asynchronous Circuits Toward Practical Use,” IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2016

• Heechun Park and Taewhan Kim, “Comprehensive Technique for Designing and Synthesizing TSV Fault-Tolerant 3D Clock Trees,” IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2013

• Heechun Park and Taewhan Kim, “Fault Coverage and Resource Analysis for Diverse Structures of Clock TSV Fault-Tolerant Units in 3D ICs,” IEEE International SOC Design Conference (ISOCC), 2013

• Jaehoon Ahn, Kyungjoon Chang, Kyu-Myung Choi, Taewhan Kim, and Heechun Park, "DTOC-P: Deep-learning-driven Timing Optimization using Commercial EDA Tool with Practicality Enhancement", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Vol. 43, No. 8, pp. 2493-2506, 2024

• Suwan Kim and Heechun Park, "Comprehensive Physical Design Flow Incorporating 3D Connections for Monolithic 3D ICs", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Vol. 43, No. 7, pp. 1944-1956, 2024

• Eunsol Jeong, Taewhan Kim, and Heechun Park, "Eliminating Minimum Implant Area Violations With Design Quality Preservation," IEEE Transactions on Very Large Scale Integration Systems (TVLSI), Vol. 31, No. 5, pp. 611-621, 2023

• Heechun Park and Taewhan Kim, “Speeding-up Neuromorphic Computation for Neural Networks: Structure Optimization Approach,” Integration, the VLSI Journal, Vol. 82, pp.104-114, 2022

• Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, and Sung Kyu Lim, "Built-in self-test and fault localization for inter-layer vias in monolithic 3D ICs", ACM Journal on Emerging Technologies in Computing Systems (JETC), Vol. 18, No. 1, pp. 1-37, 2022

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• Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, and Sung Kyu Lim, “Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements”, ACM Transactions on Design Automation of Electronic Systems (TODAES), Vol. 26, No. 5, pp. 1-25, 2021.

• Gauthaman Murali, Heechun Park, Eric Qin, Hakki Mert Torun, Majid Ahadi Dolatsara, Madhavan Swaminathan, Tushar Krishna, and Sung Kyu Lim, "Clock Delivery Network Design and Analysis for Interposer-based 2.5D Heterogeneous Systems", IEEE Transactions on Very Large Scale Integration Systems (TVLSI), Vol. 29, No. 4, pp. 605-616. 2021

• Taehwan Kim, Heechun Park, and Taewhan Kim, "Allocation of Always-On State Retention Storage for Power Gated Circuits - Steady State Driven Approach," IEEE Transactions on Very Large Scale Integration Systems (TVLSI), Vol. 29, no. 3, pp. 499-511, 2021

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• Heechun Park, Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Majid Ahadi Dolatsara, Mohammed Nabeel, Alabi Bojesomo, Satwik Patnaik, Ozgur Sinanoglu, Madhavan Swaminathan, Saibal Mukhopadhyay, Johann Knechtel, and Sung Kyu Lim, "Design Flow for Active Interposer-Based 2.5D ICs and Study of RISC-V Architecture with Secure NoC," IEEE Transactions on Components, Packaging and Manufacturing Technology(TCPMT), Vol. 10, no. 12, pp. 2047-2060, 2020

• Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, and Sung Kyu Lim, "Architecture, Chip, and Package Co-design Flow for Interposer-based 2.5D Chiplet Integration Enabling Heterogeneous IP Reuse," IEEE Transactions on Very Large Scale Integration Systems (TVLSI), Vol. 28, no. 11, pp. 2424-2437, 2020

• Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Jinwoo Kim, Gauthaman Murali, Edward Lee, Daehyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay, and Krishnendu Chakrabarty, “Advances in Design and Test of Monolithic 3D ICs,” IEEE Design & Test, Vol. 37, No. 4, pp. 92-100, 2020

• Heechun Park and Taewhan Kim, “Hybrid asynchronous circuit generation amenable to conventional EDA flow,” Integration, the VLSI Journal, Vol. 64, pp. 29-39, 2019

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• Heechun Park and Taewhan Kim, “Synthesis of TSV Fault-Tolerant 3D Clock Trees,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Vol. 34, No. 2, pp. 266-279, 2015

• 박희천, 김태환, "심층 신경망을 위한 뉴로모픽 컴퓨팅 구조의 최적화 시스템," 한국, 등록번호 10-2353816, 2022년 1월 17일

• 임경환, 박현수, 김기섭, 이봉현, 임철, 최정연, 김태환, 박희천, "신호 전달을 위한 주 경로 및 우회 경로를 갖는 집적 회로 및 그것을 포함하는 집적 회로 패키지," 한국, 등록번호 10-2125340, 2020년 6월 16일

• Kyounghwan Lim, Hyoun Soo Park, Kee Sup Kim, Bonghyun Lee, Chul Rim, Jungyun Choi, Taewhan Kim and Heechun Park, “Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same,” US Patent, US 9524922 B2, Dec. 20, 2016

• Taewhan Kim and Heechun Park, “Design Methodology for TSV-Based 3D Clock Networks,” in Physical Design for 3D Integrated Circuits, edited by Aida Todri-Sanial and Chuan Seng Tan, CRC Press, 2015. (ISBN 978-1-4987-1036-7)

• Geonhyeong Park and Heechun Park, "Efficient 3D IC CTS Flow with Commercial EDA Tools," Korean Conference on Semiconductors (KCS), 2025

• Dho Ui Lim and Heechun Park, "Unsupervised Learning-Based Legalization with Graph Neural Network," Korean Conference on Semiconductors (KCS), 2024

• Junghyun Yoon and Heechun Park, "Design-Technology Co-Optimization for Standard Cell Pin Length Modulation," Korean Conference on Semiconductors (KCS), 2024

• Gang-Min Jeon and Heechun Park, "Chiplet Placement with Sequence Pair Based Tree and Branch-and-Bound Method Considering Chiplet Ordering," Korean Conference on Semiconductors (KCS), 2024

• Hyun Min Jo and Heechun Park, "Deep Learning Driven Pre-Route Arc Length Prediction Considering Routing Priority," Korean Conference on Semiconductors (KCS), 2024

• Ik-Kyum Kim and Heechun Park, "Logic-in-Memory Technology Mapping Framework for Memristor Crossbar with Maximized Parallelism," Korean Conference on Semiconductors (KCS), 2024

• Sojung Park and Heechun Park, "Timing-Aware Tier Partitioning for 3D ICs With Critical Path Consideration," Korean Conference on Semiconductors (KCS), 2024 [On-site Outstanding Poster Award]

• 박희천, 김태환, "비동기식 회로 설계 구조에 대한 전력 및 면적 비교," 대한전자공학회 추계학술대회, 2015

• 박희천, 김태환, "Clock TSV Fault-Tolerant 한 3 차원 IC 설계를 위한 TSV 공유 알고리즘," 대한전자공학회 추계학술대회, 2012