This section of the microsite will detail all of the different circuit boards involved in the SPEEEduino project, as well as being an open documentation publicly available for reference. Scroll down for nomenclature used in this site.
This section aims to clear up ambiguous terms for newcomers.
DIP: Dual inline package. Most older chips employ this form factor, but certain modules, such as the ESP8266-01 also uses a DIP format to make it easier to interface with, as surface mount devices are hard to solder.
SoC: System on a Chip. An SoC is a single chip that contains all the essential functionality of a microcomputer and more. Examples include the ESP8266EX and the ATmega328P. These chips include all the features of a computer on them, such as the CPU, RAM, ROM, and in the ESP8266EX's case, a complete 802.11a/b/g/n Wi-Fi radio embedded in the silicon.
ESP8266: The ecosystem based around Espressif's ESP8266EX SoC (datasheet available here).
ESP8266-01: A simple ESP8266 module, made by Ai-Thinker, one of the first companies to design modules for the now popular ESP8266EX chip.
ESP-01: Refers to the same module as the definition above.
ESP-01S: An upgraded version of the ESP-01, this module has 32Mbit flash instead of the 8Mbit flash on the black ESP-01 boards.
An ESP-01S Module
Gerber: Gerber files are files that describe a PCB, including all of its layers, such as its copper, solder mask, solder paste, silkscreen, and so on. These files are sent to fabrication houses (sometimes termed "fab houses") for them to fabricate