ALD is a thin film deposition based on the self-limiting reaction of the gas phase chemicals

• ALD has unique features, including precise thickness control, high conformality and uniformity, and precise composition and stoichiometry control
  
  

PEALD, which employs plasma as a reactant, brings about more advantages

• Improved material properties, even lower process temperature, high reactivity, etc.

ALA is an additional process that can be utilized during the PEALD processes

ALA transfers required energy to the surface of films through ion bombardment with high kinetic energy in the plasma, and transferred energy encourages displacement and surface diffusion of adatoms

• Additional treatments are not required (e.g., post-thermal annealing)

• Controllable films properties by adjusting plasma conditions (e.g., pressure, power, biasing, time)

• Effective for a top-most surface in sub-nanometer scale -> Extremely localized control on the vertical direction

Laminate structures are effective for improving electrical stability of capacitors

However, heterogeneous interfaces formed by inserted interlayer deteriorate properties of upper-TiO2 (e.g., crystallinity, phase, density), leading to degradation of performance of entire capacitors

ALA only induces phase transition of upper-TiO2 while maintaining amorphous phase of ZrO2 interlayer
-> Capacitance density increases, whereas leakage current maintains
-> Decoupling two main properties of the trade-off relationship

Low thermal budget of polymer substrates limits to use of thermal annealing required for crystallization and phase transition of thin films
-> Challenge to fabricate high-performance flexible capacitors

ALA can crystallize dielectric film without thermal treatment

Successfully fabricate high-performance flexible capacitors at a low temperature of 80℃
-> World-record performance & selected as a front-cover article

I can design and manufacture customized ALD systems and have experience in making HCP-PEALD systems

Based on an in-depth understanding of detailed systems and mechanisms of ALD equipment, I can maintain, modify, and repair customized ALD systems in person

Unique feature of customized HCP-ALD systems
-> Possible to utilize both HCP-ALD and UV-ALD by switching the HCP plasma generator and UV lamp on the top of the chamber (left pictures)