Projects Involved

In Samsung

2022.03 ~ Now

• 3nm/2nm/1.4nm CMOS logic device performance enhancement and process integration

• Test elements group (TEG) design for parasitic extraction (PEX) / process design kit (PDK)

In Academia

2016.03 ~ 2022.02

• "Device study for improving degradation immunity through NAND Peripheral Transition Hydrogen Passivation.", SK Hynix

• "Development of device-circuit co-optimization platform for 3D monolithic integrated semiconductor devices and 3D stacked CFET devices to overcome scaling limits of next-generation semiconductors.", Samsung Electronics 

• "Development of Si/SiGe channel M3D integrated devices and circuit architecture technology based on low-temperature epitaxy and recrystallization processes.", NRF Korea 

• "Development of Hybrid Conductance Transition Steep Switching (HYCOS) FET devices based on steep switching characteristics for next-generation semiconductor devices.", NRF Korea 

• "Big data and machine learning-based modeling of characteristic changes in next-generation semiconductor devices.", KEIT 

• "Device research for improving performance/reliability and scaling of next-generation memory.", SK Hynix 

• "3D stacking process technology and system implementation for synapse/neuron devices.", NRF Korea 

• "Development of low-temperature-based unit processes for the implementation of ultra-low-power 3D IoT device platforms.", NRF Korea  

• "Development of ultra-low-resistance contact technology based on conductive filament for next-generation semiconductor device implementation.", NRF Korea   

• "Analysis and modeling study of source/drain contact resistance characteristics based on next-generation III-V compound semiconductor for CMOS.", Samsung Electronics 

• "Development of ultra-low-temperature front-end integration technology for sequential device stacking.", KEIT

• "Development of Ge nMOS/pMOS FinFET technology for 10nm node technology.", KEIT