Thin films: High-k gate oxides and metals deposition using physical and chemical deposition methods
Plasma enhanced atomic layer deposition system
Self-assembled cluster RF/DC magnetron sputtering system
automated commercial sputtering system (oxford)
Thermal evaporation system
Spin coating for organic thin films.
Device Structures: Fabrication and Characterization of Semiconductor device Structures
Metal/Oxide/Semiconductor (MOS)
Metal/Ferroelectric/Metal (MFM)
Metal/Ferroelectric/Insulator/Semiconductor (MFIS)
Metal/Ferroelectric/Metal/Insulator/Semiconductor (MFMIS)
Flash memory device structures (charge trap/ floating gate)
Organic electronic devices for electronic and optoelectronic applications, and so on.
Device Electrical characterization: C-V, I-V, and pulse measurements using CVU, SMU, and RPM integrated Keithley SCS 4200 system equipped with Cascade four-probe station (manual and semi-automatic), and Agilent B1500A.
Material characterizations: Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM) crossection sample preparation.
Other Fabrication/Characterization Facilities used/operated:
Optical Lithography (Karl Suss MA6 Mask Aligner)
Maskless Lithography (Intelligent SF-100 Xpress)
Inductively Coupled Plasma (ICP) Reactive Ion Etching (RIE) / RIE
Plasma enhanced chemical vapor deposition (PECVD)
Thermal Annealing Systems: single-zone/three-zone furnace, and Rapid thermal Annealing (RTP) system
Wet Bench
Plasma Asher
Stylus Profilometer
Optical Profilometer
Optical Microscope
Solution-based electrochemical cell
Contact Angle
Material analysis tools used: XPS, GI-XRD, TEM, SEM, RAMAN, FTIR, and so on.
Experience of working in Cleanroom (Class 100/1000/10000).
VLSI Design/Simulation tools: Virtual TCAD, Silvaco TCAD, Matlab, Xilinx ISE Design Suite, Keil u-vision, Tanner, AVR studio, Cadence virtuoso, and encounter, etc.
Design and Implementation of FPGA based system using hardware description languages (VHDL/Verilog)
Development of Microcontroller (8051, AVR, ARM) based IoT and embedded systems both Hardware and Software (embedded C, Assembly language)