Book Chapters:

1. Tanwar, R., Singh, G., Pal, P.K. (2025). Stress-Wed: Stress Recognition Autoencoder Using Wearables Data. In: Tiwari, S., Ortiz-Rodriguez, F., Sicilia, MA., Chhetri, T.R. (eds) Artificial Intelligence: Towards Sustainable Intelligence. AI4S 2024. Communications in Computer and Information Science, vol 2243. Springer, Cham. https://doi.org/10.1007/978-3-031-81369-6_7.

2. Tanwar, R., Singh, G., Pal, P.K. (2024). Non-invasive Stress Recognition framework using edge/cloud Computing and Consumer Internet of Things in Smart Healthcare Applications. In the book series Smart Sensors Measurement and Instrumentation. Springer. https://doi.org/10.1007/978-3-031-68602-3_13. 

3. Pundir, Y.P., Bisht, A., Pal, P.K. (2024). Performance Analysis of Nanosheet Transistors for Analog ICs. In: Kalyan Biswas, Angsuman Sarkar (eds) Advanced Nanoscale MOSFET Architectures, pp. 221-253. Wiley. https://doi.org/10.1002/9781394188970.ch11. 

4. Bisht, A., Pundir, Y.P., Pal, P.K. (2022). Electro-Thermal Analysis of Vertically Stacked Gate All Around Nano-sheet Transistor. In: Shah, A.P., Dasgupta, S., Darji, A., Tudu, J. (eds) VLSI Design and Test. VDAT 2022. Communications in Computer and Information Science, vol 1687. Springer, Cham. https://doi.org/10.1007/978-3-031-21514-8_12. 

5. Pal, P.K., Kaushik, B.K., Dasgupta, S. (2013). Optimization of Underlap FinFETs and Its SRAM Performance Projections Using High-k Spacers. In: Gaur, M.S., Zwolinski, M., Laxmi, V., Boolchandani, D., Sing, V., Sing, A.D. (eds) VLSI Design and Test. Communications in Computer and Information Science, vol 382. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-42024-5_32