Publications

Annadurai, B. H., Ragumoorthy, C., Chen, S. M., Vengudusamy, R., & Kao, C. R. (2025). ZIF-67 on Graphitic Platforms: Carbon-Based Synergy for Trace-Level Metol Detection. Journal of Environmental Chemical Engineering, 119125.

Huang, J. H., Shih, P. S., Gräfner, S. J., Renganathan, V., Chen, Y. E., Hsieh, M. H., ... & Kao, C. R. (2025). Improvement of bonding interface in electroless copper-plated joints using a high copper concentration copper–quadrol complex solution. Materials Science in Semiconductor Processing, 194, 109601.

Lin, Y. H., Fang, I. C., Chang, F. L., Chang, C. C., & Kao, C. R. (2025). Diffusion Marker Experiment for Diffusion Between Silver and Solid Indium. Journal of Electronic Materials, 1-8.

Chang, F. L., Kao, C. R., & Shigetou, A. (2025, April). Hybrid Bonding of Cu and Manganin by using IPA-VUV Irradiation. In 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 89-90). IEEE.

Chang, C. C. B., & Kao, C. R. (2025, April). A Study on the Growth Kinetics and Mechanical Properties of IMCs in Au-In Joints. In 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 99-100). IEEE.

Shih, P. S., Chen, I. E., Kao, C. L., Lin, Y. S., Hung, Y. C., & Kao, C. R. (2025, April). Studies of the Twin Coherency on Electroless (111) Nanotwins. In 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 113-114). IEEE.

Tseng, Y. C., Lin, Y. S., Hung, Y. C., & Kao, C. R. (2025, April). Investigation of Cu-to-Cu Bonding Featuring Indium Passivation and a Tin Diffusion Barrier Layer. In 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 199-200). IEEE.

Tatsumi, H., Kao, C. R., & Nishikawa, H. (2025). Atomistic behavior of Cu–Cu solid-state bonding in polycrystalline Cu with high-density boundaries. Materials & Design, 250, 113576.

Pandiyan, A., Vengudusamy, R., Veeramuthu, L., Muthuraman, A., Wang, Y. C., Lee, H., ... & Kuo, C. C. (2025). Synergistic effects of size-confined mxene nanosheets in self-powered sustainable smart textiles for environmental remediation. Nano Energy, 133, 110426.

Lin, Y. H., Chang, F. L., Chen, Y. C., Wu, P. K., & Kao, C. R. (2024). Diffusion and marker experiments for the newly discovered CuIn2 compound. Materials Characterization, 217, 114316.

Shih, P. S., Chen, I. E., Kao, C. L., Lin, Y. S., Hung, Y. C., & Kao, C. R. (2024, October). Effect of Plating Temperature on the Crystallization and Texture Development of Highly (111) Oriented Electroless Cu Nanotwins. In 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (pp. 343-346). IEEE.

Annadurai, H., Vengudusamy, R., Chen, S. M., Lin, Y. H., Ku, Y. H., & Kao, C. R. (2024). Sonochemical Assisted Europium (III) Oxide–Graphitic-Carbon Nitride Nanocomposite for Reversible Electrochemical Detection of Quinol. Journal of The Electrochemical Society, 171(9), 097520.

Chang, C. C. B., & Kao, C. R. (2024). Phase Equilibria of the Binary Ag-In System. Journal of Phase Equilibria and Diffusion, 45(4), 790-803.

Chang, C. C. B., Chang, C. K., Chien, S. Y., & Kao, C. R. (2024). Low-temperature phase equilibria of the ternary Cu-In-Sn system at In-rich corner. Materialia, 36, 102154.

Shih, P. S., Huang, J. H., Gräfner, S. J., Kao, C. L., Lin, Y. S., Hung, Y. C., & Kao, C. R. (2024). Vertical Interconnections by Electroless Pd Atoms on Immersion Au Surface for Heterogeneous Integration. Journal of The Electrochemical Society, 171(7), 072502.

Chang, F. L., Lin, Y. H., Hung, H. T., & Kao, C. R. (2024). Experimental and thermodynamic assessment of the Cu–In system. Calphad, 85, 102700.

Gräfner, S. J., Huang, J. H., Wu, P. Y., Renganathan, V., Shih, P. S., & Kao, C. R. (2024). Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study. Advanced Materials, 36(19), 2307850.

Shih, M. L., Shih, P. S., Huang, J. H., Chen, I. A., Wang, J. S., Ko, C. T., ... & Kao, C. R. (2024, April). Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology. In 2024 International Conference on Electronics Packaging (ICEP) (pp. 1-2). IEEE.

Chang, F. L., Chen, Y. C., Lin, Y. H., Wu, P. K., Chuang, M. C., & Kao, C. R. (2024, April). Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder. In 2024 International Conference on Electronics Packaging (ICEP) (pp. 203-204). IEEE.

Chen, Y. C., Chang, F. L., Chuang, M. C., Su, Y. C., & Kao, C. R. (2024, April). A Thermodynamic Modeling Approach for the Design and Development of Low-Temperature Solder Alloys. In 2024 International Conference on Electronics Packaging (ICEP) (pp. 205-206). IEEE.

Huang, J. H., Shih, P. S., Renganathan, V., Gräfner, S. J., Lin, Y. C., Kao, C. L., ... & Kao, C. R. (2024). A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials, 17(7), 1638.

Chang, C. C. B., & Kao, C. R. (2024). Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System. Materials, 17(4), 883.

Annadurai, H., Vengudusamy, R., Chen, S. M., & Kao, C. R. (2024). Facile stoichiometric interfacial surface bonded cerium oxide and graphene oxide heterostructure for efficient electrochemical non-enzymatic detection of dopamine. Journal of Materials Chemistry B, 12(39), 9979-9990.

Tatsumi, H., Kao, C. R., & Nishikawa, H. (2023). Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations. Scientific Reports, 13(1), 23030.

Shih, P. S., Huang, C. H., & Kao, C. R. (2023). Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition. Journal of Alloys and Compounds, 958, 170531.

Hung, H. T., Chang, F. L., Tsai, C. H., Liao, C. Y., & Kao, C. R. (2023). Long-term aging study on the solid state interfacial reactions of In on Cu substrate. Materials, 16(18), 6263.

Shih, P. S., Huang, J. H., Shen, C. H., Lin, Y. C., Gräfner, S. J., Renganathan, V., ... & Kao, C. R. (2023, May). Low-temperature and pressureless Cu-to-Cu bonding by electroless Pd plating using microfluidic system. In 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (pp. 579-584). IEEE.

Huang, J. H., Shih, P. S., Shen, C. H., Renganathan, V., Gräfner, S. J., Lin, Y. C., ... & Kao, C. R. (2023, May). A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging. In 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (pp. 1660-1663). IEEE.

Chang, F. L., Lin, Y. H., Hung, H. T., Kao, C. W., & Kao, C. R. (2023). Artifact-free microstructures in the interfacial reaction between eutectic In-48Sn and Cu using ion milling. Materials, 16(9), 3290.

Tsai, C. H., Steiner, F., Ishikawa, D., Kao, C. R., & Blank, T. (2023, April). Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 97-98). IEEE.

Kung, P. Y., Huang, W. L., Kao, C. L., Hung, Y. C., & Kao, C. R. (2023, April). Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 29-30). IEEE.

Chang, F. L., Lin, Y. H., & Kao, C. R. (2023, April). Investigation of the Stability of CuIn 2 in Cu-In Phase Diagram. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 205-206). IEEE.

Tatsumi, H., Kao, C. R., & Nishikawa, H. (2023, April). Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding Parameters. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 149-150). IEEE.

Fang, I. C., Chang, F. L., Chang, C. C., & Kao, C. R. (2023, April). Interfacial Reaction Between Silver and Solid Indium. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 207-208). IEEE.

Gräfner, S. J., Huang, J. H., Renganathan, V., Kung, P. Y., Wu, P. Y., & Kao, C. R. (2023). Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications. Chemical Engineering Science, 269, 118474.

Gräfner, S. J., Huang, J. H., Shih, P. S., Renganathan, V., Kung, P. Y., Chen, Y. A., ... & Kao, C. R. (2022, December). Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications. In 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (pp. 644-649). IEEE.

Kung, P. Y., Huang, W. L., Kao, C. L., Lin, Y. S., Hung, Y. C., & Kao, C. R. (2022). Investigation of low-pressure Sn-passivated Cu-to-Cu direct bonding in 3D-integration. Materials, 15(21), 7783.

Balaji, R., Renganathan, V., Chu, C. P., Liao, Y. C., Kao, C. R., & Chen, S. M. (2022). Periodic copper microbead array on silver layer for dual mode detection of glyphosate. OpenNano, 8, 100105.

Yu, H., & Kao, C. R. (2022, October). Formation Mechanism of high Ni content (Cu, Ni) 6 Sn 5 in Cu/Sn/Ni microbump for solid state aging. In 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) (pp. 20-21). IEEE.

Gräfner, S. J., Wu, P. Y., & Kao, C. R. (2022). Flow in a microchannel filled with arrays of numerous pillars. International Journal of Heat and Fluid Flow, 97, 109045.

Huang, W. C., Tsai, C. H., & Kao, C. R. (2022, September). High-Temperature Reliability of Sintered Silver-Tin Alloy Paste for Die Attach Applications. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (pp. 326-329). IEEE.

Huang, J. H., Shih, P. S., Renganathan, V., Grӓfner, S. J., Chen, Y. A., Huang, C. H., ... & Kao, C. R. (2022). Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper‐glycerin complex solution. Electrochimica Acta, 425, 140710.

Tatsumi, H., Kao, C. R., & Nishikawa, H. (2022). Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation. Scientific Reports, 12(1), 12755.

Huang, W. C., Tsai, C. H., Lee, P. T., & Kao, C. R. (2022). Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging. Journal of Materials Research and Technology, 19, 3828-3841.

Tsai, C. H., Hung, H. T., Chang, F. L., Bickel, S., Mueller, M., Panchenko, I., ... & Kao, C. R. (2022). Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization. Journal of Materials Research and Technology, 19, 2510-2515.

Maheshwaran, S., Renganathan, V., Chen, S. M., Balaji, R., Kao, C. R., Chandrasekar, N., ... & Govarthanan, M. (2022). Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat. Chemosphere, 299, 134434.

Kao, C. W., Kung, P. Y., Chang, C. C., Huang, W. C., Chang, F. L., & Kao, C. R. (2022). Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps. Materials, 15(12), 4297.

Lee, P. T., Hsieh, W. Z., Lee, C. Y., Tseng, S. C., Tang, M. T., Chiang, C. Y., ... & Ho, C. E. (2022). Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure. Scripta Materialia, 214, 114682.

Lin, Y. S., Hung, Y. C., Kao, C. L., Lai, C. H., Shih, P. S., Huang, J. H., ... & Kao, C. R. (2022, May). Fine-pitch 30 μm Cu-Cu bonding by using low temperature microfluidic electroless interconnection. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 177-181). IEEE.

Gräfner, S. J., Huang, J. H., Chen, Y. A., Shih, P. S., Huang, C. H., & Kao, C. R. (2022, May). Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 539-547). IEEE.

Chen, Y. A., Shih, P. S., Chang, F. L., Gräfner, S. J., Huang, J. H., Huang, C. H., ... & Tarng, D. (2022, May). Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 956-961). IEEE.

Shih, P. S., Shen, C. H., Chen, Y. A., Huang, C. H., Gräfner, S. J., Huang, J. H., & Kao, C. R. (2022, May). A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 1294-1299). IEEE.

Huang, C. H., Shih, P. S., Huang, J. H., Gräfner, S. J., Chen, Y. A., & Kao, C. R. (2022, May). Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 2163-2167). IEEE.

Kao, C. W., Kung, P. Y., Chang, C. C., & Kao, C. R. (2022, May). Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers. In 2022 International Conference on Electronics Packaging (ICEP) (pp. 45-46). IEEE.

Tsai, C. H., Huang, W. C., & Kao, C. R. (2022). Development of Ag–In alloy pastes by mechanical alloying for die attachment of high-power semiconductor devices. Materials, 15(4), 1397.

Renganathan, V., Balaji, R., Chen, S. M., Chandrasekar, N., Maheshwaran, S., & Kao, C. R. (2022). Bifunctional nanocomposites based on SiO2/NiS2 combination for electrochemical sensing and environmental catalysis. Electroanalysis, 34(1), 111-121.

Zhu, Z. X., Renganathan, V., & Kao, C. R. (2021). Grain boundary diffusion of Ni through Au-doped Ni3Sn2 intermetallic compound for technological applications. Journal of Electronic Materials, 50(12), 6590-6596.

Tsai, C. H., Huang, W. C., Chew, L. M., Schmitt, W., Li, J., Nishikawa, H., & Kao, C. R. (2021). Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment. Journal of Materials Research and Technology, 15, 4541-4553.

Tsai, C. H., Lin, S. Y., Lee, P. T., & Kao, C. R. (2021). A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn. Intermetallics, 138, 107342.

Wu, P. Y., Pironneau, O., Shih, P. S., & Kao, C. R. (2021). Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow. Fluids, 6(11), 371.

Lee, P. T., Hsieh, W. Z., Lee, C. Y., Huang, Y. H., Chiang, C. Y., Ku, C. S., ... & Ho, C. E. (2021). Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5. Journal of Materials Research and Technology, 13, 1316-1322.

Lee, P. T., Hsieh, W. Z., Lee, C. Y., Kao, C. R., & Ho, C. E. (2021, May). White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal-into Monoclinic-Cu6Sn5. In 2021 International Conference on Electronics Packaging (ICEP) (pp. 113-114). IEEE.

Hung, H. T., Ma, Z. D., Shih, P. S., Huang, J. H., Kao, L. Y., Yang, C. Y., ... & Kao, C. R. (2021). Highly uniform microfluidic electroless interconnections for chip stacking applications. Electrochimica Acta, 376, 138032.

Maheshwaran, S., Balaji, R., Chen, S. M., Biswadeep, R., Renganathan, V., Narendhar, C., & Kao, C. R. (2021). Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone. New Journal of Chemistry, 45(6), 3215-3223.

Hung, H. T., Lee, P. T., Tsai, C. H., & Kao, C. R. (2020). Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing. Journal of Materials Research and Technology, 9(6), 12946-12954.

Hung, H. T., Yang, S., Shih, P. S., Ma, Z. D., Huang, J. H., & Kao, C. R. (2020, October). Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure. In 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (pp. 1-5). IEEE.

Chiu, Y. S., Kao, C. R., & Shigetou, A. (2020). Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure. Materials & Design, 195, 109065.

Wang, Y., & Kao, C. R. (2020, September). Interconnections of Low-Temperature Solder and Metallizations. In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (pp. 1-4). IEEE.

Weng, I. A., Hung, H. T., Huang, W. C., Kao, C. R., & Chen, Y. H. (2020). Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish. Journal of Electronic Materials, 49(8), 5003-5008.

Yang, T. H., Shintake, J., Kanno, R., Kao, C. R., & Mizuno, J. (2020). Low‐Cost Sensor‐Rich Fluidic Elastomer Actuators Embedded with Paper Electronics. Advanced Intelligent Systems, 2(8), 2000025.

Lin, Y. F., Hung, H. T., Yu, H. Y., Kao, C. R., & Wang, Y. W. (2020). Phase stabilities and interfacial reactions of the Cu–In binary systems. Journal of Materials Science: Materials in Electronics, 31(13), 10161-10169.

Tsai, C. H., Huang, W. C., Kao, C. R., Chew, L. M., Schmitt, W., & Nishikawa, H. (2020, June). Sintered micro-silver paste doped with indium for die attachment applications of power ICs. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (pp. 1430-1435). IEEE.

Lu, P. Y., Li, Y. R., Yen, C. M., Hung, H. T., Kao, C. R., Pu, W. C., ... & Liao, M. H. (2020, June). The real demonstration of high-quality carbon nano-tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (pp. 1573-1578). IEEE.

Sheikhi, R., Huo, Y., Tsai, C. H., Kao, C. R., Shi, F. G., & Lee, C. C. (2020). Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure. Journal of Materials Science: Materials in Electronics, 31(10), 8059-8071.

Liao, M. H., Lu, P. Y., Su, W. J., Chen, S. C., Hung, H. T., Kao, C. R., ... & Lee, M. H. (2020). The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance. IEEE Transactions on Electron Devices, 67(5), 2205-2207.

Chen, C. J., Lin, Y. M., Ni, T. H., Chang, T. C., Hung, H. T., Tsai, C. H., ... & Lee, C. C. (2020). Low Temperature SLID Bonding Approach in Fine Pitch Chip-stacking Structure with 30 μm-pitch Interconnections. Transactions of The Japan Institute of Electronics Packaging, 13, E20-010.

Yu, H. Y., Yang, T. H., Chiu, Y. S., & Kao, C. R. (2020). Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars: Yu, Yang, Chiu, and Kao. Journal of Electronic Materials, 49(1), 88-95.

Wang, Y. W., & Kao, C. R. (2019, December). Interfacial reactions of Cu and In for Low-temperature processes. In 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (pp. 435-439). IEEE.

Kao, C. R., Hung, H. T., & Chen, Y. H. (2019, September). Microfluidic Electroless Interconnection (MELI) Process for Low-Temperature, Pressureless Chip Stacking Applications. In Electrochemical Society Meeting Abstracts 236 (No. 28, pp. 1246-1246). The Electrochemical Society, Inc..

Chiang, P. J., Wu, J. Y., Yu, H. Y., & Kao, C. R. (2019). Creep behaviors along characteristic crystal orientations of Sn and Sn-1.8 Ag by using nanoindentation. Jom, 71(9), 2998-3011.

Wang, Y. W., Zhu, Z. X., Shih, W. L., & Kao, C. R. (2019). Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples. Journal of Alloys and Compounds, 799, 108-112.

Hung, H. T., Yang, S., Weng, I. A., Chen, Y. H., & Kao, C. R. (2019, May). Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 1729-1734). IEEE.

Wu, J. Y., Kao, C. R., & Yang, J. M. (2019, May). Mechanical reliability assessment of Cu_6Sn_5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 2258-2265). IEEE.

Yang, T. H., Chiu, Y. S., Yu, H. Y., Shigetou, A., & Kao, C. R. (2019, May). A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 235-242). IEEE.

Li, S., Suen, W., Kao, C., Yang, M., Lin, P., & Yang, L. (2019). 880 Gasdermin A3-mediated cell death causes niche collapse and precocious activation of hair follicle stem cells. Journal of Investigative Dermatology, 139(5), S152.

Yang, T. H., Yang, C. Y., Shigetou, A., & Kao, C. R. (2019, April). A single process for homogeneous and heterogeneous bonding in flexible electronics: Ethanol-assisted vacuum ultraviolet (E-VUV) irradiation process. In 2019 International Conference on Electronics Packaging (ICEP) (pp. 117-122). IEEE.

Kao, L. Y., Hung, H. T., Chen, Y. H., & Kao, C. R. (2019, April). Bonding of Copper Pillars Using Electroless Cu Plating. In 2019 International Conference on Electronics Packaging (ICEP) (pp. 220-222). IEEE.

Wu, J. Y., Chiu, Y. S., Wang, Y. W., & Kao, C. R. (2019). Mechanical characterizations of single-crystalline (Cu, Ni) 6Sn5 through uniaxial micro-compression. Materials Science and Engineering: A, 753, 22-30.

Chiu, Y. S., Yu, H. Y., Hung, H. T., Wang, Y. W., & Kao, C. R. (2019). Phase formation and microstructure evolution in Cu/In/Cu joints. Microelectronics Reliability, 95, 18-27.

Weng, I. A., Hung, H. T., Yang, S., Kao, C. R., & Chen, Y. H. (2019). Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits. Scripta Materialia, 159, 119-122.

Wang, Y. W., Shih, W. L., Hung, H. T., & Kao, C. R. (2019). Reaction within Ni/Sn/Cu microjoints for chip-stacking applications. Journal of Electronic Materials, 48(1), 25-31.

Chung, C. K., Yu, J. J., Yang, T. L., & Kao, C. R. (2019). Refine microstructure of solder materials via minor element additions. In 13th Electronic Circuits World Convention: Connecting the World, ECWC 2014. VDE Verlag GmbH.

Yang, T. H., Chiu, Y. S., Yang, C. Y., Shigetou, A., & Kao, C. R. (2019). Polyimide-polyetheretherketone and tin-polyimide direct bonding via ethanol-assisted vacuum ultraviolet irradiation. Transactions of The Japan Institute of Electronics Packaging, 12, E19-012.

Yu, J. J., Wu, J. Y., Yu, L. J., & Kao, C. R. (2019). Micropillar mechanics of Sn-based intermetallic compounds. In Handbook of Mechanics of Materials (pp. 873-899). Springer, Singapore.

Yang, T. H., Yu, H. Y., Wang, Y. W., & Kao, C. R. (2019). Effects of aspect ratio on microstructural evolution of Ni/Sn/Ni microjoints. Journal of Electronic Materials, 48(1), 9.

Yang, C. A., Yang, S., Liu, X., Nishikawa, H., & Kao, C. R. (2018). Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium. Journal of Alloys and Compounds, 762, 586-597.

Yang, C. A., Wu, J., Lee, C. C., & Kao, C. R. (2018). Analyses and design for electrochemical migration suppression by alloying indium into silver. Journal of Materials Science: Materials in Electronics, 29(16), 13878-13888.

Wang, Y. W., Yang, T. L., Wu, J. Y., & Kao, C. R. (2018). Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications. Journal of Alloys and Compounds, 750, 570-576.

Yang, S., Hung, H. T., Nishikawa, H., & Kao, C. R. (2018, May). Development of low-temperature, pressureless copper-to-copper bonding by microfluidic electroless interconnection process. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 308-313). IEEE.

Chiu, Y. S., & Kao, C. R. (2018, May). Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 890-895). IEEE.

Yang, C. A., Kao, C. R., Nishikawa, H., & Lee, C. C. (2018, May). High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 1993-1999). IEEE.

Nishikawa, H., Yang, S., Kao, C. R., & Hung, H. T. (2018, May). Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE.

Yang, S., Hung, H. T., Wu, P. Y., Wang, Y. W., Nishikawa, H., & Kao, C. R. (2018). Materials merging mechanism of microfluidic electroless interconnection process. Journal of The Electrochemical Society, 165(7), D273.

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Yu, J. J., Wu, J. Y., Yu, L. J., Yang, H. W., & Kao, C. R. (2017). Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation. Journal of Materials Science, 52(12), 7166-7174.

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Key Chung, C., Zhu, Z. X., & Kao, C. R. (2015). Thermal stress of surface oxide layer on micro solder bumps during reflow. Journal of Electronic materials, 44(2), 744-750.

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Ke, J. H., Boyne, A., Wang, Y., & Kao, C. R. (2014). Phase field microelasticity model of dislocation climb: Methodology and applications. Acta materialia, 79, 396-410.

Yang, T. L., Yu, J. J., Shih, W. L., Hsueh, C. H., & Kao, C. R. (2014). Effects of silver addition on Cu–Sn microjoints for chip-stacking applications. Journal of alloys and compounds, 605, 193-198.

Huang, T. C., Yang, T. L., Ke, J. H., Hsueh, C. H., & Kao, C. R. (2014). Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing. Scripta Materialia, 80, 37-40.

Li, C. C., Shih, W. L., Chung, C. K., & Kao, C. R. (2014). Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals. Corrosion Science, 83, 419-422.

Yang, T. L., Shih, W. L., Yu, J. J., & Kao, C. R. (2014, May). Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 2277-2282). IEEE.

Li, C. C., Chung, C. K., Shih, W. L., & Kao, C. R. (2014). Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints. Metallurgical and Materials Transactions A, 45(5), 2343-2346.

Yang, T. L., Huang, K. Y., Yang, S., Hsieh, H. H., & Kao, C. R. (2014). Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer. Solar Energy Materials and Solar Cells, 123, 139-143.

Chen, Y. J., Yang, T. L., Yu, J. J., Kao, C. L., & Kao, C. R. (2013). Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections. Materials Letters, 110, 13-15.

Chung, C. K., Yu, J. J., Yang, T. L., & Kao, C. R. (2013, October). Grain refinement of solder materials by minor element addition. In 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (pp. 124-127). IEEE.

Yang, T. L., Ke, J. H., Shih, W. L., Lai, Y. S., & Kao, C. R. (2013). Serrated cathode dissolution under high current density: Morphology and root cause. Journal of Applied Physics, 114(5).

Li, C. C., Zhu, Z. X., Liao, L. L., Dai, M. J., Liu, C. K., & Kao, C. R. (2013). Assembly of N type Bi2 (Te, Se) 3 thermoelectric modules by low temperature bonding. Science and Technology of Welding and Joining, 18(5), 421-424.

Chung, C. K., Chen, Y. J., Yang, T. L., & Kao, C. R. (2013). Reactions of Sn-4.0 Ag-0.5 Cu on Cu and electroless Ni substrate in premelting soldering process. Journal of electronic materials, 42(6), 1254-1259.

Huang, T. C., Yang, T. L., Ke, J. H., Li, C. C., & Kao, C. R. (2013). Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing. Journal of alloys and compounds, 555, 237-240.

Chen, Y. J., Huang, K. Y., Chen, H. T., & Kao, C. R. (2013, February). Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications. In 2013 IEEE International Symposium on Advanced Packaging Materials (pp. 102-112). IEEE.

Li, C. C., Zhu, Z. X., Chen, M. H., & Kao, C. R. (2013, February). Volume shrinkage induced by interfacial reactions in micro joints. In 2013 IEEE International Symposium on Advanced Packaging Materials (pp. 8-14). IEEE.

Yu, J. J., Chung, C. K., Yang, S., & Kao, C. R. (2013, February). Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications. In 2013 IEEE International Symposium on Advanced Packaging Materials (pp. 113-120). IEEE.

Lin, C. H., Chuang, H. Y., & Kao, C. R. (2013). Cu (TiWNx) Film as a barrierless buffer layer for metallization applications. Japanese Journal of Applied Physics, 52(1S), 01AC12.

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Chen, Y. J., Chung, C. K., Yang, C. R., & Kao, C. R. (2013). Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. Microelectronics Reliability, 53(1), 47-52.

Chung, C. K., Huang, T. C., Shia, R., Yang, T. L., & Kao, C. R. (2012). Roles of phosphorous in Sn4Ag0. 5Cu solder reaction with electrolytic Ni–Au. Journal of alloys and compounds, 539, 57-62. 

Chung, C. K., Chen, Y. J., Li, C. C., & Kao, C. R. (2012). The critical oxide thickness for Pb-free reflow soldering on Cu substrate. Thin Solid Films, 520(16), 5346-5352.

Chung, C. K., Chen, Y. J., Chen, W. M., & Kao, C. R. (2012). Origin and evolution of voids in electroless Ni during soldering reaction. Acta materialia, 60(11), 4586-4593.

Kao, C. R., Chuang, H. Y., Chen, W. M., Yang, T. L., Kuo, M. S., Chen, Y. J., ... & Li, C. C. (2012, May). Soldering reactions under space confinement for 3D IC applications. In 2012 IEEE 62nd Electronic Components and Technology Conference (pp. 724-728). IEEE.

Chen, W. M., Kang, S. K., & Kao, C. R. (2012, May). Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium. In 2012 IEEE 62nd Electronic Components and Technology Conference (pp. 729-735). IEEE.

Chen, W. M., Kang, S. K., & Kao, C. R. (2012). Effects of Ti addition to Sn–Ag and Sn–Cu solders. Journal of alloys and compounds, 520, 244-249.

Ke, J. H., Chuang, H. Y., Shih, W. L., & Kao, C. R. (2012). Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing. Acta materialia, 60(5), 2082-2090.

Chuang, H. Y., Yu, J. J., Kuo, M. S., Tong, H. M., & Kao, C. R. (2012). Elimination of voids in reactions between Ni and Sn: A novel effect of silver. Scripta Materialia, 66(3-4), 171-174.

Chuang, H. Y., Yang, T. L., Kuo, M. S., Chen, Y. J., Yu, J. J., Li, C. C., & Kao, C. R. (2012). Critical concerns in soldering reactions arising from space confinement in 3-D IC packages. IEEE Transactions on Device and Materials Reliability, 12(2), 233-240.

Yang, T. L., Chuang, H. Y., Shih, W. L., Lai, Y. S., & Kao, C. R. (2012). Effects of Minor Alloy Additions on the Interfacial Reactions with Low Solder Volume for 3D IC Applications. In AIP Conference Proceedings. American Institute of Physics, Ste. 1 NO 1 Melville NY 11747-4502 United States.

Chang, C. C., Chen, Y. J., Tsai, M. Y., & Kao, C. R. (2011). Laminar pattern induced by cycling thermomechanical stress in two-phase materials. Materials Chemistry and Physics, 130(1-2), 413-417.

Tsai, M. Y., Lin, Y. L., Tsai, M. H., Chen, Y. J., & Kao, C. R. (2011). Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing. Journal of electronic materials, 40(10), 2076-2080.

Liu, C. S., Ho, C. E., Peng, C. S., & Kao, C. R. (2011). Effects of joining sequence on the interfacial reactions and substrate dissolution behaviors in Ni/solder/Cu joints. Journal of electronic materials, 40(9), 1912-1920.

Chen, W. M., Yang, T. L., Chung, C. K., & Kao, C. R. (2011). The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction. Scripta Materialia, 65(4), 331-334.

Chuang, H. Y., Chen, W. M., Shih, W. L., Lai, Y. S., & Kao, C. R. (2011, May). Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging. In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (pp. 1723-1728). IEEE.

Lu, Y. H., Wang, Y. W., Appelt, B. K., Lai, Y. S., & Kao, C. R. (2011, May). Growth of CuAl intermetallic compounds in Cu and Cu (Pd) wire bonding. In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (pp. 1481-1488). IEEE.

Chang, C. C., Yang, S. C., Chen, Y. J., & Kao, C. R. (2011). Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder. International Journal of Materials Research, 102(5), 579-583.

Ke, J. H., Yang, T. L., Lai, Y. S., & Kao, C. R. (2011). Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing. Acta Materialia, 59(6), 2462-2468.

Chuang, H. Y., Chen, W. M., Shih, W. L., Lai, Y. S., & Kao, C. R. (2011). Proceedings–61st electronic components and technology conference.

Kao, C. R. (2011). Growth of CuAl Intermetallics in Cu and Cu (Pd) Wire Bonding. In Proc. 61th Electron. Comp. Technol. Conf., Lake Buena Vista, 2011.

Yang, T. L., Ke, J. H., & Kao, C. R. (2011). Study of Interfacial Morphology in Flip Chip Solder Joints under Extra- High Current Density with Local Temperature Control. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.

Chuang, H., Ke, J., Chung, C., Li, C., & Kao, C. (2011). Distribution of Pd within Solder Joints in the Reaction between SAC 305 and ENEPIG Surface Finish. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.

Chen, J., Lai, Y. S., Wang, Y. W., & Kao, C. R. (2011). Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding. Microelectronics reliability, 51(1), 125-129.

Chang, C. C., Chung, H. Y., Lai, Y. S., & Kao, C. R. (2010). Interaction between Ni and Cu across 95Pb-5Sn high-lead layer. Journal of electronic materials, 39(12), 2662-2668.

Tsai, M. Y., Lin, Y. L., Lin, Y. W., Ke, J. H., & Kao, C. R. (2010). Transmission Electron Microscopy Characterization of Ni (V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints. Journal of electronic materials, 39(12), 2528-2535.

Wang, Y. W., Chang, C. C., Chen, W. M., & Kao, C. R. (2010). Effects of Ni additions on the growth of Cu3Sn in high-lead solders. Journal of electronic materials, 39(12), 2636-2642.

Chang, C. C., & Kao, C. (2010, October). Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-4). IEEE.

Yang, T. L., & Kao, C. R. (2010, October). Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-5). IEEE.

Chen, W. M., & Kao, C. R. (2010, October). Spectacular epitaxial growth of (Cu, Ni) 6 Sn 5 formed on Ni substrate. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-3). IEEE.

Ke, J. H., & Kao, C. R. (2010, October). Temperature effects on electromigration behavior of solder joints. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-4). IEEE.

Lee, C. C., Chuang, H. Y., Chung, C. K., & Kao, C. R. (2010, October). Oxidation behavior of ENIG and ENEPIG surface finish. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-4). IEEE.

Chuang, H. Y., Lin, C. H., Chu, J. P., & Kao, C. R. (2010). Novel Cu–RuNx composite layer with good solderability and very low consumption rate. Journal of alloys and compounds, 504(2), L25-L27.

Tsai, M. H., Chen, W. M., Tsai, M. Y., & Kao, C. R. (2010). Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions. Journal of alloys and compounds, 504(2), 341-344.

Chang, C. C., Wang, Y. W., Lai, Y. S., & Kao, C. R. (2010). Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints. Journal of electronic materials, 39(8), 1289-1294.

Chen, W. M., Yang, S. C., Tsai, M. H., & Kao, C. R. (2010). Uncovering the driving force for massive spalling in the Sn–Cu/Ni system. Scripta Materialia, 63(1), 47-49.

Chung, C. K., Duh, J. G., & Kao, C. R. (2010). Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction. Scripta Materialia, 63(2), 258-260.

Yang, S. C., Chang, C. C., Tsai, M. H., & Kao, C. R. (2010). Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni. Journal of Alloys and Compounds, 499(2), 149-153.

Tsai, M. Y., Yang, S. C., Wang, Y. W., & Kao, C. R. (2010). Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems. Journal of alloys and compounds, 494(1-2), 123-127.

Lin, Y. W., Ke, J. H., Chuang, H. Y., Lai, Y. S., & Kao, C. R. (2010). Electromigration in flip chip solder joints under extra high current density. Journal of Applied Physics, 107(7).

Wang, Y. W., Lin, Y. W., & Kao, C. R. (2010). Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders. Journal of Alloys and Compounds, 493(1-2), 233-239.

Chang, C. C., Lin, Y. W., Wang, Y. W., & Kao, C. R. (2010). The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering. Journal of Alloys and Compounds, 492(1-2), 99-104.

Chen, W. M., Yang, S. C., & Kao, C. (2010). Uncovering the Driving Force for Massive Spalling. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Wu, P. H., & Kao, C. (2010). The Effect of Temperature on the Critical Cu Concentration in SnCu/Ni Reaction. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Ke, J. H., Lin, Y. W., & Kao, C. R. (2010). Electromigration Study of Flip Chip Packages under Extra-high Current Density Tests with Temperature Control. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Wang, Y. W., & Kao, C. (2010). On the Mechanism of Retarding Cu 3 Sn Growth by Ni Addition. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Yang, T. L., Lin, Y. L., Chuang, H. Y., & Kao, C. (2010). Study of UBM Consumption in Flip Chip Solder Joints with Local Temperature Control. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Tsai, M. Y., Lin, Y. L., & Kao, C. (2010). TEM Characterization of the Porous Structure Induced by High Current Density in the Flip-Chip Solder Joint. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.

Chang, C. C., Lin, Y. W., Lai, Y. S., & Kao, C. R. (2009). Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates. Journal of electronic materials, 38(11), 2234-2241.

Tsai, M. H., Lin, Y. W., Chuang, H. Y., & Kao, C. R. (2009). Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate. Journal of Materials Research, 24(11), 3407-3411.

Chang, C. C., Lin, C. C., & Kao, C. R. (2009, October). Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (pp. 72-75). IEEE.

Chang, C. C., & Kao, C. R. (2009, October). Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (pp. 44-47). IEEE.

Tsai, M. Y., Lin, Y. L., & Kao, C. R. (2009, October). Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (pp. 444-447). IEEE.

Wang, Y. W., & Kao, C. R. (2009, October). Effects of Ni addition to high-lead solders on the growth of Cu 3 Sn and micro voids. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (pp. 64-67). IEEE.

Wang, Y. W., & Kao, C. R. (2009, August). Development of lead-free solders with superior drop test reliability performance. In 2009 International Conference on Electronic Packaging Technology & High Density Packaging (pp. 534-539). IEEE.

Lai, Y. S., Kao, C. R., Chang, H. C., & Kao, C. L. (2009). Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints. Soldering & surface mount technology, 21(3), 4-9.

Wang, Y. W., Chang, C. C., & Kao, C. R. (2009). Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth. Journal of Alloys and Compounds, 478(1-2), L1-L4.

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Gu, X., & Chan, Y. C. (2009). Thermomigration and electromigration in Sn58Bi solder joints. Journal of applied physics, 105(9).

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Kao, S. T., & Duh, J. G. (2005). Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization. Journal of electronic materials, 34(8), 1129-1134.

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Ho, C. E., Luo, W. C., Yang, S. C., & Kao, C. R. (2005, June). Copper concentration effect and solder volume effect on the soldering reactions between Sn-Ag-Cu lead-free solders and Ni. In Proceedings of IMAPS Taiwan 2005 International Technical Symposium, Taipei (p. 98).

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Lin, Y. H., Hu, Y. C., Tsai, C. M., Kao, C. R., & Tu, K. N. (2005). In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing. Acta materialia, 53(7), 2029-2035.

Ho, C. E., Lin, Y. W., Yang, S. C., & Kao, C. R. (2005, March). Volume effect on the soldering reaction between SnAgCu solders and Ni. In Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. (pp. 39-44). IEEE.

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Wu, A. T., Tamura, N., Lloyd, J. R., Kao, C. R., & Tu, K. N. (2005). Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigration. MRS Online Proceedings Library (OPL), 863, B9-10.

Lin, Y. H., Tsai, C. M., Hu, Y. C., Lin, Y. L., & Kao, C. R. (2005). Electromigration-induced failure in flip-chip solder joints. Journal of electronic materials, 34(1), 27-33.

Kao, S. T., & Duh, J. G. (2004). Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying. Journal of electronic materials, 33(12), 1445-1451.

Tsai, C. M., Luo, W. C., Chang, C. W., Shieh, Y. C., & Kao, C. R. (2004). Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints. Journal of electronic materials, 33(12), 1424-1428.

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Lin, Y. L., Luo, W. C., Lin, Y. H., Ho, C. E., & Kao, C. R. (2004). Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints. Journal of electronic materials, 33(10), 1092-1097.

Wu, A. T., Tu, K. N., Lloyd, J. R., Tamura, N., Valek, B. C., & Kao, C. R. (2004). Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Applied Physics Letters, 85(13), 2490-2492.

Ho, C. E., & Kao, C. R. (2004). Interfacial reaction between solders and surface finishes. In TPCA Forum (pp. 238-246).

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Lin, Y. H., Hu, Y. C., Tsai, C. M., Kao, C. R., & Tu, K. N. (2003, September). New Electromigration Failure Mode in Flip Chip Solder Joints. In SMTA International (Vol. 5, No. 1, pp. 312-317). Surface Mount Technology Association.

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Lin, Y. L., Tsai, J., & Kao, C. R. (2002, December). Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. (pp. 324-329). IEEE.

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Ho, C. E., Lin, Y. L., & Kao, C. R. (2002). Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni. Chemistry of materials, 14(3), 949-951.

Chen, W. T., Ho, C. E., & Kao, C. R. (2002). Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. Journal of materials research, 17(2), 263-266.

Liu, C. M., Ho, C. E., Chen, W. T., & Kao, C. R. (2001). Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish. Journal of electronic Materials, 30(9), 1152-1156.

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