Activities

Invited Talk, “Using Microfluidic Electroless Deposition Process for Low-Temperature, Pressureless Interconnection Bonding,” presented at The 30th Topical Meeting of the International Society of Electrochemistry, Taipei, November 21-24, 2021.

Invited Talk, “Microfluidic Electroless Interconnection (MELI) Process for Low-Temperature, Pressureless Chip-stacking Applications,” presented at The 236th Electrochemical Society Meeting, Atlanta, October 13-17, 2019.

Invited Talk, “Enhancement of Nano-Silver Chip Attachment by Using Transient Liquid Phase Reaction with Indium,” presented at The 20th International Conference on Electronic Packaging Technology, Hong Kong, August, 11-15, 2019.

Invited Talk, “Enhancement of Nano-Silver Chip Attachment by Using Transient Liquid Phase Reaction with Indium,” presented at International Conference on Electronic Packaging, Niigata, Japan, April 17-20, 2019.

Invited Talk, “Microfluidic Electroless Interconnection Process for Low-Temperature, Pressureless Chip-stacking,” presented at The 20th Electronics Packaging Technology Conference, Singapore, December 4-7, 2018.

Invited Talk, “Microfluidic Electroless Interconnection Process for Low-Temperature, Pressureless Chip-stacking " presented at The 20th International Conference on Electronics Materials and Packaging, Hong Kong, December 17-20, 2018.

Keynote Speaker, “Bonding Cu pillars by using the Microfluidic ElectroLess Interconnection (MELI) process,” presented at the 16th International Symposium on Microelectronics and Packaging, Seoul, Korea, October 17-19, 2017.

Invited Talk, “Bonding Cu Plillars by Using Electroless Plating,” presented at the "13th TMS Workshop on Emerging Electronic Interconnect Materials and Processing for Advanced Packaging Technology" during The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017.

Invited Talk, “Low-temperature and pressureless Cu-to-Cu bonding by electroless nickel plating,” presented at the "Frontiers in Materials Science, Engineering, and Technology Symposium" during The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017.

“2017 Taiwan-Japan Workshop on Electronic Interconnection I,” National Taiwan University, October 24, 2017. Organizer: C. Robert Kao.

“Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology,” The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017. Organizer: Fan-Yi Ouyang, C. Robert Kao, Albert T Wu, Fay Hua, Yan Li, Babak Arfaei, Kazuhiro Nogita.

“Pb-free Solders and Emerging Interconnect and Packaging Materials,” The Minerals, Metals & Materials Society 2014 Annual Meeting, San Diego, CA, February 16-20, 2014. Organizer: Andre Lee, Fay Hua, Tae-Kyu Lee, John Elmer, Yan Li, C. Robert Kao, Fan-yi Ouyang, Chang-Woo Lee, Won Sik Hong, Heugel Werner.

“Materials and Processes for Advanced Interconnects and Packaging Technologies,” International Union of Materials Research Societies – International Conference on Electronic Materials, Taipei, June 10-14, 2014. Organizer: A. T. Wu, C. M. Chen, C. R. Kao, C. E. Ho, J. G Duh. J. M. Song, K. L. Lin, S. K. Lin, and W. P. Dow.

“Phase Stability, Diffusion, Kinetics and Their Applications V,” Materials Science & Technology 2010 Conference, Houston, TX, October 17-21, 2010, Organizer: John Morral (Ohio State University), Raymundo Arroyave (Texas A & M University), Yongho Sohn (University of Central Florida), Sudarsanam Babu (Ohio State University), C. Robert Kao (National Taiwan University), and Jingxian Zhang (Carpenter Technology).

“Pb-Free, Pb-Bearing Joining and Packaging Materials and Processes for Microelectronics,” Materials Science & Technology 2009 Conference, Pittsburgh, PA, October 25-29, 2009. Organizer: Andre Lee (Michigan State University) and C. R. Kao (National Taiwan University).

“Electronic, Magnetic and Photonic Materials Division Symposium: Advanced Metallizations and Interconnect Technologies, in Honor of Prof. K. N. Tu’s 70th Birthday,” The Minerals, Metals & Materials Society 2007 Annual Meeting, Orlando, FL, February 25 – March 1, 2007. Organizer: C. Chen (National Chiao Tung University), L. J. Chen (National Tsing Hua University), Ulrich Goesele (Max Planck Institute of Microstructure Physics), C. R. Kao (National Central University), and S. W. Chen (Tsing-Hua University).

“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials V Symposium,” The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, March 12-16, 2006. Organizer: K. Suganuma (Osaka University), D. Swenson (Michigan Tech. Univ.), S. Chada (Jabil Circuit), S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), , H. M. Lee (KAIST), and S. E. Mohney (Pennsylvania State University).

“Current Topic in Electronic Packaging: Pb-Free Solders, Thermal Management Symposium,” Materials Science & Technology 2005 Conference, Pittsburgh, PA, September 25-28, 2005. Organizer: Eric J. Cotts (SUNY – Binghamton), C. R. Kao (National Central University), Mark A. Palmer (Kettring University), K. N. Subramanian (Michigan State University), Paul T. Vianco (Sandia National Laboratories), and K. M. Nair.

“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium,” The Minerals, Metals & Materials Society 2005 Annual Meeting, San Francisco, CA, February 13-17, 2005. Organizer: D. Swenson (Michigan Tech. Univ.), S. Chada (Jabil Circuit), S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), and K. Suganuma (Osaka University).

“Lead-Free and Lead-Bearing Solders Symposium,” Materials Science & Technology 2004 Conference, New Orleans, LA, September 26-30, 2004. Organizer: C. R. Kao (National Central University), K. N. Subramanian (Michigan State University), and W. Plumbridge (Open University).

“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III Symposium,” The Minerals, Metals & Materials Society 2004 Annual Meeting, Charlotte, NC, March 14-18, 2004. Organizer: C. R. Kao (National Central University), S. W. Chen (Tsing-Hua University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), M. R. Notis (Lehigh University), and D. Swenson (Michigan Tech.).

 “Lead-Free and Lead-Bearing Solders Symposium,” Materials Science & Technology 2003 Conference, Chicago, IL, November 9-12, 2003. Organizer: K. N. Subramanian (Michigan State University), C. R. Kao (National Central University).

“Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging,” The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003. Organizer: James P. Lucas (Michigan State University), Srinivas Chada (Motorola), Sung K. Kang (IBM), Kwang-Lung Lin, (National Cheng Kung University), Jin Yu (KAIST), C. Robert Kao (National Central University).

“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium,” The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003. Organizer: S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), M. R. Notis (Lehigh University), and D. Swenson (Michigan Tech.).

“Lead-Free and Lead-Bearing Solders Symposium,” The Minerals, Metals & Materials Society 2002 Fall Meeting, Columbus, OH, October 6-10, 2002. Organizer: K. N. Subramanian (Michigan State University), C. R. Kao (National Central University), and M. Pfeifer (Motorola).

“Lead-Free Solders and Materials Issues in Microelectronic Packaging Symposium,” The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002. Organizer: S. Chada (Motorola), D. Frear (Motorola), J. Sungho (Lucent), S. K. Kang (IBM), C. R. Kao (National Central University), M. Pfeifer (Motorola), and M. Weiser, (Honeywell Electronics Materials).

“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium,” The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002. Organizer: S. W. Chen (Tsing-Hua University), M. R. Notis (Lehigh University), H. M. Lee (KAIST), D. Swenson (Michigan Tech.), and C. R. Kao (National Central University).

“Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for Electronic Packaging Symposium,” The Minerals, Metals & Materials Society 2001 Fall Meeting, Indianapolis, IN, November 4-8, 2001. Organizer: C. R. Kao (National Central University), S. Chada (Motorola), Z. Mei, (Fujitsu), G. Ghosh (Northwestern), S. W. Chen (Tsing-Hua University), and P. S. Godavarti (FlipChip Technologies).

“Lead-Free Solder Materials and Soldering Technologies Symposium,” The Minerals, Metals & Materials Society 2001 Annual Meeting, New Orleans, LA, February 11-15, 2001. Organizer: S. K. Kang (IBM), H. Mavoori (Lucent Technologies), S. Chada (Motorola), C. R. Kao (National Central University), and R. W. Smith (Materials Resources International).