Emerging Topics and Future Directions 

Device-driven etch challenges

• • 1. • Addressing etch requirements driven by next-generation devices, including high aspect ratio structures, new materials, and tight dimensional control.

       • Focuses on translating device needs into robust, repeatable etch processes across platforms. 

Atomic-scale processing (ALE)

• Exploring atomic layer etching for precise, layer-by-layer material removal with sub-nanometer control.

• Enables damage-free processing for advanced nodes, quantum devices, and sensitive materials. 

Cryogenic etching

• Utilizing low-temperature plasma processes to achieve smooth sidewalls, high anisotropy, and reduced defects.

• Critical for applications requiring ultra-high aspect ratios and minimal surface roughness. 

Plasma diagnostics and control

• • 1. • Advancing in-situ and ex-situ diagnostics to better understand plasma behavior and process variability.

       • Focuses on real-time monitoring and control strategies to improve repeatability and yield. 

Modeling, AI, and machine learning

• • 1. • Leveraging simulation, data-driven models, and AI/ML to predict and optimize plasma etch processes.

       • Aims to accelerate process development and enable intelligent, adaptive fabrication workflows. 

Sustainable plasma processing

• • 1. • Developing environmentally responsible etch processes by reducing energy use and harmful chemistries.

       • Focuses on green alternatives, process efficiency, and long-term sustainability in microfabrication. 

& More