Publications
Book and Book Chapter:
1. Published a Book on "Modelling and Simulation of CNT and GNR Interconnects" in Lambert Academic Publishers (2019).
2. Published a Book Chapter on "Modelling Interconnects for Future VLSI Circuit Applications" in Book entitled "VLSI and Post-CMOS Devices, Circuits and Modelling" published by IET (2019).
3. Published a Book Chapter on "Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models" in Book entitled "Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design" published by CRC Press (2023).
International Journals
J27. S. Bardhan, M. Sahoo, J. Samanta, and H. Rahaman, "A Quasi-Ballistic Model For Short Channel Monolayer Graphene Field Effect Transistor Including Scattering Effects", IETE Journal of Research, Taylor and Francis Publishers, 2024 (Accepted), DOI: 10.1080/03772063.2024.2352154.
J26. N. K. Singh, and M. Sahoo, "Comparative Investigation of Different Doping Techniques in TMD Tunnel FET for Subdeca Nanometer Technology Nodes", Journal of Electronic Materials, May, 2023, DOI :10.1007/s11664-023-10505-8, Link: https://rdcu.be/ddEh2 .
J25. S. K. Dora, H. B. Mishra, and M. Sahoo, "Low Complexity Implementation of OTFS Transmitter using Fully Parallel and Pipelined Hardware Architecture", Journal of Signal Processing Systems, pg. 1-10, 2023, DOI: https://doi.org/10.1007/s11265-023-01847-x.
J24. M. Kumari, N. K. Singh and M. Sahoo, “A detailed investigation of dielectric-modulated dual-gate TMD FET based label-free biosensor via analytical modelling", Nature Scientific Reports, 12:21115, 2022, DOI: https://doi.org/10.1038/s41598-022-24677-6, Link for the paper: https://rdcu.be/c09iE.
J23. B. Kumari, R. Y. Sharma and M. Sahoo, “Electro-Thermal Modeling and Reliability Analysis of Cu-Carbon Hybrid Interconnects for Beyond-CMOS Computing", Applied Physics Letters, 2022, DOI: https://doi.org/10.1063/5.0101329.
J22. N. K. Singh, M. Kumari and M. Sahoo, "All Region Analytical Modeling of 2-D Transition Metal Dichalcogenide FET by Considering effect of Fringing field and Region-wise Mobility", Physica E: Low-dimensional Systems and Nanostructures, 2022, DOI: https://doi.org/10.1016/j.physe.2022.115480.
J21. B. Kumari, P. Santosh, R. Y. Sharma and M. Sahoo, “Thermal-Aware Modeling and Analysis of Cu-Mixed CNT Nanocomposite Interconnects", IEEE Transactions on Nanotechnology, IEEE Publishers, vol. 21, pp. 163-171, 2022, DOI: 10.1109/TNANO.2022.3160870.
J20. B. Kumari, R. Y. Sharma and M. Sahoo, “Performance and Reliability Improvement in Intercalated MLGNR Interconnects using Optimized Aspect Ratio ”, Nature Scientific Reports, 12:1475, 2022, DOI: 10.1038/s41598-022-05222-x,
Link for the paper: https://rdcu.be/cFOQT.
J19. N. K. Singh and M. Sahoo, “Analytical Modeling of Short-Channel TMD TFET Considering Effect of Fringing Field and 2-D Junctions Depletion Regions”, IEEE Transactions on Electron Devices, IEEE Publishers, February, 2022, vol. 69, no. 2, pp. 843-850, DOI: 10.1109/TED.2021.3135367.
J18. B. Kumari, R. Kumar, R. Y. Sharma and M. Sahoo, “Design, Modeling and Analysis of Cu-Carbon Hybrid Interconnects”, IEEE Access, August 2021, vol. 9, pp. - 113577-113584, DOI: 10.1109/ACCESS.2021.3104299.
J17. M. Kumari, N. K. Singh, M. Sahoo and H. Rahaman, “2-D Analytical Modeling and Simulation of Dual Material, Double Gate, Gate Stack engineered, Junctionless MOSFET based Biosensor with Enhanced Sensitivity", Silicon, Springer, July, 2021, pp. 1-12, DOI:
https://doi.org/10.1007/s12633-021-01223-z
J16. M. Kumari, N. K. Singh, M. Sahoo and H. Rahaman, “Work function optimization for Enhancement of sensitivity of Dual Material(DM), Double gate(DG), Junctionless MOSFET based biosensor”, Applied Physics A, Springer, January, 2021, DOI: https://doi.org/10.1007/s00339-020-04256-0.
J15. N. K. Singh, M. Kumari and M. Sahoo, “A Compact Short-Channel Analytical Drain Current Model of Asymmetric Dual-gate TMD FET in Subthreshold Region including Fringing Field effects”, IEEE Access, IEEE Publishers, November, 2020, vol. 8, no. 11, pp. 207982--207990, DOI: 10.1109/ACCESS.2020.3038421.
J14. N. K. Singh and M. Sahoo, “Investigation on the Effect of Gate dielectric and other Device parameters on Digital Performance of Silicene Nanoribbon Tunnel FET”, IEEE Transactions on Electron Devices, IEEE Publishers, July, 2020, vol. 67, no. 7, pp. 2966-2973, DOI: 10.1109/TED.2020.2992016.
J13. B. Kumari, and M. Sahoo, `` Performance and Signal Integrity Analysis of Intercalation Doped Multilayer Vertical Graphene Nanoribbon Interconnects”, IET Circuits, Devices and Systems, IET Publishers, March, 2020, vol. 14, no. 2, pp. 192-199, DOI: https://doi.org/10.1049/iet-cds.2019.0072.
J12. B. Kumari, P. Jha and M. Sahoo, `` Investigation on the Impact of Intercalation Doping on Performance and Signal Integrity of ML-GNR Interconnects”, IEEE VLSI Circuits & Systems Letter, IEEE Computer Society, August, 2019.
J11. S. Bardhan, M. Sahoo and, H. Rahaman, ``A Boltzmann Transport Equation Based Semiclassical Drain Current Model for Bilayer GFET Including Scattering Effects,” IET Circuits, Devices and Systems, IET Publishers 2019, DOI: https://doi.org/10.1049/iet-cds.2018.5104.
J10. B. Kumari and M. Sahoo, `` Stability Analysis of Multilayer Vertical Graphene Nanoribbon Interconnects”, IOP Science, Materials Research Express, DOI:https://iopscience.iop.org/article/10.1088/2053-1591/ab1b92, vol. 6, pp. 08560, 2019.
J9. B. Kumari and M. Sahoo, ``Performance and Power Optimization for Intercalation doped Multilayer Graphene Nanoribbon Interconnects”, IETE Journal of Research, Taylor and Francis Publishers, 2019.
DOI: https://doi.org/10.1080/03772063.2019.1621214
J8. S. Bardhan, M. Sahoo and, H. Rahaman, `` Empirical Drain Current Model of Graphene Field-Effect Transistor for Application as a Circuit Simulation Tool,” IETE Journal of Research, Taylor and Francis Publishers, 2019.
DOI: https://doi.org/10.1080/03772063.2019.1620639
J7. S. Bardhan, M. Sahoo and, H. Rahaman, ``A Surface Potential Based Model for Dual Gate Bilayer GFET Including the Capacitive Effects”, Journal of Circuits, Systems and Computers,World Scientific Publishers. https://doi.org/10.1142/S0218126619502414, 2019.
J6. M. Sahoo, and H. Rahaman, “Analysis of Crosstalk Induced Effects in Multilayer Graphene Nanoribbon Interconnects”, Journal of Circuits, Systems, and Computers, World Scientific Publishers, Vol. 26, No. 6 (2017) 1750102, pp. 1-21, https://doi.org/10.1142/S021812661750102X, 2017.
J5. M. Sahoo, and H. Rahaman, “Modeling and Analysis of Crosstalk Induced Overshoot/Undershoot Effects in Multilayer Graphene Nanoribbon Interconnects and Its Impact on Gate Oxide Reliability”, Microelectronics Reliability (2016), Elsevier Publishers, Vol.63, August 2016, pp. 231–238, https://doi.org/10.1016/j.microrel.2016.06.017.
SCI Impact Factor (2017): 1.24
J4. M. Sahoo, P. Ghosal, and H. Rahaman, “Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube Bundle Interconnects: An ABCD Parameter Based Approach”, IEEE Transactions on Nanotechnology, IEEE, Vol. 14, no. 2, pp. 259–274, March 2015, https://doi.org/10.1109/TNANO.2014.2388252.
SCI Impact Factor (2018): 2.86
J3. M. Sahoo, and H. Rahaman, “Modeling of Crosstalk Induced Effects in Copper-Based Nanointerconnects: An ABCD Parameter Matrix-Based Approach”, Journal of Circuits, Systems, and Computers, World Scientific Publishers, Vol. 24, no. 2, pp. 1-22, 2015, https://doi.org/10.1142/S0218126615400071.
SCI Impact Factor (2017): 0.6
J2. M. Sahoo, P. Ghosal, and H. Rahaman, “Performance Modeling and Analysis of Carbon Nanotube Bundles for Future VLSI Circuit Applications”, Journal of Computational Electronics, Springer Publications, Vol. 13, no. 3, pp. 673-688, 2014, https://doi.org/10.1007/s10825-014-0587-7.
SCI Impact Factor: 1.53
J1. M. Sahoo, H. Rahaman, and Bhargab B. Bhattacharya, “On the Suitability of Single-Walled Carbon Nanotube Bundle Interconnects for High-Speed and Power-Efficient Applications”, Journal of Low Power Electronics, American Scientific Publishers, Vol. 10, no. 3, pp. 191-206, September 2014, https://doi.org/10.1166/jolpe.2014.133.
Scopus and ESCI Cite Score: 0.84
International Conferences
C36. M. Kumari, and M. Sahoo, "Sensitivity Enhancement of TMD MOSFET-Based Biosensor by Modeling and Optimization of Back Gate Parameters", IEEE VLSID, January 2024, DOI: 10.1109/VLSID60093.2024.00007.
C35. S. K. Dora, H. B. Mishra, M. Sahoo and K. Yadav, "Hardware Implementation of OTFS Modulation Using CORDIC Algorithm", IEEE SPCOM (Accepted).
C34. M. Kumari, and M. Sahoo, "Sensitivity Enhancement of TMD MOSFET-Based Biosensor by Optimization of Back Gate Parameters and Noise Analysis", IEEE CODEC, December 2023, DOI: 10.1109/CODEC60112.2023.10466064.
C33. M. Kumari, A. Kumari, S. Das, and M. Sahoo, "Low-Cost Fabrication of MoS2 Nanosheet Biosensor for Glucose Detection", RPGR 2023 (Recent Progress in Graphene and 2D Materials Research Conference) .
C32. S. K. Dora, R. K. Yadav, M. Sahoo and H. B. Mishra, "VLSI Architecture for Low Complexity Zero Forcing Equalizer in OTFS Modulation", IEEE ELEXCOM, August 2023, DOI: 10.1109/ELEXCOM58812.2023.10370165.
C31. N. K. Singh, R. Shankar, S. Verma, and M. Sahoo, "Design of low-power and high-performance 10 nm SRAM using Electrostatically doped TMD TFET", IEEE ISDCS 2023, May, 2023, pp. 1-6, DOI: 10.1109/ISDCS58735.2023.10153525.
C30. M. Kumari, and M. Sahoo, "Impact of Process Induced Strain on the Sensitivity of Charge Plasma Doped TMD TFET Biosensor", 6th IEEE ICEE, Bangalore, December, 2022, pp. 1-6, DOI: 10.1109/ICEE56203.2022.10118170.
C29. B. Kumari, R. Sharma and M. Sahoo, "Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects", IEEE ECTC, 2022, pp. 1-6,
DOI: 10.1109/ECTC51906.2022.00158.
C28. B. Kumari, S. Pandranki, M. Sahoo, R. Sharma, “Copper-MWCNT Composite: A Solution to Breakdown in Copper Interconnects”, 2021 IEEE 21st International Conference on Nanotechnology, July 2021, DOI: 10.1109/NANO51122.2021.9514276 .
C27. B. Kumari, R. Kumar, M. Sahoo and R. Sharma, "Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects", Proceedings of the 71st IEEE Electronic Components and Technology Conference, Lake Buena Vista, May 2021, DOI: 10.1109/ECTC32696.2021.00256 .
C26. P. Howladar, K. Mondaal, M. Sahoo, "Machine Learning based Supraventricular Tachycardia Detection Model of ECG signal", International Conference on Data Analytics & Management, Jaipur, June, 2021, https://link.springer.com/chapter/10.1007/978-981-16-6289-8_23 (Got Best Paper award).
C25. P. Howladar, M. Sahoo, "Machine Learning based Ventricular Tachycardia Detection of ECG Signal", 8th International Conference on Microelectronics, Circuits & Systems, Kolkata, May, 2021, https://arxiv.org/abs/2112.12956 (Got Best Paper award).
C24. R. Kumar, B. Kumari, S. Kumar, M. Sahoo and R Y. Sharma, “Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Shenzhen, China, December 2020, DOI: 10.1109/EDAPS50281.2020.9312905.
C23. K. Sable and M. Sahoo, ``Electrical and Thermal Analysis of Cu-CNT Composite TSV and GNR Interconnects”, Accepted in International Symposium on Devices, Circuits and Systems (ISDCS), Howrah, March, 2020, DOI: 10.1109/ISDCS49393.2020.9262991.
C22. N. K. Singh and M. Sahoo, ``Investigation of Silicene Nanoribbon Tunnel FET for Low power Digital VLSI circuit application with variation of Device parameters”, International Conference on Communication, Circuits and Systems (ICCCAS, 2018), Chengdu, China, December 22-24, 2018, pp. 65-69, DOI: 10.1109/ICCCAS.2018.8768929.
C21. P. Jha, B. Kumari and M. Sahoo, ``Investigation on the Impact of Various Intercalation doping on the Signal Integrity in ML-GNR Interconnects”, International Conference on Communication, Circuits and Systems (ICCCAS, 2018), Chengdu, China, December 22-24, 2018, pp. 349-353, DOI: 10.1109/ICCCAS.2018.8769315.
C20. B. Kumari and M. Sahoo, ``Width Optimization of Intercalation doped Multilayer Graphene Nanoribbon Interconnects”, 2018 International Symposium on Devices, Circuits and Systems (ISDCS), Howrah, 2018, pp. 1-5, https://doi.org/10.1109/ISDCS.2018.8379653.
C19. B. Kumari and M. Sahoo, ``Thickness Optimization of Intercalation doped Multilayer Graphene Nanoribbon Interconnects”, IEEE ICDCS-2018, March, 2018, DOI: 10.1109/ICDCSyst.2018.8605127 .
C18. M. Kumari, M. Sahoo and J. Kumar, ``Modelling and Optimization of Double barrier AlGaAs/GaAs/AlGaAs Resonant Tunneling Diode for THz applications”, Accepted in 4th IEEE ICEE, 2018 to be held in Bangalore in December, 2018 (Got Best Poster award).
C17. M. Sahoo, and H. Rahaman, “Impact of Mutual Inductance on the Crosstalk Induced Effects in Single-Walled Carbon Nanotube Bundle Interconnects”, IEEE ICDCS,KarunyaUniversity,2016,pp.286-290, https://doi.org/10.1109/ICDCSyst.2016.7570585.
C16. S. Bardhan, M. Sahoo and H. Rahaman, ``Analytical Study of BTE Based Multilayer GFET Model”, MicroCom 2016, NIT Durgapur, 2016, pp. 1-6, https://doi.org/10.1109/MicroCom.2016.7522594.
C15. S. Bardhan, M. Sahoo and H. Rahaman, ``A Verilog-A based Semiclassical Model for Dual Gated Graphene Field-Effect Transistor”, IEEE ICDCS, Karunya University, 2016, pp. 37-42, https://doi.org/10.1109/ICDCSyst.2016.7570619
C14. M. Sahoo and H. Rahaman,“Modeling of Crosstalk induced Overshoot/Undershoot effects in Multilayer Graphene Nanoribbon Interconnects”, IEEE EICT, Khulna University,December,2015, pp. 416-421, https://doi.org/10.1109/EICT.2015.7391988.
C13. S. Bardhan, M. Sahoo and H. Rahaman,``Analytical Drain Current Model for Graphene Metal-Oxide semiconductor Field-Effect Transistor”, IEEE EICT, Khulna University, December, 2015, pp. 422-427,https://doi.org/10.1109/EICT.2015.7391989
C12. M. Sahoo, P. Ghosal, and H. Rahaman, “An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube undle Interconnects”, IEEE 27th International Conference on VLSI Design, IIT Bombay, India, pp. 433-438, Jan. 5–9, 2014,https://doi.org/10.1109/VLSID.2014.81.
C11. M. Sahoo, and H. Rahaman, “Modeling of Crosstalk Induced Effects in Nanoscale Copper Interconnects”, IEEE EICT, KUET, Bangladesh, pp. 1–6, Feb. 13–15, 2014,https://doi.org/10.1109/EICT.2014.6777811.
C10. M. Sahoo, and H. Rahaman, “An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Multilayer Graphene Nano Ribbon Interconnects”, IEEE ISCAS, Melbourne, Australia, pp. 1138-1142, June 1–5, 2014,
https://doi.org/10.1109/ISCAS.2014.6865341.
C9. M. Sahoo, and H. Rahaman, “Impact of Line resistance variations on Crosstalk delay and noise in Multilayer Graphene Nano Ribbon Interconnects”, 5th IEEE International Symposium on Electronic System Design (ISED 2014), NITK Surathkal, India, pp. 94–98, Dec. 15–17, 2014,https://doi.org/10.1109/ISED.2014.27.
C8. S. A. Mandal, S. Pal, M. Sahoo, P. Mondal and H. Rahaman, ``A New Feedback Circuit Based Charge-pump for a Wide-range and Low-jitter DLL suitable for PET Imaging Applications”, Proceedings of IEEE ICDCS, India, 2014, pp. 1-5, https://doi.org/10.1109/ICDCSyst.2014.6926125.
C7. S. Chakraborty, M. Sahoo and H. Rahaman, ``A 1.8 V 64.9 uW 54.1 dB SNDR 1st Order Sigma-Delta Modulator Design Using Clocked Comparator Based Switched Capacitor Technique”, IEEE Asia Symposium and Exhibit on Quality Electronic Design (ASQED), 2013, pp. 220-226, https://doi.org/10.1109/ASQED.2013.6643591.
C6. M. Sahoo, P. Ghosal, and H. Rahaman, “An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Single-Walled Carbon Nanotube Bundle Interconnects”, IEEE/ACM Asia Symposium and Exhibit on Quality Electronic Design (ASQED), Penang, Malaysia, pp. 264-273, Aug. 26–28, 2013,
https://doi.org/10.1109/ASQED.2013.6643598.
C5. M. Sahoo, and H. Rahaman, “Modeling of Crosstalk Delay and Noise in Singlewalled Carbon Nanotube Bundle Interconnects”, IEEE INDICON, IIT Bombay, India, pp. 1–6, Dec. 13–15, 2013, https://doi.org/10.1109/INDCON.2013.6725907. (Got Best Paper Award)
C4. M. Sahoo, H. Rahaman and B. B. Bhattacharya, “Impact of Inductance on the Performance of Single Walled Carbon Nanotube Bundle Interconnects”, 4th IEEE International Symposium on Electronic System Design (ISED), NTU, Singapore, pp. 16- 20, Dec. 12–13, 2013,https://doi.org/10.1109/ISED.2013.10.
C3. M. Sahoo and H. Rahaman, “Performance Analysis of Multiwalled Carbon Nanotube Bundles”, 33rd IEEE International Scientific Conference Electronics and Nanotechnology (ELNANO), NTUU, Ukraine, pp. 200-204, Apr. 16–19, 2013,
https://doi.org/10.1109/ELNANO.2013.6552004.
C2. M. Sahoo, P. Ghosal, and H. Rahaman, “Efficient and Compact Electrical Modeling of Multi Walled Carbon Nanotube Interconnects”, 3rd IEEE International Symposium on Electronic System Design (ISED), Bengal Engineering and Science University, Shibpur Howrah, India, pp. 236-240, Dec. 19–22, 2012, https://doi.org/10.1109/ISED.2012.24.
C1. S. A. Kannan, M. Sahoo, S. Dwivedi, B. Amrutur and N. Bhat, ``Optimal Power and Noise Allocation for Analog and Digital Sections of a Low Power Radio Receiver”, ACM/IEEE ISLPED, India, August, 2008, pp. 271-276, https://doi.org/10.1145/1393921.1393993.
National Conferences/Symposium
NC5. B. Kumari and M. Sahoo, ``Impact of Width on the Performance of Intercalation Doped MLGNR Interconnects”, INUP Familiarization workshop, IISc, Bangalore, November, 2017.
NC4. I. Das, M. Sahoo, P. Roy and H. Rahaman, ``A 45 uW 13 pJ/conv-step 7.4 ENOB 40 kS/s SAR ADC for Digital Microfluidic Biochip Applications”, International Symposium on VLSI Design and Test (VDAT) 2014, PSG College of Technology, Coimbatore, https://doi.org/10.1109/ISVDAT.2014.6881068.
NC3. M. Guha, A. Sengupta, M. Sahoo and H. Rahaman, “Effect of Defects on Performance and Signal Integrity of Multilayer GNR Interconnects”, INUP Familiarization Workshop on Compact Modeling, IISc, August, 2014.
NC2. M. Sahoo and B. Amrutur, ``Comparison of OpAmp Based and Comparator Based Switched Capacitor Filter,” International Symposium on VLSI Design and Test (VDAT), 2012, Kolkata, Springer LNCS, vol. 7373, pp. 180-189, https://doi.org/10.1007/978-3-642-31494-0_21.
NC1. M. Sahoo, and H. Rahaman, “Analytical Modeling of Crosstalk Effects in Coupled Copper Interconnects in Deep Sub Micron Technology”, 5th IEEE International Conference on Computers and Devices for Communication (CODEC), IRPE, Calcutta University, India, pp. 1-4, Dec. 17–19, 2012, https://doi.org/10.1109/CODEC.2012.6509212.