I am an R&D engineer specializing in materials reliability for semiconductor and power-electronic applications. My work combines materials science, reliability physics, multiphysics simulation, fracture mechanics, and experimental validation to understand degradation mechanisms, predict lifetime, and support the design of reliable electronic systems. My expertise spans COMSOL Multiphysics, ANSYS APDL, finite-element analysis (FEA), cohesive-zone modelling, thermomechanical fatigue, materials degradation, microstructural characterization, EBSD, semiconductor and power-module reliability, and failure physics.
Currently, I am a researcher at Mitsubishi Electric R&D Centre Europe, where I develop COMSOL-based multiphysics finite-element frameworks for the reliability assessment of epoxy-encapsulated power modules. My research focuses on resin-aluminium interfacial fracture, investigating crack propagation, cure-induced chemical shrinkage, manufacturing-induced residual stresses, energy release rate, and mode mixity. By combining numerical modelling with 3-point and 4-point bending experiments, force-displacement analysis, and compliance evolution, I develop and validate methodologies for fracture characterization and predictive reliability assessment, with ongoing extension toward full power-module assemblies.
Previously, I was a Postdoctoral Researcher at LAPLACE laboratory / Toulouse INP, where I investigated the reliability of SiC MOSFETs under short-circuit conditions. Using advanced multiphysics simulations, I studied gate cracking, passivation delamination, thermomechanical fatigue, and failure mechanisms, contributing to reliability assessment, device protection, and design optimization.
I obtained my Ph.D. in Electrical and Electronics Engineering from ENS Paris-Saclay University, with research conducted at SATIE laboratory / Gustave Eiffel University (ex IFSTTAR). My doctoral work focused on crack propagation and degradation mechanisms in IGBT interconnections subjected to thermomechanical fatigue. By combining EBSD and physicochemical characterization with cohesive-zone modelling in ANSYS APDL, I developed simulation approaches for reliability assessment and lifetime prediction.
My academic background includes both a Master’s degree and a Bachelor’s degree in Physical & Materials Chemistry from the Lebanese University. This multidisciplinary training provided a strong foundation in materials science, microstructural characterization, degradation mechanisms, and numerical modelling, which continues to shape my research approach today.