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I am currently a Researcher at Mitsubishi Electric R&D Centre Europe, focusing on the thermomechanical reliability and lifetime assessment of epoxy-encapsulated power modules for demanding industrial applications. My work combines electro-thermo-mechanical FEM simulations, microstructural and materials characterization, durability and aging analysis, and experimental validation to support robust design under challenging operating conditions.

Previously, I was a postdoctoral researcher at LAPLACE laboratory / Toulouse INP, , specializing in the reliability and degradation mechanisms of microelectronic modules under extreme accidental conditions. Using COMSOL, I developed advanced coupled 2D electrothermal-metallurgical-elastoplastic simulations, integrating physicochemical insights and structural damage modeling to advance the performance and robustness of power devices.

I earned my Ph.D. from ENS Paris-Saclay University, with research conducted at SATIE laboratory / Gustave Eiffel University (ex IFSTTAR). The project focused on modeling crack progression and degradation mechanisms in IGBT topside interconnection components under thermomechanical fatigue. I used EBSD and ATEX analysis to extract microstructural and physicochemical data and integrated these into a Cohesive Zone Model using ANSYS APDL (2022).

I hold both a Master’s and Bachelor’s degree in Physical and Materials Chemistry from the Lebanese University (2014-2019). This academic background led to my Master 2 training at SATIE laboratory / IFSTTAR, which involved studying aluminum grain boundary fatigue in semiconductors, with a focus on temperature and thermal cycling effects on interfacial energy between thin-film grains. This work laid the foundation for my Ph.D. research, providing both the experimental basis and the initial modeling approach.