Experience

Topic: Study of thermomechanical fatigue behavior of epoxy-encapsulated power modules / Mitsubishi Electric R&D Centre Europe, France 

- Developed a multiphysics fracture-mechanics framework in COMSOL to predict resin-aluminium interfacial delamination, integrating dedicated post-processing for Energy Release Rate (G) and Mode Mixity (Ψ) extraction from crack-front displacement fields.

- Validated simulations against 3-point and 4-point bending experiments through force-displacement, J-integral, compliance, and interfacial crack-propagation analyses.

- Established coupled thermo-chemo-mechanical FE models incorporating chemical shrinkage and thermal expansion to quantify manufacturing-induced residual stresses and their contribution to interfacial fracture initiation and propagation.

- Investigated resin-property and manufacturing-stress effects on deformation, residual-stress evolution, and delamination driving forces, establishing process-material-structure relationships for epoxy-encapsulated power-module reliability.

- Developed an experiment-simulation methodology for interfacial fracture characterization, combining loading/unloading response, compliance evolution, crack-growth assessment, and FE analysis to distinguish applied-loading and residual-stress contributions to fracture behavior.

- Preparing to extend the validated resin-aluminium bi-material methodology toward multilayer power-module assemblies for predictive thermomechanical reliability assessment under representative operating conditions.

- Conducted a parallel R&D study on power-module transient thermal behaviour, developing a hybrid FEM-RC model in COMSOL that couples localized wire-bond heating with an RC thermal network derived from transient thermal-impedance data.

Topic: 2D thermomechanical simulations of SiC MOSFET power transistors in short-circuit regime using COMSOL Multiphysics / LAPLACE laboratory - Toulouse INP, France

- Developed a 2D electrothermal-metallurgical-elastoplastic model of a gate-planar SiC MOSFET in COMSOL software to simulate short-pulse short-circuit conditions.

- Structural modeling of Al-source melting & SiO₂-ILD cracking, considering non-linear material properties that account for high temperatures with wide fluctuations.

- The model suggests margins to prevent SiO₂ cracking & Al melting while predicting energy density at their onset, aiming to enhance gate-driver protection.

- Multiple repetitive thermomechanical cycles were simulated to evaluate crack progression, illustrating the evolution of crack formation & direction during cycling.

- Repetitive short-circuit tests confirmed gate aging, aligning with the model's critical time & energy values as well as crack evolution. Future research aims to estimate the critical cycle range for complete fracture across the Ti-SiO₂-PolySi regime. 

- Extended the validated electro-thermomechanical framework under short-circuit conditions to the full SiC MOSFET geometry, including packaging, enabling the analysis of transient chip bending under realistic short-circuit loading.

- Implemented a cohesive-zone model at the Si₃N₄-polyimide passivation interface, capturing delamination induced by thermomechanical stresses during heating and cooling transients.

- Highlighted passivation damage at both gate-finger and gate-ring regions in contact with the source under transient thermomechanical loading, and defined critical time-energy indicators for passivation optimization and gate-driver protection.

Topic: Physicochemical and microstructural approaches for modeling the degradations of power electronic interconnection components / SATIE laboratory - Gustave Eiffel University, France 

- Analyzing EBSD data of accelerated aged IGBT topside metallic contacts using ATEX software.

- Linking physicochemical & microstructural properties to the parameters of the Cohesive Zone Model to predict crack progression in IGBT intermetallic topsides.

- Modeling physiochemically & microstructurally the crack evolution at topside metallic contacts in IGBT devices using the ANSYS APDL software. 

Topic: Role of temperature and temperature cycles on the interface energies between thin aluminum films’ grains / SATIE laboratory - IFSTTAR, France

- Exploring the failure processes at topside metallic contacts in IGBT semiconductor devices caused by thermomechanical fatigue.

- Analyzing the microstructural evolutions at aluminum wire-metallization contacts.

- Predicting the progress of grain boundary grooving in aluminum wire-metallization contacts using mathematical equations that consider physicochemical properties.

Topic: Studying the adsorption properties of ZSM-5 zeolite for artificial kidney application / MCEMA Laboratory - Lebanese University, Lebanon

- Exploring kidney failure treatments & how the adsorption method offers a solution.

- Conducting experiments (XRD, Zeta potential measurement, UV spectroscopy) to investigate the adsorption of ZSM-5 zeolite, a mesoporous material, on uremic toxins in various media.

- Assessing the efficiency of ZSM-5 zeolite in adsorbing uremic toxins (esp. urea).