PUBLICATIONS

1. Ko, Danny D., Hangjie Ji, and Y. Sungtaek Ju. “Prediction of Pore-Scale Flow in Heterogeneous Porous Media from Periodic Structures Using Deep Learning.” AIP Advances 13, no. 4 (April 28, 2023): 045324. https://doi.org/10.1063/5.0147472. 

2. Ko, Danny D., Hangjie Ji, and Y. Sungtaek Ju. “Prediction of 3D Velocity Field of Reticulated Foams Using Deep Learning for Transport Analysis.” Transport in Porous Media 148, no. 3 (July 1, 2023): 577–604. https://doi.org/10.1007/s11242-023-01961-1. 

3. Kim, B. Ji, H., Bertozzi, A., Sadeghpour, A., and Ju, Y. S., “A Positivity-Preserving Numerical Method for a Thin Liquid Film on a Vertical Cylindrical Fiber,” Journal of Computational Physics, 496 (January 1, 2024): 112560. https://doi.org/10.1016/j.jcp.2023.112560. 

1. Ju, Y. Sungtaek, “Thermal Management and Control of Wearable Devices,” IScience 25, no. 7 (July 15, 2022): 104587. https://doi.org/10.1016/j.isci.2022.104587.

2. Liu, Y., Wang, J., Jung, B., Rao, U., Sedighi, E., Hoek, E. M. V, Tilton, N., Cath, T. Y., Turchi, C. S., Heeley, M. B., Ju, Y., S., and Jassby, D., “Desalinating a Real Hyper-Saline Pre-Treated Produced Water via Direct-Heat Vacuum Membrane Distillation.” Water Research 218 (June 30, 2022): 118503. https://doi.org/10.1016/j.watres.2022.118503.

3. Dickstein, D., Ko, D., Nadvornick, W., Jain, K., Holdheim, S., Ju, Y. S., and Ghoniem, N., “Optimized Permeability of Microporous Foam for Transpiration Cooling in Hypersonic Leading Edge.” Journal of Thermophysics and Heat Transfer, Vol. (2022): 1–13. https://doi.org/10.2514/1.T6475.

1.  Ji, H., Falcon, C., Sedighi, E., Sadeghpour, A., Ju, Y. S., Bertozzi, A., “Thermally-driven Coalescence in Thin Liquid Film Flowing down a Fibre,” Journal of Fluid Mechanics, Vol. 916, A19 (June 2021). https://doi.org/10.1017/jfm.2021.198.

2.  Wang, J., Liu, Y., Rao, U., Dudley, M., Dehdari Ebrahimi, N., Han, F., Hoek, E. M.V., Tilton, N., Cath, T., Turchi, C. S., Ju, Y. S., Jassby, D., Lou, J., and Heeley, M. B., “Conducting Thermal Energy to the Membrane/Water Interface for the Enhanced Desalination of Hypersaline Brines Using Membrane Distillation,” Journal of Membrane Science, Vol. 626, 119188 (May 15, 2021). https://doi.org/10.1016/j.memsci.2021.119188.

3. Sadeghpour, A., Oroumiyeh, F., Zhu, Y., Ko, D. H., Ji, H., Bertozzi, A. L., and Ju, Y. S., “Experimental Study of a String-based Counterflow Wet Electrostatic Precipitator for Collection of Fine and Ultrafine Particles,” Journal of the Air & Waste Management Association, Vol. 71, no. 7 (July 3, 2021): 851–65. https://doi.org/10.1080/10962247.2020.1869627 

4. Sedighi, E., Zeng, Z., Sadeghpour, A., Ji, H., Ju, Y. S., and Bertozzi, A. L., “Capillary-Driven Rise of Well-Wetting Liquid on the Outer Surface of Cylindrical Nozzles.” Langmuir, Vol. 37, no. 35 (September 7, 2021): 10413–23. https://doi.org/10.1021/acs.langmuir.1c01096. 

1. Dehari Ebrahimi, N., Eldredge, J. D., and Ju, Y.S., “Three-Dimensional Characteristics of the Jet Flows Induced by a Pitching Plate in a Quiescent Fluid,” Journal of Fluid Mechanics, Vol. 887 (March 2020). https://doi.org/10.1017/jfm.2020.2. 

2. Ji, H., Sadeghpour, A., Ju, Y. S., and Bertozzi, A. L., “Modelling Film Flows down a Fibre Influenced by Nozzle Geometry,” Journal of Fluid Mechanics 901 R6 (October 2020). https://doi.org/10.1017/jfm.2020.605. 

1. Sadeghpour, A., Z. Zeng, H. Ji, N. Dehdari Ebrahimi, A. L. Bertozzi, and Y. S. Ju, “Water Vapor Capturing Using an Array of Traveling Liquid Beads for Desalination and Water Treatment,” Science Advances, Vol. 5, no. 4 (April 12, 2019): eaav7662. https://doi.org/10.1126/sciadv.aav7662.

2. Ji, H., C. Falcon, A. Sadeghpour, Z. Zeng, Y. S. Ju, and A. L. Bertozzi, “Dynamics of Thin Liquid Films on Vertical Cylindrical Fibres,” Journal of Fluid Mechanics, Vol. 865, pp. 303–27, April 25, 2019. https://doi.org/10.1017/jfm.2019.33. 

3. Dehdari Ebrahimi, N., Eldredge, J.,  and Ju, Y. S., “Wake Vortex Regimes of a Pitching Cantilever Plate in Quiescent Air and Their Correlation with Mean Flow Generation,” Journal of Fluids and Structures, Vol. 84, pp. 408–20, January 1, 2019. https://doi.org/10.1016/j.jfluidstructs.2018.11.010.

4. Zeng, Z., Sadeghpour, A, and Ju, Y. S., “A Highly Effective Multi-String Humidifier with a Low Gas Stream Pressure Drop for Desalination,” Desalination, Vol. 449, pp. 92–100, January 1, 2019. https://doi.org/10.1016/j.desal.2018.10.017.

5. Dehdari Ebrahimi, N. and Ju, Y. S., “Heat Transfer Augmentation using Scale-roughened Surfaces for Low-Reynolds Number Flows Generated by Piezoelectric Fans,” Proceedings of the 18th IEEE ITHERM Conference, May 28 - May 31, 2019, Las Vegas, NV, 12-H12-204.

6. Ji, H., Falcon. C., Sadeghpour, A., Zeng, Z., Ju, Y. S., and Bertozzi, A., “Dynamics of Fluid Films Flowing Sown a Fibre Influenced by Nozzle Geometry,” American Physical Society (APS) March Meeting, March 6th, 2018, Los Angeles. 

7. Sadeghpour, A., Zeng, Z., and Ju, Y. S., “Multi-String Humidifier and Water Vapor Capturing Using an Array of Traveling Liquid Beads for Desalination and Water Treatment,” U.S. Provisional Application No. 62/814731, March 6, 2019. 

1. Dehdari Ebrahimi, N. and Ju, Y. S., “Thermal Conductivity of Sintered Copper Samples Prepared Using 3D Printing-Compatible Polymer Composite Filaments,” Additive Manufacturing, Vol. 24, pp. 479–85, December 1, 2018. https://doi.org/10.1016/j.addma.2018.10.025.

2.  Zeng, Z., Sadeghpour, A., and Ju, Y. S., “Thermohydraulic Characteristics of a Multi-String Direct-Contact Heat Exchanger,” International Journal of Heat and Mass Transfer, Vol. 126, pp. 536–44, November 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2018.05.060.

3.  Dehdari Ebrahimi, N., Wang, Y., and Ju, Y. S., “Mechanisms of Power Dissipation in Piezoelectric Fans and Their Correlation with Convective Heat Transfer Performance,” Sensors and Actuators A: Physical, Vol. 272, pp. 242–252, April 2018.

4. Dehdari Ebrahimi, N., Zeng, Z., and Ju, Y.S., “Vortex Propagation in Air Flows Generated by Piezoelectric Fans and Their Correlation With Fan Cooling Power Efficiency,” Proceedings of the 16th International Heat Transfer Conference, IHTC-16, August 10-15, 2018, Beijing, China, IHTC16-22381.

5. Zeng, Z., Sadeghpour, A., and Ju, Y. S., “Experimental Study of Heat Transfer and Pressure Drop in a Multistring Based Direct Contact Heat Exchanger,” Proceedings of the 16th International Heat Transfer Conference, IHTC-16, August 10-15, 2018, Beijing, China, IHTC16-22112.

6. Sadeghpour, A., Zeng, Z., and Ju, Y. S., Highly Effective Multi-String Humidifier with a Low Gas Stream Pressure Drop for Desalination,” U.S. Provisional Application No. 62/720792, August 21, 2018. 

1. Ju, Y. S., “Analysis of Thermocapacitive Effects in Electric Double Layers under a Size Modified Mean Field Theory,” Applied Physics Letters, Vol. 111 (17), 173901, October 23, 2017, https://doi.org/10.1063/1.5003362.

2. Ma, R., Zhang, Z., Tong, K., Huber, D., Kornbluh, R., Ju, Y. S., Pei, Q., “Highly Efficient Electrocaloric Cooling with Electrostatic Actuation,” Science, Vol. 357, Issue 6356, pp. 1130-1134, September 15, 2017.

3. Sadeghpour, A., Zeng, Z. and Ju, Y. S. “Effects of Nozzle Geometry on the Fluid Dynamics of Thin Liquid Films Flowing down Vertical Strings in the Rayleigh–Plateau Regime,” Langmuir, Vol. 33 (25), pp. 6292–6299, June 27, 2017. doi:10.1021/acs.langmuir.7b01277.

4. Kaufmann, D., Theriot, J.J., Zyuzin, J., Service, C.A., Chang, J.C., Tang, Y.T., Bogdanov, V.B., Multon, S., Schoenen, J., Ju. Y.S., and Brennan, K.C., “Heterogeneous Incidence and Propagation of Spreading Depolarizations,” Journal of Cerebral Blood Flow & Metabolism, Vol. 37(5), pp. 1748–1762, May 2017.

5. Zeng, Z., Sadeghpour, A., Warrier, G., and Ju, Y. S., “Experimental Study of Heat Transfer between Thin Liquid Films Flowing down a Vertical String in the Rayleigh-Plateau Instability Regime and a Counterflowing Gas Stream,” International Journal of Heat and Mass Transfer, Vol. 108, pp. 830-840, May, 2017.

6. Peng, C., and Ju, Y. S., “Finger-Powered Electro-Digital-Microfluidics,” in Biosensors and Biodetection Methods and Protocols, Volume 2: Electrochemical, Bioelectronic, Piezoelectric, Cellular and Molecular Biosensors, edited by B. Prickril and A. Rasooly, pp. 293-311, 2017.

7. Dehdari Ebrahimi, N., Wang, Y., and Ju, Y.S., “Power Partitioning and Efficiency of Piezoelectric Fan Cooling,” ASME 2017 Summer Heat Transfer Conference, July 9 - 12, 2017, Bellevue, Washington, HT2017-4742.

8. Sadeghpour, A., Zeng, Z., and Ju, Y. S., “Flow Instability Characteristics of Liquid Films Flowing Down a Thin Vertical String for Direct-Contact Heat/Mass Exchangers,” ASME 2017 Summer Heat Transfer Conference, July 9 - 12, 2017, Bellevue, Washington, HT2017-4744.

1. Cha, G., Kim, C.-J., and Ju, Y. S., “Thermal Conductance Switching Based on the Actuation of Liquid Droplets through the Electrowetting on Dielectric (EWOD) Phenomenon,” Applied Thermal Engineering, Vol. 98, pp. 189–195, 2016

2. Peng, C., Wang, Y., and Ju, Y. S., “Finger-powered electrophoretic transport of discrete droplets for portable digital microfluidics,” Lab Chip, vol. 16, no. 13, pp. 2521–2531, 2016.

3. Zeng, Z., Sadeghpour, A., Warrier, G. R., Ju, Y. S., “Experimental Study of Heat Transfer between Thin Liquid Films Flowing down a Vertical String in the Rayleigh-Plateau Instability regime and a Counterflowing Gas Strea,” International Journal of Heat and Mass Transfer, Vol. 108, pp. 830-840, 2016

4. Bogdanov, V. B., Middleton, N. A., Theriot, J. J., Parker, P. D., Abdullah, O. M., Ju, Y. S., Hartings, J. A., and Brennan, K. C., “Susceptibility of Primary Sensory Cortex to Spreading Depolarizations,”Journal of Neuroscience, Vol. 36(17),pp. 4733-4743, 2016.

5. Sadeghpour, A. and Ju, Y. S., “Fluid Dynamics of Thin Liquid Flows over High Curvature Surfaces for Direct-Contact Heat and Mass Exchange Applications,” ASME 2016 International Mechanical Engineering Congress & Exposition (IMECE 2016), November  11 – 17, 2016, Phoenix, Arizona, USA, IMECE2016-67479.

6. Zeng, Z. and Ju, Y. S., “Experimental Characterization of Direct-Contact Heat Exchange between a Liquid Film Flowing down over a Vertical String and a Counter-flowing Gas,” ASME 2016 International Mechanical Engineering Congress & Exposition (IMECE 2016), November  11 – 17, 2016, Phoenix, Arizona, USA, IMECE2016-67474

7. Sadeghpour, A., Zeng, Z., and Ju, Y. S., “Effects of Nozzle Geometry on the Instability of Liquid Films Flowing Down a Thin Vertical String,” ASME 2016 International Mechanical Engineering Congress & Exposition (IMECE 2016), November  11 – 17, 2016, Phoenix, Arizona, USA, Poster Presentation. IMECE2016-68897.

8. Wang, Y., Fan, C., Sadeghpour, A., Dehdari Ebrahimi, N., and Ju, Y.S., “Mechanically Augmented Piezoelectric Fans and Polymeric Air-Cooled Heat Sinks for Thermal Management of Portable and Wearable Electronics,” ASME 2016 International Mechanical Engineering Congress & Exposition (IMECE 2016), November  11 – 17, 2016, Phoenix, Arizona, USA, IMECE2016-67515.

1. Zhuang, J. and Ju, Y. S., “A Combined Experimental and Numerical Modeling Study of the Deformation and Rupture of Axisymmetric Liquid Bridges under Coaxial Stretching,” Langmuir, Vol. 31, pp. 10173−10182, August 31, 2015.

2. Ju, Y. S., “Theoretical Analysis of Pyroelectric Harvesting of Low-Grade Exhaust Waste Heat,” Proceedings of the ASME 2015 International Mechanical Engineering Congress and Exposition IMECE2015 November 13-19, 2015, Houston, Texas, IMECE2015-53042.

3. Zeng, Z., Warrier, G. R., and Ju, Y. S., “Study of The Fluid Dynamics of Thin Liquid Films Flowing Down a Vertical String With Counterflow Of Gas,” Proceedings of the ASME 2015 International Mechanical Engineering Congress and Exposition IMECE2015 November 13-19, 2015, Houston, Texas, IMECE2015-53132. 

4. Zeng, Z., Warrier, G. R., and Ju, Y. S., “Flow and Heat Transfer in Liquid Films Flowing over Highly Curved Surfaces,” Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 12th International Conference on Nanochannels, Microchannels, and Minichannels (InterPACKICNMM2015) July 6-9, 2015, San Francisco, California, USA, InterPACKICNMM2015-48149.

5. Peng, C. and Ju, Y. S., “Finger-Powered Droplet Actuation by Electrophoretic Force for Portable Microfluidics,” Proceedings of the18th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2015), June 21-25, 2015, Anchorage, Alaska, USA, pp. 232-235.

1. Tang, Y. Mendez, J. M., Theriot, J. J., Sawant, P. M., Lopez-Valdes, H. E., Ju, Y. S., and Brennan, K.C., “Minimum Conditions for the Induction of Cortical Spreading Depression in Brain Slices," Journal of Neurophysiology, Vol. 112, pp. 2572-2579, 2014.

2. Zhuang, J. and Ju, Y. S., “Deployable and Conformal Planar Micro-Devices: Design and Model Validation,” Micromachines, Vol. 5, pp. 528-546, 2014.

3. Zhuang, J. and Ju, Y. S., “A Tunable Hemispherical Platform for Non-Stretching Curved Flexible Electronics and Optoelectronics,” Journal of Applied Physics, Vol. 116, 044508, 2014.

4. Jia, Y. and Ju, Y. S., “Characterization of the Electrocaloric Effect and Hysteresis Loss in Relaxor Ferroelectric Thin Films under Alternating Current Bias Fields,” Applied Physics Letters, Vol. 104, 251913, 2014.

5. Jia, Y. and Ju, Y. S., “Solid-Liquid Hybrid Thermal Interfaces for Low-Contact Pressure Thermal Switching,” Journal of Heat Transfer, Vol. 136, 074503, 2014.

6. Peng, C., Zhang, Z., Kim, C.-J., and Ju, Y. S., “EWOD(Electrowetting on Dielectric) Digital Microfluidics Powered by FingerActuation,” Lab on Chip, Vol. 14, pp. 1117-1122, 2014. (also featured in a news article on Chemistry World, (http://www.rsc.org/chemistryworld/2014/01/microfluidic-device-runs-finger-power)

7. Warrier, G. R., Kim, C.-J., and Ju, Y. S., “Microchannel Cooling Device with Perforated Side Walls: Design and Modeling,” International Journal of Heat and Mass Transfer, Vol. 68, pp. 174–183, 2014.

8. Warrier, G. R., Lloyd, D., Yang, L., Hu, Y., Dhir, V. K., and Ju, Y. S., “Heat Transfer Enhancement in Tangential Injection Induced Swirl Flows,” Proceedings of the 15th International Heat Transfer Conference (IHTC-15), August 10-15, 2014, Kyoto, Japan, IHTC15-8801.

9. Warrier, G.R., Ju, Y.S., Schroers, J., Asta, M., and Hosemann, P., “Development of High-Temperature Liquid Metal Heat Transfer Fluids for CSP Applications,” Proceedings of the ASME 2014 8th International Conference on Energy Sustainability, June 30–July 2, 2014, Boston, Massachusetts, USA, ES-FuelCell2014-6611.

1. Gaspera, E. D., Tucker, R., Star, K., Lan, E. H., Ju, Y. S. and Dunn, B., “Copper-Based Conductive Composites with Tailored Thermal Expansion,” ACS Applied Materials and Interfaces, Vol. 5(21), pp. 10966-10974, 2013.

2. Jia, Y. and Ju, Y. S., “Direct Characterization of the Electrocaloric Effects in Thin Films Supported on Substrates,” Applied Physics Letters, Vol. 103, 042903, 2013.

3. Ju, Y. S., Kaviany, M., Nam, Y., Sharratt, S., Hwang, G. S., Catton, I., Fleming, E., and Dussinger, P., “Planar Vapor Chamber with Hybrid Evaporator Wicks for the Thermal Management of High-Heat-Flux and High-Power Optoelectronic Devices,” International Journal of Heat and Mass Transfer, Vol. 60, pp. 163-169, 2013.

4. Cha, G. and Ju, Y. S., “Pyroelectric Energy Harvesting using Liquid-Based Switchable Thermal Interfaces,” Sensors and Actuators A: Physical, Vol. 189, pp. 100-107, 2013.

5. Zhan, Y., Cha, G., Zhuang, J., Jia, Y., and Ju, Y. S., “Microscale Liquid-based Mechanical Elements for Multi-Functional Integration,” Journal of Composite Materials, Vol. 47 (1), pp. 65-75, 2013.

6. Nam, Y. and Ju, Y. S., “Comparative Study of the Morphology and Wetting Characteristics of Micro/Nanostructured Cu Surfaces for Phase Change Heat Transfer Applications,” Journal of Adhesion Science and Technology, Vol. 27 (20), pp. 2163-2176, 2013.

7. Zhuang, J. and Ju, Y. S., “Deployable MEMS Devices for Minimally Invasive Monitoring of Cortical Activities,” Proceedings of the ASME 2013 International Mechanical Engineering Congress & Exposition (IMECE 2013), November 13-21, 2013, San Diego, California, USA, IMECE2013-66662.

8. Peng, C., Kim, C.-J., and Ju, Y. S., “Finger Triggered Digital Microfluidics,” Proceedings of the 17th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers 2013), Barcelona, Spain, June 16-20, 2013, pp. 388-391.

9. Jia, Y. and Ju Y. S., “Solid-Liquid Hybrid Thermal Interfaces for Low-Contact Pressure Thermal Switching,” ASME 2013 International Mechanical Engineering Congress & Exposition (IMECE 2013), November 13-21, 2013, San Diego, California, USA, IMECE2013-66660.

10. Warrier, G., Na, Y., and Ju, Y. S., “Heat Transfer Enhancements in Solar Thermal Power Generation Flow Loops,” ASME 2013 Summer Heat Transfer Conference, July 14-19, 2013, Minneapolis, MN, USA.

11. Jia, Y., Peng, C., and Ju, Y. S., “Characterization of Electrocaloric Cooling in Thin Films,” ASME 2013 Summer Heat Transfer Conference, July 14-19, 2013, Minneapolis, MN, USA.

1. Theriot, J., Toga, A., Prakash, N., Ju, Y. S., and Brennan, K.C., “Cortical Sensory Plasticity in a Model of Migraine with Aura," Journal of Neuroscience, Vol. 32 (44), pp. 15252-15261, 2012.

2. Jia, Y. and Ju, Y. S., “A Solid-State Refrigerator based on the Electrocaloric Effect,”Applied Physics Letters, Vol. 100, 242901, 2012.

3. Sharratt, S., Peng, C., and Ju, Y. S., “Micro-Post Wicks for Improved Phase Change Heat Transfer Performance,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 6163-6169, 2012.

4. Jia, Y., Cha, G., and Ju, Y. S., “Switchable Thermal Interfaces based on Discrete Liquid Droplets,” Micromachines, Vol. 3, pp. 10-20, 2012.

5. Cha, G. and Ju, Y. S., “Electric Field Dependence of the Curie Temperature of Ferroelectric Poly(vinylidenefluoride-trifluoroethylene) Co-polymers for Pyroelectric Energy Harvesting,” Smart Materials and Structures, Vol. 21, 022001, 2012 (selected as a featured Fast Track article and also included in “Highlights of 2012’).

6. Trujillo, J. E., Kim, J. W., Lan, E. H., Sharratt, S., Ju, Y. S., and Dunn, B., “Metal-Matrix Nanocomposites with Tailored Coefficients of Thermal Expansion for Improved Thermomechanical Reliability,” Journal of Electronic Materials, Vol. 41, pp. 1020–1023, 2012.

7. Fan, A., Bonner, R., Sharratt, S., and Ju, Y. S., “An Innovative Passive Cooling Method for High Performance Light-emitting Diodes,” Proceedings of the 28th IEEE SEMI-THERM Symposium, March 18-22, 2012, San Jose, CA, pp. 319-324.

8. Dussinger, P., Ju, Y. S., Catton, I., and Kaviany, M., “High-Heat-Flux High-Power Low-Resistance Low-CTE Two-Phase Thermal Ground Planes for Direct-Die-Attach Applications,” Proceedings of GOMACTech-12 (Government Microcircuit Applications and Critical Technology Conference), March 19 – 22, 2012, Las Vegas, Nevada, Paper ID 121.

9. Cha, G., Jia, Y., and Ju, Y. S., “High-Power Density Pyroelectric Energy Harvesters Incorporating Switchable Liquid-based Thermal Interfaces,” Proceedings of  the IEEE 25th International Conference on Micro Electro Mechanical Systems, January 29 -  February 2, 2012, Paris, FRANCE, pp. 1241-1244.

10. Tang, Y.T., Kim, J., López-Valdés, H.E., Brennan, K.C., and Ju, Y.S., “Minimum Conditions for the Induction of Cortical Spreading Depression,” the 54th American Headache Society Meeting, June 21-24, 2012, Los Angeles, CA, USA.

11. Bogdanov, V.B., Tang, Y.T., Multon, S., Mamilov, S.A., Misyura, A.G., Schoenen, J., Ju, Y.S., and Brennan, K.C., “Preferential Susceptibility and Propagation of Spreading Depression in Superficial Cortical Layers,” the 54th American Headache Society Meeting, June 21-24, 2012, Los Angeles, CA, USA.

12. Brennan, K.C., Tang, Y.T. , López-Valdés, H. E. and Ju, Y. S., “Minimum Conditions for the Induction of Cortical Spreading Depression: Implications for Migraine with Aura,” the 64th American Academy of Neurology Annual meeting, April 21-28, 2012, New Orleans, LA, USA. Top 5 % of the program and, is highlighted in the "Scientific Program Highlights Plenary Session."

13. Jia, Y. and Ju, Y. S., “Solid-State Refrigerator based on the Electrocaloric Effect,” ASME 2012 International Mechanical Engineering Congress and Exposition, November 9-15, 2012, Houston, TX, IMECE2012-93114.

14. Jia, Y., He, H., Ju, Y. S., “Magnetothermal Energy Harvester Incorporating Liquid-based Switchable Thermal Interfaces,” presented at ASME 2012 International Mechanical Engineering Congress and Exposition, November 9-15, 2012, Houston, TX, IMECE2012-93113.

15. Trujillo, J., Kim, J., Lan, E., Ju, Y.S., Dunn, B., “Combining Positive and Negative Thermal Expansion Materials to Tailor the Coefficient of Thermal Expansion in Metal/Ceramic Composites,” Materials Science & Technology 2012 Conference and Exhbition, October 7-11, 2012, Pittsburgh, PA, USA.

16. Cha, G., Jia, Y. B., and Ju, Y. S., "Thermal Energy Harvesting Based on Pyroelectric Copolymers and Liquid-Based Switchable Thermal Interfaces," presented at ASME 2012 3rd Micro/Nanoscale Heat & Mass Transfer International Conference, Atlanta, GA, March 3-6, 2012, MNHMT2012-75214.

17. Peng, C., Sharratt, S., and Ju, Y. S., “Exploration of Alternative Wick Geometries for Micro Heat Pipe and Vapor Chambers," presented at ASME 2012 3rd Micro/Nanoscale Heat & Mass Transfer International Conference, March 3-6, 2012, Atlanta, Georgia, USA.

1. Nam, Y., Sharratt, S., and Ju, Y. S., “Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks,” Journal of Heat Transfer, Vol. 133, 101502, 2011.

2. Bulgrin, K. E., Ju, Y. S., Carman, G., and Lavine, A. S., “An Investigation of a Tunable Magnetomechanical Thermal Switch,” Journal of Heat Transfer, Vol. 133, 101401, 2011.

3. Tang, Y. T., Kim, J., López-Valdés, H. E., Brennan, K. C., and Ju, Y. S., “Development and Characterization of a Microfluidic Chamber Incorporating Fluid Ports with Active Suction for Localized Chemical Stimulation of Brain Slices,” Lab on a Chip, Vol. 11, pp. 2247-2254, 2011.

4. Hwang, G. S., Fleming, E., Carne, B., Sharratt, S., Nam, Y., Dussinger, P., Ju, Y. S., and Kaviany, M., “Multi-Artery Heat-Pipe Spreader: Lateral Liquid Supply,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 2334-2340, 2011.

5. Nam, Y., Aktinol, E., Dhir, V. K., and Ju, Y. S., “Single Bubble Dynamics on a Superhydrophilic Surface with Artificial Nucleation Sites,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 1572-1577, 2011.

6. Tang, Y. T., Lopez-Valdes, H. E., Brennan, K. C., and Ju, Y. S., “Localized Induction of Cortical Spreading Depression Waves in Brain Slices using Microfluidic Injection,” Proceedings of the 15th International Conference on Miniaturized System for Chemistry and Life Sciences (TAS 2011), Seattle, WA, October 2-6, 2011, pp. 867-869.

7. Sharratt, S., Nam, Y., and Ju, Y. S., “Liquid Supply and Heat Transfer Performance of Sintered Cu Monolayer Wicks for Phase Change Heat Transfer Applications,” Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference AJTEC2011, March 13-17, 2011, Honolulu, Hawaii, USA, AJTEC2011-44356.

8. Nam, Y., Sharratt, S., and Ju, Y. S., “Nanostructured Cu Micro-post Wicks for Advanced Heat Pipes,” Proceedings of the IEEE 24th International Conference on Micro Electro Mechanical Systems, January 23-27, 2011, Cancun, Mexico, pp. 1313-1316.

9. Ju, Y. S., “Thermal Ground Planes Incorporating Bio-inspired Multiscale Wicks for High Heat Flux Devices,” presented at the ASME International Mechanical Engineering Congress and Exposition (IMECE), Denver, CO, November 11-17, 2011, IMECE2011-65301.

10. Sharratt, S., Peng, C., and Ju, Y. S., “Modeling and Characterization of Advanced Geometries for Single-Layer Evaporator Wicks,” presented at the ASME International Mechanical Engineering Congress and Exposition (IMECE), Denver, CO, November 11-17, 2011, IMECE2011-65287.

11. Sharratt, S. and Ju, Y. S., “Thermal Management of LED Lighting Systems using Low-Temperature Synthesized Cu Wicks on PCB Substrates,” presented at the ASME International Mechanical Engineering Congress and Exposition (IMECE), Denver, CO, November 11-17, 2011, IMECE2011-65297.

12. Tang, Y. T., López-Valdés, H. E.  Brennan, K-C., and Ju, Y. S., “Microfluidic Brain Slice Chamber with Localized Injection Ports and Its Application to the Study of Cortical Spreading Depression,” presented at the 12th Annual UC Systemwide Bioengineering Symposium, Santa Barbara, CA, June 13-15, 2011.

13. Trujillo, J.E., Kim, J.W., Lan, E.H., Sharrat, S., Ju, Y.S., and Dunn, B.,“Metal-Matrix Nanocomposites with Tailored Coefficients of Thermal Expansion (CTE) for Improved Thermomechanical Reliability of Thermoelectric Devices,” presented at the 30th International Conference on Thermoelectrics, Traverse City, Michigan, July 17-21, 2011.

14. Cha, G., Jia, Y., and Ju, Y. S., “Solid-state Waste Heat Harvesting Device Based on the Pyroelectric Effect and Liquid-Based Switchable Thermal Interfaces,” presented at MRS 2011 Spring Meeting, San Francisco, CA, April 26-28, 2011 (Symposium E: Energy Harvesting – From Fundamentals to Devices).

1. Ju, Y. S., “Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling,” Journal of Electronic Packaging, Vol. 132, 041004, 2010.

2. Nam, Y., Sharratt, S., Byon, C., Kim, S. J., Ju, Y. S., “Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays,” Journal of Microelectromechanical Systems, Vol. 19, pp. 581-588, 2010.

3. Cha, G., Ju, Y. S., Ahure, L. A., and Wereley, N. M., “Experimental Characterization of Thermal Conductance Switching in Magnetorheological Fluids,” Journal of Applied Physics, Vol. 107, 09B505, 2010.

4. Hwang, G. S., Nam, Y., Fleming, E., Dussinger, P., Ju, Y. S., and Kaviany, M., “Multi-artery Heat Pipe Spreader: Experiment,” International Journal of Heat and Mass Transfer, Vol. 53, pp. 2662-2669, 2010.

5. Byon, C., Nam, Y., Kim, S. J., and Ju, Y. S.,” Drag Reduction in Stokes Flows over Spheres with Nanostructured Superhydrophilic Surfaces,” Journal of Applied Physics, Vol. 107, 066102, 2010.

6. Maung, J. K., Hahn, H. T., and Ju, Y. S., “Multifunctional Integration of Thin Film Silicon Solar Cells on Carbon Fiber Reinforced Epoxy Composites,” Solar Energy, Vol. 84, pp. 450-458, 2010.

7. Sharratt, S., Nam, Y., and Ju, Y. S., “Performance Modeling of Micropost Wicks for Micro Heat Pipes at Low Heat Fluxes,” Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition, November 12-18, Vancouver, British Columbia, Canada, IMECE2010-40719.

8. Nam, Y., Sharratt, S., and Ju, Y. S., “Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes,” Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition, November 12-18, Vancouver, British Columbia, Canada, IMECE2010-40242.

9. Tang, Y. T., Kim, J. Lopez-Valdes, H., Brennan, K. C., and Ju, Y. S., “Microfluidic Chamber with Active Suction Ports for Localized Chemical Stimulation of Brain Slices,” Proceedings of  the IEEE 23rd International Conference on Micro Electro Mechanical Systems, January 24-28, 2010, Hong Kong, China, pp. 304-307.

1. Kim, J. and Ju, Y. S., “On-Chip Characterization of the Mass Diffusivity of Binary Mixtures Using Brownian Microscopy,” Sensors and Actuators A. Physical, Vol. 155, pp. 39-46, 2009.

2. Cha, G. and Ju, Y. S., “Reversible Thermal Interfaces based on Microscale Dielectric Liquid Layers,” Applied Physics Letters, Vol. 94, 211904, 2009.

3. Nam, Y., Warrier, G., Wu, J., and Ju, Y. S., “Experimental and Numerical Study of Single Bubble Dynamics on a Hydrophobic Surface,” Journal of Heat Transfer, Vol. 131, 121004, 2009.

4. Nam, Y. and Ju, Y. S., “Fabrication and Characterization of Superhydrophilic Cu Microposts for Micro Heat Pipes,” Proceedings of the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, Washington DC, USA, December 1-4, 2009, pp. 123-126.

5. Bulgrin, K. E., Lavine, A. S., and Ju, Y. S., “Magnetomechanical Thermal Diode with Tunable Switching Temperatures,” Proceedings of the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, Washington DC, USA, December 1-4, 2009, pp. 153-156

6. Cha, G. and Ju, Y. S., “Liquid-Mediated Reversible Thermal Interface for Satellite Thermal Management,” Proceedings of the 2009 ASME International Mechanical Engineering Congress and Exposition, November 13-19, Lake Buena Vista, Florida, USA, IMECE2009-12429.

7. Bulgrin, K. E., Ju, Y. S., Carman, G. P., and Lavine, A. S., “A Coupled Thermal and Mechanical Model of a Thermal Energy Harvesting Device,” Proceedings of the 2009 ASME International Mechanical Engineering Congress and Exposition, November 13-19, Lake Buena Vista, Florida, USA, IMECE2009-13040.

8. Bulgrin, K. E., Ju, Y. S., Carman, G. P., and Lavine, A. S., “A Tunable Magnetomechanical Thermal Switch for Thermal Management Purposes,” Proceedings of the ASME 2009 Heat Transfer Summer Conference, July 19-23, 2009, San Francisco, California, USA, HT2009-88571.

1. Kim, J. and Ju, Y. S., “Brownian Microscopy for Simultaneous in situ Measurements of the Viscosity and Velocity Fields in Steady Laminar Microchannel Flows,” Journal of Microelectromechanical Systems, Vol. 17, pp. 1135-1143, 2008.

2. Hung, M.-T. and Ju, Y. S., “Thermal Patterning of Amorphous Fluoropolymer Layers,” Sensors & Actuators: A. Physical, Vol. 148, pp. 111-114, 2008.

3. Nam, Y. and Ju, Y. S., “Bubble Nucleation on Hydrophobic Islands Provides Evidence to Anomalously High Contact Angles of Nanobubbles,” Applied Physics Letters, Vol. 93, 103115, 2008.

4. Ju, Y. S., Kim, J., and Hung, M.-T., “Experimental Study of Heat Conduction in Aqueous Suspensions of Aluminum Oxide Nanoparticles,” Journal of Heat Transfer, 130, 092403, 2008.

5. . Ju, Y. S., “Impact of Interface Resistance on Pulsed Thermoelectric Cooling,” Journal of Heat Transfer, 130, 014502, 2008.

6. Nam, Y. and Ju, Y. S., “Comparative Study of Copper Oxidation Schemes and Their Effects on Surface Wettability,” Proceedings of 2008 ASME International Mechanical Engineering Congress and Exposition, November 2-6, 2008, Boston, Massachusetts, USA, IMECE2008-67492. 

7. Nam, Y. and Ju, Y. S., “Bubble Nucleation on Nanoscopically Smooth Hydrophobic Islands,” Proceedings of 2008 ASME International Mechanical Engineering Congress and Exposition, November 2-6, 2008, Boston, Massachusetts, USA, IMECE2008-67483.

8. Ju, Y. S. and Cha, G., “Impact of Micro/Nanoscale Heat Transfer in Silicon Substrates on Thermal Interface Resistance Characterization,” Proceedings of 2008 ASME International Mechanical Engineering Congress and Exposition, November 2-6, 2008, Boston, Massachusetts, USA, IMECE2008-67511.

9. Maung, K. J., Hahn, H. T., and Ju, Y. S., “Multifunctional Characterization of Structurally Integrated Thin-Film Silicon Solar Cell Modules,” Proceedings of the 2008 SAMPE Fall Technical Conference, Memphis, TN, September 8-11, 2008.

10. Kim, J. and Ju, Y. S., “On-Chip Characterization of the Transport Properties of Liquids Using Microfluidic Channel-Based Brownian Microscopy,” Proceedings of IEEE MEMS 2008 Conference, Tucson, Arizona, January 13-17, 2008, pp. 587-590.

11. Gong, J., Cha, G., Ju, Y. S., and Kim, C.-J., “Thermal Switches Based on Coplanar EWOD for Satellite Thermal Control,” Proceedings of IEEE MEMS 2008 Conference, Tucson, Arizona, January 13-17, 2008, pp. 848-851.

12. Bulgrin, K., Lavine, A. S., Carman, G., and Ju, Y. S., “A Multi-Physics Model of a Novel Two-Step Thermal Energy Harvesting Device,” presented at MRS 2008 Spring Meeting, San Francisco, CA, March 23-28, 2008 (Symposium LL: Energy Harvesting--From Fundamentals to Devices).

1. Hung, M.-T. and Ju, Y. S., “Process Dependence of the Thermal Conductivity of Image Reversal Photoresist Layers,” Journal of Vacuum Science and Technology B, 25, pp. 224-228, 2007.

2. Nam, Y., Warrier, G., Wu, J., and Ju, Y. S., “Experimental and Numerical Study of Single Bubble Dynamics on a Hydrophobic Surface,” Proceedings of the 2007 ASME International Mechanical Engineering Congress and Exposition, IMECE2007-42461, Seattle, WA, November 11-15, 2007.

3. Sugar, J. G., Scaffaro , R. Guo, Z. Maung, J. K., Ju, Y. S., and Hahn, H. T., “Photovoltaic Performance of Amorphous Silicon Flexible Solar Modules under Mechanical Loading,” Proceedings of the 6th International Workshop on Structural Health Monitoring, Stanford, CA,  September 11-13, 2007.

4. Ju, Y. S., Kim, J., and Hung, M.-T., “Experimental Study of Heat Conduction in Aqueous Suspensions of Aluminum Oxide Nanoparticles,” Proceedings of the 2007 ASME-JSME Thermal Engineering Summer Heat Transfer Conference, HT2007-32689, Vancouver, British Columbia, CANADA, July 8-12, 2007.

5. Nam, Y., Warrier, G., Wu, J., and Ju, Y. S., “Single Bubble Dynamics on a Hydrophobic Surface,” Proceedings of the 2007 ASME-JSME Thermal Engineering Summer Heat Transfer Conference, HT2007-32690, Vancouver, British Columbia, CANADA, July 8-12, 2007.

1. Ju, Y. S., Hung, M.-T., and Usui, T., “Nanoscale Heat Conduction across Metal-Dielectric Interfaces,” Journal of Heat Transfer, 128, pp. 919-925, 2006.

2. Hung, M.-T., Choi, O., Ju, Y. S., and Hahn, H. T., “Heat Conduction in Graphite Nanoplatelet-Reinforced Polymer Composites,” Applied Physics Letters, Vol. 89, 023117, 2006.

3. Ju, Y. S., “Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications,” Journal of Electronic Packaging, Vol. 128, pp. 109-114, 2006.

4. Hung, M.-T., Kim, J., and Ju, Y. S., “Exploration of Thermolithography for Micro- and Nanomanufacturing,” Applied Physics Letters, Vol. 88, 123110, 2006.

5. Theriot, J., Prakash, N., Toga, A., and Ju, Y. S., “Microfabricated Electrode Array Compatible with Optical Imaging of Intrinsic Signals During Somatosensory Stimulation and Cortical Spreading Depression,” Proceedings of the 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 16086, Chicago, Illinois, USA, November 5-10, 2006.

6. Kim, J. and Ju, Y. S., “Analysis and Experimental Characterization of Statistical Errors in Brownian Microscopy,” Proceedings of the 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006-16104, Chicago, Illinois, USA, November 5-10, 2006.

7. Hung, M.-T., Choi, O., Guo, Z., Hahn, H. T., and Ju, Y. S., “Heat Transport in Graphite Nanoplatelet-Reinforced Polymeric Nanocomposites and Aluminum Oxide Nanofluids,” Proceedings of the 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Paper Number AIAA 2006-3112, San Francisco, CA, June 5-8, 2006.

8. Theriot, J., Prakash, N., Mitsuyama, S., Ju, Y. S., and Toga, A. W., “Application of a Semi-Transparent Multi-Electrode Array to Examine the Coupling between Optical Intrinsic Signals and Field Potentials in Rat Somatosensory Cortex,” presented at Neuroscience 2006, Oct. 14-18, 2006, Atlanta, GA.

9. Theriot, J., Prakash, N., Mitsuyama, S., Ju, Y. S., and Toga, A. W., “Microelectrode Array to Characterize Evoked Responses in Rat Somatosensory Cortex during Cortical Spreading Depression: Simultaneous Electrophysiology and Functional Imaging Of Optical Intrinsic Signals,” presented at the 2006 UC Systemwide Bioengineering Symposium, June 25~26, 2006, Los Angeles, CA. 

1. Ju, Y. S., “Self-Heating in Thin-Film Magnetic Recording Heads due to Write Currents,” IEEE Transactions on Magnetics, Vol.41,  pp. 4443- 4448, 2005.

2. Ju, Y. S., “Impact of Nonequilibrium between Electrons and Phonons on Heat Transfer in Metallic Nanoparticles Suspended in Dielectric Media,” Journal of Heat Transfer, Vol. 127, pp. 1400-1403, 2005.

3. Ju, Y. S., “Phonon Heat Transport in Silicon Nanostructures,” Applied Physics Letters, Vol. 87, 153106, 2005.

4. Ju, Y. S., “Micro- and Nano-scale Thermal Phenomena in Thin-Film Magnetic Recording Heads,” Journal of Vacuum Science and Technology A, Vol. 23, pp. 1276-1283, 2005.

5. Ju, Y. S., Hung, M.-T., Carey, M. J., Cyrille, M.-C., and Childress, J. R., “Nanoscale Heat Conduction across Tunnel Junctions,” Applied Physics Letters, Vol. 86, 203113, 2005.

6. Hung, M.-T. and Ju, Y. S., “Exploration of Thermolithography for Micro- and Nano-Manufacturing,” Proceedings of ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (InterPack 2005), IPACK2005-73424, San Francisco, CA, July 17-22, 2005.

7. Ju, Y. S., Hung, M.-T., and Usui, T., “Nanoscale Heat Conduction across Metal-Dielectric Interfaces,” Proceedings of ASME Summer Heat Transfer Conference, HT2005-72364, San Francisco, CA, July 17-22, 2005.

8. Meng, D.-S., Ju, Y. S., and Kim, C.-J., “A Comparative Study of Electrolysis and Boiling for Bubble-Driven Microactuations,” Proceedings of the 13th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’ 05), Seoul, Korea, June 5-9, 2005, pp. 1263-1266.

9. Hung, M.-T. and Ju, Y. S., “Thermolithography for Micro- and Nanofabrication,” presented at AVS 52nd Annual International Symposium, Boston, MA, October 30-November 4, 2005.

10. Ju, Y. S., “Heat Conduction across Nanolaminates of Alternating Metal-Dielectric Materials,” presented at AVS 52nd Annual International Symposium, Boston, MA, October 30-November 4, 2005.

1. Ju, Y. S., “A Study of Heat Generation and Transport in Tunnel Junctions,” Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2004), Las Vegas, Nevada, June 1-4, 2004, pp. 411-417.

2.  Ju, Y. S., “Micro- and Nanoscale Phonon Heat Transport in Silicon,” Proceedings of ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, North Carolina, July 11-15, 2004, paper no. HT-FED04-56743.

1. Katine, J. A., Ho, M. K., Ju, Y. S., Rettner, C. T., “Patterning Damage in Narrow Track Spin-Valve Sensors,” Applied Physics Letters, Vol. 83, pp. 401-403, 2003. 

1. Ju, Y. S., Lee, W.-Y., Cyrille, M. C., Fontana, R. E., and Gurney, B., “Thermal Engineering of Giant Magnetoresistive Sensors: Alternative Dielectric Gap,”  IEEE Transactions on  Magnetics, Vol. 38, pp. 2259-2261, 2002 and also presented at International Magnetics Conference Europe, April 28-May 2, 2002, Amsterdam, the Netherlands.

2.  Ju, Y. S., Xu, R., Wu, X., Smith, N., Fontana, R., Lee, W., Carey, K., Ho, M., Hsiao, D., and Gurney, B., “A Combined Experimental and Numerical Study of Temperature Rise in GMR Sensors due to Self-Heating,” IEEE Transactions on Magnetics, Vol. 37, pp. 1701-1703, 2001.

3.  14. Wang, R. H., Wu, X. Z., Weresin, W., and Ju, Y. S., “Head Protrusion and Its Implications on Head-Disk Interface Reliability,” IEEE Transactions on Magnetics, Vol. 37, pp. 1842-1844, 2001.

4.  Sverdrup, P. G., Ju, Y. S., and Goodson, K. E., “Sub-Continuum Simulations of Heat Conduction in Silicon-On-Insulator Transistors,” Journal of Heat Transfer, Vol. 123, pp.130-137, 2001.

5.  Ju, Y. S. and Ghoshal, U., “Study of Interface Effects in Thermoelectric MicroRefrigerators,” Journal of Applied Physics, Vol. 88, pp. 4135-4137, 2000.

6.  Ju, Y. S., “Thermal Conduction and Viscous Heating in Microscale Couette Flows,” Journal of Heat Transfer, Vol. 122, pp. 817-818, 2000.

7.  Ju, Y. S. and Goodson, K. E., “Phonon Scattering in Silicon Films with Thickness of Order 100 nm," Applied Physics Letters, Vol. 74, p. 3005-3007, 1999.

8. Ju, Y. S. and Goodson, K. E., “Process-Dependent Thermal Transport Properties of Silicon-Dioxide Films Deposited Using Low-Pressure Chemical Vapor Deposition," Journal of Applied Physics, Vol. 85, pp. 7130-7134, 1999.

9. Ju, Y. S., Kurabayashi, K., and Goodson, K. E., “Thermal Characterization of Anisotropic Thin Dielectric Films using Harmonic Joule Heating,” Thin Solid Films, Vol. 339, pp. 160-164, 1999.

10. Chui, B. W., Asheghi, M., Ju, Y. S., et al., “Intrinsic-Carrier Thermal Runaway in Silicon Microcantilevers,” Microscale Thermal Engineering, Vol. 3, pp. 217-228, 1999.

11. Ju, Y. S. and Goodson, K. E., “Short-Timescale Thermal Mapping of Microdevices Using a Scanning Thermoreflectance Technique,” Journal of Heat Transfer, Vol. 120, pp. 306-313, 1998.

12. Chui, B. W., Stowe, T. D., Ju, Y. S, Goodson, K. E., Kenny, T. W., Mamin, H. J., Terris, B. D., Ried, B. P., and Rugar, D., “Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage,” Journal of MEMS, Vol. 7, p. 69-78, 1998.

13. Ju, Y. S., Kurabayashi, K., and Goodson, K. E., “Thermal Characterization of IC Passivation Layers Using Joule Heating and Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 2, pp. 101-110, 1998.

14. Ju, Y. S., Käding, O. W., Leung, Y. K., Wong, S. S., and Goodson, K. E., “Short-Timescale Thermometry of Semiconductor Devices,” IEEE Electron Device Letters, Vol. 18, p. 169-171, 1997.

15. Ju, Y. S. and Goodson, K. E., “Thermal Mapping of Interconnects Subjected to Brief Electrical Stresses,” IEEE Electron Device Letters, Vol. 18, p. 512-514, 1997.

16. Ju, Y. S. and Goodson, K. E., “Size Effect on Thermal Conduction in Silicon-on-Insulator Devices under Electrostatic Discharge Conditions,” Japanese Journal of Applied Physics, Vol. 36, p. L798-800, 1997.