Research Project

Research Projects from National Science and Technology Council

1. Development of OptoElectroMechanical(OEM) Wafer-Level Testing System for Thin Film Material of CMOS-MEMS Devices (Ⅰ) (NSC 101-2218-E-110 -006)

2. Development of OptoElectroMechanical(OEM) Wafer-Level Testing System for Thin Film Material of CMOS-MEMS Devices (Ⅱ) (NSC 102-2221-E-110 -052)

3. Electromechanical Characteristics of Microstructure with Etching Holes: Application to Tunable Resonator (MOST 103-2221-E-110 -032)

4. Electromechanical Characteristics of A Micro Mirror and its Optimized Design (MOST 104-2221-E-110-011)

5. Development and Optimal Design of Testkey for Determining the Thermal Expansion Coefficient of Thin Film (MOST 105-2221-E-110 -036 -MY2)

6. Development of A Real-Time Monitoring System of Motion For Exercise Training (MOST 107-2221-E-110-070-MY3)

7. Study of Failure Modes For Thin Type Flip Chip Package And Design Optimization (MOST 110-2221-E-110-035)

8. Study of Failure Modes For Thin Type Flip Chip Package And Design Optimization (Ⅱ) (MOST 111-2221-E-110-049)

9. Developing an evaluation model for the reliability of fan-out wafer-level packaging components and board-level using machine learning methods(NSTC 113-2221-E-006-232)

10. Development and system integration of compound semiconductors and advanced packaging technologies(NSTC 113-2640-E-006-007 ) (NSTC 114-2640-E-006-006)

11. Developing an evaluation model for the reliability of fan-out wafer-level packaging components and board-level using machine learning methods(II)(NSTC 114-2221-E-006-146)

12. Thermo-Mechanical Coupled Reliability Modeling and Lifetime Prediction for Automotive-Grade Double-Sided Fan-Out Glass Core Packaging (NSTC 115-2221-E-006-247)

Other Projects

1. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, development of flexible strain sensor module for spinal muscle activation training. (NSYSUKMU 2013–P033)

2. Yonghua Optoelectronics Co., Ltd.- Laser scribing surface inspection. (N102038)

3. Advanced Semiconductor Engineering, Inc. (ASE)- Analysis of fracture mechanisms in wafer dicing using stealth laser technology. (N102114)

4. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, development of spinal muscle activation training system. (NSYSUKMU 103-P027)

5. Advanced Semiconductor Engineering, Inc. (ASE)-Dicing wafer expand rule for die to die gap control effect corner chipping. (N103146)

6. National Sun Yat-sen University and Kaohsiung Medical University Joint Research Program, Top-notch research universities program, optimization of flexible sensors for spinal muscle activation training. (NSYSUKMU 104-P029)

7. Advanced Semiconductor Engineering, Inc. -Simulation and analysis for WLCSP protection thickness / material type for package structure. (N104169)

8. Advanced Semiconductor Engineering, Inc. (ASE)-Simulation study on dynamic warpage behavior with different substrate thickness and temperature profile. (N105165)

9. Advanced Semiconductor Engineering, Inc. (ASE)- Thin wire bond dram product for strip / package warpage influence factor simulation analysis. (N106177)

10. National Chung Shan Institute of Science and Technology-Stealth propulsion technology and evaluation and market analysis. (N107121)

11. Advanced Semiconductor Engineering, Inc. (ASE)- Study on the correlation between die structure and thickness on expanded films and establishment of simulation models. (N107179)

12. Advanced Semiconductor Engineering, Inc. (ASE)- Warpage model establishment and optimal design for thin strip structures. (N108215)

13. Advanced Semiconductor Engineering, Inc. (ASE)- Study on the application of key properties of compound materials in fan-out packaging processes. (N110232)

14. Advanced Semiconductor Engineering, Inc. (ASE)- Power Module and Board-level Reliability for ATV and HPC with Low Carbon Footprint of Soldering/Sintering Material. (B113-K802)

15. Advanced Semiconductor Engineering, Inc. (ASE)-Molding warpage key parameter simulation.(B113-A009MS)

16. Innolux Corporation-Advanced Packaging on Glass Panel. (B113-A014BS)

17. Advanced Semiconductor Engineering, Inc. (ASE)-Molding warpage key parameter simulation. (Continuation Case) (B114-A013JS)

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