News

- 2026/05/08 - Congratulations! Chun-Yu Ting, a master's student, has won the Best Paper Award in the Forum category at the ISME 2026 Paper Competition.
- 2026/05/08 - Congratulations! Ting-Kai Zhang, a master's student, has won the Best Paper Award in the Forum category at the ISME 2026 Paper Competition.
- 2025/05/02 - Congratulations! Jun-Yong Mao, a master's student, has won the Best Paper Award in the Forum category at the ISME 2025 Paper Competition.
- 2025/01/06 - Congratulations! Po-En Chen was awarded the "Excellent Master's Thesis award" in the 2024 Annual Thesis Competition of the International Society of Mechatronic Engineering.
- 2024/04/26 - Congratulations! Chung-Jui Wang, a master's student, has won the Best Paper Award in the Forum category at the ISME 2024 Paper Competition.
- 2024/04/26 - Congratulations! Po-En Chen, a master's student, has won the Best Paper Award in the Forum category at the ISME 2024 Paper Competition.
- 2023/12/15 - Congratulations! Kuan-Lun Hsiao was awarded the "Excellent Thesis Award" in the 2023 Annual Thesis Competition of the International Society of Mechatronic Engineering.
- 2023/04/30 - Congratulations! Graduate students Yi Huang and Po-En Chen have submitted their research results to the SCI journal "Materials" and the manuscript have been accepted and published. They will receive a reward of 3000 NTD.
  Paper title: Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.
- 2023/04/28 - Congratulations! Po-En Chen, a master's student, has won the Best Paper Award in the Forum category at the ISME 2023 Paper Competition.
- 2023/04/28 - Congratulations! Yi Huang, a master's student, has won the Best Paper Award in the Forum category at the ISME 2023 Paper Competition.
- 2023/04/28 - Congratulations! Yen-Cheng Lai, a master's student, has won the Best Paper Award in the Forum category at the ISME 2023 Paper Competition.
- 2022/04/22 - Congratulations! Kuan-Lun Hsiao, a master's student, has won the Best Paper Award in the Forum category at the ISME 2022 Paper Competition.
- 2022/04/22 - Congratulations! Yen-Cheng Lai, a master's student, has won the Best Paper Award in the Forum category at the ISME 2022 Paper Competition.

Research Field

Mechanical Property Testing Technique of MEMS Thin Film Materials Compatible with CMOS Process

Our research team has been focusing on developing material mechanical property testing techniques that are suitable for wafer-level testing in recent years. By utilizing the circuit behavior of a CMOS-MEMS testkey, we can measure the pull-in voltage of the test specimen to extract the mechanical parameters of metal thin films in the CMOS process.

Electromechanical Behavior Analysis of Electrostatic Microstructures

The analysis model established by our research team considers the nonlinear electromechanical coupling effect, stray fringing field, and non-ideal boundary conditions of electrostatic structures. From the energy point of view, we derive an approximate analytical solution for the pull-in voltage, which exhibits a certain degree of accuracy when compared with experimental measurements.

Development of Real-time Motion Detection System for Assisted Exercise Training

Our research team has recently focused on developing a real-time motion detection system for assisted exercise training. The system analyzes signals from sensors to obtain information on user posture, speed, angle, and other metrics during training. This enables the system to provide users with feedback on correct exercise posture during training and avoid injuries caused by incorrect posture. The sensors used in the system are flexible and can conform to body surfaces such as knees, back, and wrists, making the system suitable for various body part exercise training. It can assist users with different exercise training needs in self-directed exercise and fitness to promote physical and mental health.

Investigation of Failure Modes in Advanced Packaging Processes

Our research team has been devoted to investigating failure modes and design specifications for advanced packaging processes in recent years. This includes developing models for predicting the warpage of various package designs in wire bonding, flip chip, and fan-out wafer-level packaging processes, as well as conducting optimization analyses of package structure design and process parameters. In addition, we have successfully established a wafer-level chip lifetime assessment model and estimated the fatigue life of package bodies during temperature cycling tests using creep and plasticity models.

Department of Mechanical and Electromechanical Engineering, National Sun Yat-sen University.

Microsystem Design and Analysis Laboratory. [EN3040-1]

No. 70, Lianhai Road, Gushan District, Kaohsiung City 804, Taiwan.

TEL: +886-7-5252000 ext.4265

Department of Engineering Sciences, National Cheng Kung University.

Microsystem Design and Analysis Laboratory. [41121]

No. 1, University Road, East District, Tainan City 701, Taiwan.

TEL:+886-6-2757575 ext.63342#24