相關著作
學術性著作
(A)期刊論文
W. C. Chuang*, Y. Huang, and P.-E. Chen, "Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging," Materials, vol. 16, no. 9, 2023.(Q1: Metallurgy & Metallurgical Engineering [17/79 =21.52%],I.F. 3.748) (SCI)[cited1] DOI:https://doi.org/10.3390/ma16093482
W. C. Chuang* and W. L. Chen, "Study on the Strip Warpage Issues Encountered in the Flip-chip Process," Materials, vol. 15(1), 323, 2022. (Q1: Metallurgy & Metallurgical Engineering [17/79 =21.52%],I.F. 3.748) (SCI) [cited 4] DOI:https://doi.org/10.3390/ma15010323
W. C. Chuang* and W. L. Chen, "Investigation of strip warpage behavior in wire bonding process," Journal of Electronic Packaging, vol. 142, pp. 021002-021014, 2020. (Q3: Engineering, Mechanical [73/130 =56.2%], I.F. 1.99) (SCI) [cited 1] DOI: https://doi.org/10.1115/1.4045362
W. C. Chuang* and W. L. Chen, "Fatigue prediction for molded wafer level package during temperature cycling," Journal of Electronic Packaging, vol. 142, pp. 011007-011014, 2020. (Q2: Engineering, Mechanical [73/130 =56.2%], I.F. 1.99) (SCI) [cited 2] DOI: https://doi.org/10.1115/1.4044489
W. C. Chuang* and W. L. Chen, "Real-time monitoring for knee extensor muscle training with flexible sensors," IEEE/ASME Journal of microelectromechanical systems, vol. 28, pp. 1005-1012, 2019. (Q2:Instruments & Instrumentation[21/61 =34.4%], I.F. 2.621) (SCI) [cited1] DOI: https://doi.org/10.1109/JMEMS.2019.2941939
W. C. Chuang* and W. L. Chen, "Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion," Journal of the Chinese Institute of Engineers, vol. 42, pp. 290-296, 2019. (Q4:Engineering ,Multidisciplinary [77/88=87.5%], I.F. 0.651) (SCI) [cited 1] DOI: https://doi.org/10.1080/02533839.2019.1584736
W. C. Chuang*, "The robustness of an algorithm applied in wafer‑level material property extraction," Microsystem Technologies, vol. 22, pp. 531-536, 2016(Engineering, Electrical & Electronic Q3: [158/257=61.4% ], I.F. 0.952) (SCI) (selected by Advances in Engineering as a Key Scientific Article) DOI: https://doi.org/10.1007/s00542-015-2581-9
W. C. Chuang*, H. T. Lin, and W. L. Chen, "Strengthening of back muscles using a module of flexible strain sensors," Sensors, vol. 15, pp. 3975-87, 2015.(Q1: Instruments & Instrumentation[10/56=17.8% ], I.F. 2.245) (SCI) [cited 4] DOI: http://doi.org/10.3390/s150203975
W. C. Chuang, David T. W. Lin*, Y. C. Hu, H. L. Lee, C. H. Cheng, P. Z. Chang, and N. B. Quyen, "A method integrating optimal algorithm and FEM on CMOS residual stress," Journal of Mechanics, vol. 30, pp. 123-128, 2014. (Q4: Mechanics [130/139=93.5% ], I.F. 0.314) (SCI) [cited 12]. (selected by Advances in Engineering as a Key Scientific Article) DOI: http://doi.org/10.1017/jmech.2013.51
W. C. Chuang*, Y. C. Hu, and P. Z. Chang, "CMOS-MEMS test-key for extracting wafer-level mechanical properties, " Sensors, vol. 12, pp. 17094-17111, 2012. (Q1: Instruments & Instrumentation [14/58=24.1% ], I.F. 1.739 ) (SCI) [cited 6] DOI: http://doi.org/10.3390/s121217094
W. C. Chuang, C. W. Wang, W. C. Chu, P. Z. Chang, and Y. C. Hu, "The fringe capacitance formula of microstructures," Journal of Micromechanics and Microengineering, vol. 22, pp. 25015-25021, 2012. (Q1: Instruments & Instrumentation [7/58=12% ], I.F. 2.105) (SCI) [cited 24] DOI: http://doi.org/10.1088/0960-1317/22/2/025015
W. C. Chuang, H. L. Lee, P. Z. Chang, and Y. C. Hu, "Review on the modeling of electrostatic MEMS," Sensors, vol. 10, pp. 6149-6171, 2010. (Q1: Instruments & Instrumentation [11/58=18.9% ], I.F. 1.821) (SCI) [cited 132] DOI: http://doi.org/10.3390/s100606149
W. C. Chuang, Y. C. Hu, C. Y. Lee, W. P. Shih, and P. Z. Chang, "Electromechanical behavior of the curled cantilever beam," Journal of Micro-Nanolithography Mems and Moems, vol. 8, pp. 033020-1 - 033020-8, 2009. (Engineering,Electrical&Electronic Q2: [114/229=49.7% ], I.F. 1.067) (SCI) [cited 13] DOI: https://doi.org/10.1117/1.3158355
Y. C. Hu, P. Z. Chang, and W. C. Chuang, "An approximate analytical solution to the pull-in voltage of a micro bridge with an elastic boundary," Journal of Micromechanics and Microengineering, vol. 17, pp. 1870-1876, 2007. (Q1: Mechanics [6/109=5.5% ], I.F. 2.321) (SCI) [cited 17] DOI: http://doi.org/10.1088/0960-1317/17/9/016
(B)研討會論文
莊婉君*、陳伯恩,晶片之結構厚度對於扇出型封裝移除載台製程之晶圓翹曲量影響,第九屆台灣機電工程國際學會全國學術研討會,宜蘭,台灣,四月,2024。Download
莊婉君*、陳伯恩,模製化合物之結構厚度對於扇出型封裝移除載台製程之晶圓翹曲,第九屆台灣機電工程國際學會全國學術研討會,宜蘭,台灣,四月,2024。Download
莊婉君*、黃翌、陳伯恩,鈍化層厚度對晶圓級扇出型封裝之移除載台製程的翹曲影響,第九屆台灣機電工程國際學會全國學術研討會,宜蘭,台灣,四月,2024。Download
莊婉君*、黃翌、陳伯恩,晶圓級扇出型封裝之第一介電層添加製程中介電層材料特性對翹曲之影響,第九屆台灣機電工程國際學會全國學術研討會,宜蘭,台灣,四月,2024。Download
莊婉君*、王中叡,覆晶封裝薄殼結構基板等效模型探討,第九屆台灣機電工程國際學會全國學術研討會,宜蘭,台灣,四月,2024。Download
莊婉君*、王中叡,覆晶封裝薄殼結構翹曲模擬模型,中國機械工程學會112年度年會暨第40屆全國學術研討會,彰化,台灣,十二月,2023。Download
莊婉君*、陳伯恩,不同載台種類對扇出型封裝模化成型製程之晶圓翹曲量影響,2023 中華民國力學學會年會暨第 47 屆全國力學會議,雲林,台灣,十一月,2023。Download
莊婉君*、陳伯恩,應用人工智能軟體探討模封材料性質變異性對於封裝體翹曲之影響,第一屆台灣計算力學學會年會與第十四屆台灣邊界元素法會議暨學術研討會,基隆,台灣,十月,2023。Download
W. C. Chuang*, P. E. Chen, "The effect of different die size on wafer warpage during decarrier process in fan-out wafer-level packaging." International Conference on Mechatronic, Automobile, and Environment Engineering, Bangkok, Thailand, August 3-5, 2023. Download
W. C. Chuang*, K. L. Hsiao, "Development of a real time motion detection system for assistive seated rowing exercise training." Annual Conference on Engineering and Information Technology, Osaka, Japan, July 12-14, 2023. Download
莊婉君*、賴彥澄、趙偉祥,不同運動族群之捲腹運動動作分析,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、黃翌、李仁傑,移除載台製程之製程時間對晶圓級扇出型封裝的翹曲影響,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、黃翌,移除載台步驟之製程溫度對晶圓級扇出型封裝的翹曲量影響,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、陳伯恩,模製化合物之玻璃轉換溫度對扇出型封裝移除載台步驟之晶圓翹曲量影響,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、陳伯恩,模製化合物材料特性於楊氏係數對應溫度變化區間對晶圓翹曲量影響,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、王中叡,覆晶封裝薄殼結構模型網格分割技術探討,台灣機電工程國際學會第八屆全國學術研討會(ISME2023) ,高雄,台灣,四月,2023。Download
莊婉君*、黃翌,模制化合物對扇出型封裝翹曲量影響分析,中國機械工程學會第三十九屆全國學術研討會(CSME39) ,苗栗,台灣,十二月,2022。Download
W. C. Chuang*, Y. Huang, C. Y. Wang, Q. H. Lin, F. S. Chen, Z. W. Chang, P. S. Hsieh, "A model for evaluating warpage of fan-out package during the carrier removal process." International Conference on Mechatronic, Automobile, and Environment Engineering, Penghu, Taiwan, July 15-17, 2022. Download
莊婉君*、蕭冠倫、賴彥澄、趙偉祥,可撓感測器與接線端子電阻訊號分析,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
莊婉君*、賴彥澄、蕭冠倫、趙偉祥,應用於可撓性感測器黏貼之單雙層導電膠帶比較,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
莊婉君*、賴彥澄、蕭冠倫、趙偉祥,應用於可撓性感測器黏貼之感測器長度量測比較,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
莊婉君*、黃子安 、黃翌 、李仁傑,不同模製化合物在覆晶封裝模製成型製程下翹曲量分析,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
莊婉君*、黃翌 、李仁傑,不同模製化合物在覆晶封裝的封膠製程下之應力分析,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
莊婉君*、黃翌 、李仁傑,覆晶封裝體在封膠製程中不同模製化合物的應變分析,台灣機電工程國際學會第七屆全國學術研討會(ISME2022) ,彰化,台灣,四月,2022。Download
W. C. Chuang*, K. L. Hsiao, Y. C. Lai, J. C. Li, W. H. Chao, "Motion detection and analysis of 90-degree wrist flexion training," International Conference on Mechatronic, Automobile, and Environment Engineering, Hualien, Taiwan, October 22-24, 2021. Download
莊婉君*、 賴彥澄 、 蕭冠倫 、 李仁傑 、 趙偉祥 ,腳踏車卷腹訓練動作之偵測與發電系統,第十六屆全國氫能與燃料電池學術研討會暨第八屆台灣能源學會年會(HEFC2021),台南,台灣,九月,2021。Download
莊婉君*、蕭冠倫、趙偉祥,手腕屈曲六十度訓練動作偵測與分析 ,台灣機電工程國際學會第六屆全國學術研討會(ISME2021) ,桃園,台灣,五月,2021。Download
莊婉君*、蕭冠倫、趙偉祥,手腕運動之手部表皮應變探討與分析 ,台灣機電工程國際學會第六屆全國學術研討會(ISME2021),桃園,台灣,五月,2021。Download
莊婉君*、賴彥澄、趙偉祥,捲腹運動動作分析與討論,台灣機電工程國際學會第六屆全國學術研討會(ISME2021),桃園,台灣,五月,2021。Download
莊婉君*、賴彥澄、趙偉祥,仰臥起坐運動動作分析與討論,台灣機電工程國際學會第六屆全國學術研討會(ISME2021),桃園,台灣,五月,2021。Download
W. C. Chuang*, Y. C. Chang and Y. C. Lai, "Development of the system for determining the mechanical properties of thin film," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020. Download
W. C. Chuang*, K. L. Hsiao, W. H. Chao and W. L. Chen, "Development of a real-time motion detection system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen, Taiwan, November 6-8th, 2020. Download
W. C. Chuang*, Y. C. Chan and P. H. Tseng, "Microstructure pull-in voltage extraction system," International Conference on Mechatronic, Automobile, and Environment Engineering, Kinmen , Taiwan, November 6-8th, 2020. Download
莊婉君*、趙偉祥、陳威龍,手腕運動動作角度偵測系統,中華民國力學學會第四十四屆全國力學會議 (CTAM 2020),宜蘭,台灣,十一月,2020。Download
莊婉君*、趙偉祥、張壹筌,微結構吸附電壓萃取系統,中華民國力學學會第四十四屆全國力學會議 (CTAM 2020),宜蘭,台灣,十一月,2020。Download
莊婉君*、趙偉祥、陳威龍,隱形雷射後晶圓擴片之模型建立與探討,台灣機電工程國際學會第五屆全國學術研討會(ISME2020),台中,台灣,八月,2020。Download
莊婉君*、趙偉祥、張壹筌,萃取薄膜材料之蒲松比系統開發,台灣機電工程國際學會第五屆全國學術研討會(ISME2020),台中,台灣,八月,2020。Download
W. C. Chuang*, W. L. Chen, "Important factors on the spacing between the dies after sd dicing tape expansion," 22nd International Conference on Materials, Methods and Technologies , Burgas, Bulgaria, June, 22-26th, 2020. Download
W. C. Chuang*, W. L. Chen , C. F. Wang , "Flexible sensor module applied in sit up training exercises," 9th International Conference on Nanotechnology and Materials Science, Osaka, Japan, October, 14-16th, 2019. Download
W. C. Chuang*, W. L. Chen, "Simulation model for single unit warpage of shadow moire in flip-chip process," Conference of Computational Methods in Multi-scale, Multi-uncertainty and Multi-physics Problems, Porto, Portugal, July 15-17th, 2019. Download
莊婉君*、趙偉祥、陳威龍,潛艦匿聲推進技術評估及市場分析報告,台灣機電工程國際學會第四屆全國學術研討會(ISME2019),高雄,台灣,二月,2019。Download
W. C. Chuang* and Y. C. Chang, " Empirical formula for estimating frequency of resonator with etched holes," 7th Nanotechnology and Material science, Frankfurt, Germany, November, 5-7th, 2018. Download
W. C. Chuang* and K. Chen, "Analysis of the thermal deformation behavior for a fixed-fixed beam structure," International Conference on Mechatronic, Automobile, and Environment Engineering (ICMAEE), Chiang Mai , Thailand, July 7-9th, 2018. Download
W. C. Chuang* and W. L. Chen, "Simulation model for strip warpage of molding process, " 5th Annual Conference on Engineering and Information Technology (ACEAIT), Kyoto, Japan, March 27-29th, 2018. Download
莊婉君*、陳楷,微型橋結構之熱變形分析與量測,台灣機電工程國際學會第一屆第三次年會暨全國學術研討會(ISME2018),台南,台灣,二月,2018。 Download
W. C. Chuang* and W. L. Chen, "Development of fabrication for flexible sensor applied to knee flexion and extension training," 33th Sensors and Actuators, Stockholm, Sweden, October 8-11th, 2017. Download
W. C. Chuang*, W. L. Chen, B. Tsai, and J. Su, "Reliability of ball grid array subjected to temperature cycling," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP’2017), Bordeaux , France, May, 29th - June, 1st, 2017. Download
W. C. Chuang* and K. Chen, "Design of micro torsion-mirror and its electromechanical behavior," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017. Download
W. C. Chuang* and K. Chen, "The key factor of pull-in voltage of micro torsion-mirror structure," International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017. Download
W. C. Chuang* and K. Chen, "Empirical formula about pull-in voltage of micro torsion-mirror, " International Conference on Mechatronic, Automobile, and Environment Engineering, Yantai, China, May 27th - 29th 2017. Download
W. C. Chuang* and C. H. Kuo, ""Analysis for electro-mechanical behavior of a fixed-fixed beam with thermal deformation and undercut effect," Asian Conference on Engineering and Natural Sciences, Hokkaido, Japan, January 19th - 21st 2017. Download
W. C. Chuang* and B. Y. Huang, "A real-time monitoring system for Knee Muscles Training," International Conference on Mechanical, Industrial and Power Engineering, Tokyo, Japan, December 6th - 8th 2016. Download
W. C. Chuang*, " Analysis for the variation of resonant frequency of a micro clamped-clamped resonator with etching holes," International Conference on Design and Manufacturing Engineering (ICDME2016), Auckland, New Zealand, November 19-21, 2016. Downlaod
W. C. Chuang* and W. L. Chen, Ben Tsai, Josh Su, "Analysis of wafer level chip scale package subjected to uniform pressure," 2nd International Conference on Computing and Precision Engineering, Kenting, Taiwan, Sep. 30th - Oct. 3th 2016. Download
W. C. Chuang* and J. Y. Lin, "Empirical formula for pull-in voltage of fixed–fixed beam with elastic deformation," 1st International Conference on Engineering and Science, Yilan, Taiwan, July 8-10th 2016. Download
W. C. Chuang*, W. L. Chen, B. Tsai, and R. Wu, " The trends of change of die gap control effect during the process of dicing wafer expanding," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP’2016), Budapest , Hungary, May, 30th - June, 2nd, 2016. Download
莊婉君*、黃任廷,具蝕刻孔之微結構電彈性分析及其於可調變共振器之應用研究,中國機械工程學會第三十二屆全國學術研討會(CSME32),高雄,台灣,十二月,2015。 Download
W. C. Chuang* and J. Y. Lin, " Analysis for pull-in voltage variations of fixed–fixed beam with elastic deformation in current input," World Congress on Advances in Structural Engineering and Mechanics(ASEM 2015), Incheon, Korea, Aug. 25-29, 2015. Download
W. C. Chuang*, W. H. Tu, G. S. Lin, J. Y. Hwang, and C. S. Lee, "Fracture mechanism analysis for stealth dicing applied in wafer expansion," Design, Test, Integration& Packaging of MEMS/MOEMS (DTIP'2015), Montpellier, France, April 27-30, 2015. Download
莊婉君*、戴聿,靜電式驅動之微鏡片扭轉行為研究,中國機械工程學會第三十一屆全國學術研討會(CSME31),台中,台灣,十二月,2014。 Download
W. C. Chuang* , J.Y. Lin, and J.C. Li, “Analysis of pull-in voltage variations in fixed–fixed beams with elastic deformation,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014.Download
W. C. Chuang*, W. L. Chen, and H. T. Lin, “Optimized design of flexible strain sensor for stimulation of spinal muscles,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014.Download
W. C. Chuang*, and Y. Dai, “Study on the electro-mechanical behavior of the micro torsion-mirror ,” 2nd International Conference of Multi Disciplines of Engineering on Advanced Technology and Environmentalism Design (MDEATED 2014), Tainan, Taiwan, Oct. 31- Nov. 2, 2014. Download
W. C. Chuang* , W. L. Chen , H. T. Lin, “Flexible strain sensor module applied on the activation of spinal muscle,” 1st International Electronic Conference on Sensors and Application, June 01-16, 2014. Download
W. C. Chuang, and Y. R. Lin, " The robustness of an algorithm applied in wafer-level material property extraction," Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2014), Cannes, France, April 02-04, 2014. Download
莊婉君*、林育如,晶圓級薄膜材料性質演算法之穩健性探討,中國機械工程學會第三十屆全國學術研討會(CSME30),宜蘭,台灣,十二月,2013。 Download
莊婉君*、陳威龍,應用於脊椎肌肉活化訓練之可撓感測器開發,中國機械工程學會第三十屆全國學術研討會(CSME30),宜蘭,台灣,十二月,2013。Download
莊婉君*、胡毓忠、林大偉、吳保權、張培仁、李新立、王欽宏,CMOS製程相容之樑結構應力模擬分析技術,中國機械工程學會第二十九屆全國學術研討會(CSME29),高雄,台灣,十二月,2012。Download
W. C. Chu, W. C. Chuang, W. H. Tu, P. Z. Chang, and Y. C. Hu, "Etching holes effects for CMOS-MEMS capacitive structure," 22nd International Conference on Adaptive Structures and Technologies , paper no:078 ,Corfu –Greece, October 10-12, 2011. Download
W. C. Chuang, Y. C. Hu, C. W. Wang et al., “A Fringing Capacitance Model for Electrostatic Microstructure,” 13th International Congress on Mesomechanics, Vicenza, Italy, 2011. Download
W. C. Chuang, H. L. Lee, T. W. Lin, Y. C. Hu, P. Z. Chang, N. B. Ouyen, “Optimal residual stress in CMOS fabrication,” 34th National Conference on Theoretical and Applied Mechanics, Yunlin, Taiwan, Nov. 19-20, 2010. Download
W. C. Chuang, H. L. Lee, Y. C. Hu et al., “Electromechanical coupling of CMOS-MEMS testkey for extracting material properties,” 1st IFToMM Asian Conference on Mechanism and Machine Science, Taipei, Taiwan, 2010. Download
W. C. Chuang, C. W. Lin, Y. C. Hu et al., “An analytical model for optimizing LCD-cell design,” 12th International Congress on Mesomechanics, Taipei, Taiwan, 2010. Download
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