10th KSME-SEMES Open Innovation Challenge Award 

Description: We are thrilled to announce that Jinsung Rho from Hanbat National University has been awarded the Award at the 10th KSME-SEMES Open Innovation Challenge. The award recognizes his outstanding research on 

"Development of Precise and Rapid Detection Technology for Micro-Cracks on Epoxy Mold Compound (EMC) Surface Using U-Net Based Thermal Image Processing." 

This achievement highlights his innovative approach and significant contribution to the field. 

Congratulations on this well-deserved achievement! Let's continue to innovate and push the boundaries. Fighting! 

Best Presentation Award 

Description: We are pleased to share that our research titled:

“Design of 3D-Printed Electrode Structures for Thermal Reliability of Stacked Memory Packages in Space Applications”

has been honored with the Best Presentation Award at the 3rd Workshop on Electronic Equipment Cooling and Thermal Management, organized by the Korean Society for Fluid Machinery (KSFM).

This work, led by Doyoon Kim and Prof. Jinsung Rho, explored advanced electrode designs using 3D printing to enhance thermal reliability in space-grade stacked memory packages.
By applying thermal cycling simulations (−55°C to 125°C) and evaluating stress concentration, the study demonstrated the feasibility of SLM/EMC-based electrode structures for aerospace applications.

Congratulations to the team for their outstanding research and recognition in the field of thermal design for space electronics! 

Best Paper Presentation Award

Description: We are proud to announce that our paper titled:

“Warpage Analysis of Embedded TSOP Memory Package under Die Attachment in Space-Grade Memory Packaging”

has received the Best Paper Presentation Award in the category of Space Semiconductor Technology at the 2024 Annual Conference of the Korean Society of Manufacturing Technology Engineers (KSMTE).

This research, led by Doyoon Kim, Geuntak Yuk, and Prof. Jinsung Rho, investigated warpage behavior in space-applicable memory packages, contributing to the development of high-reliability packaging solutions for aerospace applications.

Congratulations to the team on this outstanding achievement! Let’s continue pushing the boundaries of advanced semiconductor packaging — onwards and upwards! 

International Conference Participation Notice

Description: Our research team participated in PRESM 2025 (International Conference on Precision Engineering and Sustainable Manufacturing), held in Chiang Mai, Thailand, from July 6 to 11, 2025.

We jointly attended the conference with the research team of Professor Joong Bae Kim from Kongju National University, presenting collaborative research on Thermography in semiconductor packaging applications.

This academic exchange not only strengthened inter-university cooperation but also enhanced the international visibility of our research outcomes in the field of advanced semiconductor packaging.

A meaningful step toward global collaboration and high-reliability semiconductor packaging! 

Hanbat National University Selected for the 2025 Global Basic Research Lab Support Program 

Description: Professor Jeong-han Kim’s research team in the Department of Materials Science and Engineering at Hanbat National University has been newly selected for the 2025 Global Basic Research Lab Support (Advanced Type) program, sponsored by the Ministry of Science and ICT and the National Research Foundation of Korea. This prestigious grant provides KRW 1.5 billion over three years, supporting their research through May 2027.

The team consists of Professor Kim (Principal Investigator), along with collaborators Professor Chang-min Yoon (Inha University, Polymer Engineering), Professor Jinsung Rho (Hanbat National University, Mechanical Engineering), and Professor Jeong-cheol Kim (Chemistry and Life Sciences, Hanbat National University).

Their funded project focuses on developing a low-temperature hybrid bonding technology for advanced semiconductor packaging using metal–polymer–chemical fusion techniques. The goal is to achieve molecular bonding between substrates below 200 °C, employing surface modification and electroplating methods. They will also pioneer non-destructive inspection technologies, including thermal imaging, precision measurement, and image processing techniques to detect internal defects at a molecular level.

Additionally, the team will collaborate with Professor Chih Chen’s group at National Yang Ming Chiao Tung University (NYCU) in Taiwan, to develop nanotwin-structured copper and explore its applications in advanced semiconductor packages.

Let’s charge ahead together—advancing innovation and pioneering the future of semiconductor packaging!

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