Facilities

Probe station

 ● 6" vacuum chuck

 ● Hot chuck & controller (RT-200ºC)

 ● Microscope (max 90x)

 ● Year: 2019

Vacuum probe station

 ● Vacuum range (1 atm to 1 mTorr)

 ● Temperature range (77-570K or RT-500ºC)

 ● MFC (10-300 sccm)

 ● Year: 2022

Vacuum probe station

 ● Chuck size (12 mm x 12 mm)

 ● Temperature range (RT-400ºC)

 ● Microscope (max 225x)

 ● Year: 2024

4 point probe system

 ● Pitch (1000 um)

 ● One contact lift

 ● w/ Keithley 2450

 ● Year: 2024

4200A-SCS semiconductor parameter analyzer

● I-V Source Measure Units (SMUs)

● Pulsed I-V Ultra-fast Pulse Measure Unit (PMU)

● Remote Preamplifier/Switch Module (RPM)

● Year: 2021, 2024

HP4156B semiconductor parameter analyzer

● Current (1 fA to 1 A / 20 fA offset accuracy)

● Voltage (1 μA to 200 V)

● GPIB interface

● Year: 2019

HP4284A LCR meter

● Accuracy (0.05%)

● Frequency (20Hz-1MHz)

● GPIB interface

● Year: 2019, 2024

81110A pulse generator

● Single/Dual-channel pulse pattern generator

● 165 MHz, 10 V, 50 Ω into 50 Ω (81111A)

● Triggerable/PLL operation selectable

● Year: 2020

DPO7104 oscilloscope

● Bandwidth (1 GHz)

● Sample rate (20.00 GSa/s)

● Scope channels (4 channels)

● Year: 2022

DSO7104B oscilloscope

● Bandwidth (1 GHz)

● Sample rate (4 GSa/s)

● Scope channels (4 channels)

● Year: 2019

Thermal atomic layer deposition

● Precursor (Hf, Zr, Al) / Reactant (O3, H2O)

● Wafer size (<6 inch)

● Traveling wave type

● Year: 2024

E-beam evaporator system

● Source (Al, W, Au, Cr, Ag, Ti, Ni, Pd)

● Wafer size (<4 inch)

● Loadlock

● Year: 2024

Oxide sputter system

● Target (IGZO, ITO, HZO, HfO2, ZrO2)

● Wafer size (<4 inch)

● Loadlock / Heater (max 500ºC)

● Year: 2023

Metal sputter system

● Target (Ti, TiN, W, Al)

● Wafer size (<4 inch)

● Loadlock / Heater (max 500ºC)

● Year: 2023

Rapid thermal process

● Temperature range (max 1250ºC)

● Ramp rate (10-200ºC/s)

● Wafer size (<4 inch)

● Year: 2024

Rapid thermal annealing

● Temperature range (max 1000ºC)

● Ramp rate (50ºC/s)

● Wafer size (<4 inch)

● Year: 2023

Tube furnace

● Temperature range (max 1200ºC)

● Quartz tube (length 1000 mm)

● MFC, BPR, chiller

● Year: 2022

Hot plate

● Temperature range (max 500ºC)

● Time range (0-100 hours)

● Size (400 x 300 mm)

● Year: 2023

Fume Hood

● Size (W1200 x D800 x H2350 mm)

● Year: 2023

Reagent cabinet

● Size (W800 x D540 x H1950 mm)

● Year: 2023

Electronic scale

● Weight (max 6100 g)

● Measurement range (0.01 g)

● Year: 2024

Hot plate & Stirrer

● Temperature range (50-550ºC)

● Stir range (60-1150 rpm)

● Size (5 x 7 inches)

● Year: 2022

Ultrasonic

● Capacity (20 L)

● Temperature range (RT-70ºC)

● Time range (1-99 min)

● Year: 2024

Spectroscopic ellipsometer

● Wavelength range (250-840 nm)

● Measurement items (thickness, n, k)

● Sample size (200 x 200 mm)

● Year: 2023

Atomic force microscope

● Sample size (10 x 10 mm, 23 nm thickness)

● Field of view (480 μm x 360 μm)

● Modes (contact, tapping, C-AFM, PFM, etc)

● Year: 2025

Optical microscope

● Bright field/Dark field illumination

● Objective lens magnification (5x to 20x)

● Widefield eyepiece magnification (10x)

● Year: 2024

Hall effect measurement system

● Current (1 nA to 20 mA)

● Low temp. measurement (77 K)

● Magnetic flux density (0.51 T)

● Year: 2025

Ozone generator

● w/ ALD

● Ozone concentration: 335 g/Nm^3

● Ozone flow range: 1 slm ~ 20 slm

● Year: 2024

Gas scrubber

● Adsorbent (for ozone)

● Volume: 100 LPM

● Exhausting rate: above 1.0 m^3/min 

● Year: 2025

Vacuum desiccator

● Size (W310 x D350 x H710 mm)

● Pressure gauge

● Vacuum pump

● Year: 2022, 2023