Role: Mixed-Signal Product and Test Development Engineer - Magnetic Sensors Team

Duration of Employment: May 2023 - Present

Type of Employment: Full-Time (37.5 Hours/Week)

Location: Beiersdorfstrasse 12, 22529 Hamburg

Reference Name: Sascha Moeller (Product and Test Engineering Manager) 

Reference Contact: sascha.moeller@nxp.com 

Work Summary:

• Lead developer and technical lead, responsible for hardware and software industrialisation, in a wafer-level conversion of a mixed-signal sensor product from a SPEA to Advantest 93K automated test equipment (ATE) platform

• Reviewed transistor-level schematics and GDSII layout files to introduce new analog and digital test solutions, compensating for design limitations

• Performed validation and characterisation of the sensor product using oscilloscopes and other standard lab measurement equipment

• Designed and evaluated PCBs for ATE load boards, optimizing for test performance and manufacturability

• Wrote over 100K LOC in C/C++ (using SmarTest 7 APIs) and developed custom MATLAB scripts and tools for DfT SCAN pattern analysis and debugging

• Trained product and test engineers in Europe and Asia on-site on the test program development process

• Organizing bi-weekly educational, entertainment, and networking events for 200+ young community members of the NXP Hamburg site as a Young Community Employee Group Board member

Role: Research Intern - Sensor Systems Team

Duration of Employment: November 2021 - May 2022

Type of Employment: Part-Time (6 Hours/Week)

Location: Allmandring 30A, 70569 Stuttgart, Germany

Reference Name: Dr. Zili Yu (Head of Sensor Systems Team)

Reference Contact: ziliyu@ims-chips.de

Work Summary:

• Employed in the Department of Sensor Systems led by Dr. Zili Yu at one of Germany's most advanced semiconductor design and fabrication laboratories

• Analyzed and assessed signal quality characteristics using MATLAB and C++

• Edited and modified preexisting schematics and layouts in EAGLE

• Tested and debugged circuits using oscilloscopes

Role: Research Intern - Haptic Intelligence Team

Duration of Employment: July 2021 - October 2021

Type of Employment: Part-Time (20 Hours/Week)

Location: Heisenbergstraße 3, 70569 Stuttgart, Germany

Reference Name: Dr. Rachael Burns (Assistant Professor of Electrical Engineering and Computer Science at the University of Tennessee Knoxville)

Reference Contact: rburns@is.mpg.de / +49 711 689-2002

Work Summary:

• Worked in the Haptic Intelligence Group led by Dr. Katherine J. Kuchenbecker at one of Germany's premier research institutions - boasting over 20 Nobel Prize Winners

• Designed and improved soft-touch, piezoresistive fabric sensors for physical Human-Robot Interaction

• Tested material and electrical characteristics of sensors through oscilloscopes and force sensors

• Wrote MATLAB Scripts to analyze data effectively and efficiently

• Reduced sensor prototyping and manufacturing time by 50% through a more streamlined process 

Role: Summer Electronics Intern - Electrical and CZT Team

Duration of Employment: May 2019 - August 2019

Type of Employment: Internship (40 Hours/Week)

Location: 812 Avis Dr, Ann Arbor, MI 48108, United States 

Reference Name: Dr. Michael Streicher (President at H3D, Inc.)

Reference Contact: michael@h3dgamma.com / (734) 661-6416 ext.121

Work Summary:

• Independently integrated a TI MSP430 microcontroller into an embedded sensor system to remove basic system control functions from FPGA firmware

• Using a microcontroller instead of VHDL-based code for ancillary controls resulted in an improvement of over 70% in firmware flashing - which is why this implementation is still used in currently sold commercial systems

• Assisted the quality engineering team in writing procedures to help the organisation achieve ISO:9001 compliance

• Worked on testing and measuring devices to help ensure incoming quality of electronics and sensor components

• Mentored other interns, which included delegating tasks and providing technical assistance