KESHAV GARG
WORK EXPERIENCE
Institut für Mikroelektronik Stuttgart (IMS CHIPS)
Role: Research Intern - Sensor Systems Team
Duration of Employment: November 2021 - May 2022
Type of Employment: Part-Time (6 Hours/Week)
Location: Allmandring 30A, 70569 Stuttgart, Germany
Reference Name: Dr. Zili Yu (Head of Sensor Systems Department)
Reference Contact: ziliyu@ims-chips.de
Work Summary:
Employed in the Department of Sensor Systems led by Dr. Zili Yu at one of Germany's most advanced semiconductor design and fabrication laboratories
Analyzed and assessed signal quality characteristics using MATLAB and C++
Edited and modified preexisting schematics and layouts in EAGLE
Tested and debugged circuits using oscilloscopes
Max Planck Institute for Intelligent Systems
Role: Research Intern - Haptic Intelligence Team
Duration of Employment: July 2021 - October 2021
Type of Employment: Part-Time (20 Hours/Week)
Location: Heisenbergstraße 3, 70569 Stuttgart, Germany
Reference Name: Rachael Burns (Ph.D. Student)
Reference Contact: rburns@is.mpg.de / +49 711 689-2002
Work Summary:
Worked in the Haptic Intelligence Group led by Dr. Katherine J. Kuchenbecker at one of Germany's premier research institutions - boasting over 20 Nobel Prize Winners
Designed and improved soft-touch, piezoresistive fabric sensors for physical Human-Robot Interaction
Tested material and electrical characteristics of sensors through oscilloscopes and force sensors
Wrote MATLAB Scripts to analyze data effectively and efficiently
Reduced sensor prototyping and manufacturing time by 50% through a more streamlined process
H3D, Inc.
Role: Summer Electronics Intern - Electrical and CZT Team
Duration of Employment: May 2019 - August 2019
Type of Employment: Internship (40 Hours/Week)
Location: 812 Avis Dr, Ann Arbor, MI 48108, United States
Reference Name: Dr. Michael Streicher (Research and Development Engineer)
Reference Contact: michael@h3dgamma.com / (734) 661-6416 ext.121
Work Summary:
Developed circuitry and code for adding a TI MSP microcontroller to an existing CPU board which reduced device firmware syncing time by over 70%
Implemented C code and Energia scripts to establish UART and I2C communication between boards and various sensors
Adapted BSL and SBW to access embedded memory and facilitate debugging for microcontrollers
Authored technical documentation to ensure compliance of electronics manufacturing, research, and testing with ISO standards
Debugged embedded systems using oscilloscopes, multimeters, and specialized ASIC’s
Trained technicians, quality management engineers, and production staff on hardware verification and validation