AM5440: Engineering Fracture Mechanics (Jul-Nov-17) | Instructor: Dr. K. Ramesh
Micro cracks are to be detected at every stage possible during manufacturing of semiconductor devices to avoid failure in further stages. Techniques such as Dark Field Imaging, Photoluminescence Imaging, and Lock-in Thermography provide solutions to detect microcracks . However, these techniques are nascent and there is a great need to develop more techniques. Kerfless spalling has been proposed as a new technique to fabricate thin films that avoid fabrication induced micro cracks.
MM5040: Defects in Materials (Jul-Nov-17) | Instructor: Dr. Kanjarla Anand Krishna
Inverse pile up of dislocations generated from crack tip modify crack tip stress field through their elastic stress and shield the crack tip. Dislocation free zone (DFZ) can be explained by the strong attractive image forces of crack tip - free surface on dislocations.
EE5346: Introduction to Plastic Electronics (Jul-Nov-17) | Instructor: Dr. Soumya Dutta
Planar photodetectors were transferred onto a precast curved PDMS substrate and large strains arising due to the curved substrate were being accommodated by the buckling of metallic interconnects. In another similar device, fluid pressure is used to control the radius of curvature of the PDMS substrate.
EE5343: Solar Cell Device Physics and Material Selection (Jan -May 17 ) | Instructor. Dr. Debdutta Ray
Hot carrier cells aim to extract the electrical energy from photo-generated carriers before they thermalize to the band edges. Carrier thermalization to carrier extraction rates differs by six to eight orders magnitude. Thus an important property of good absorber material is to slow down the carrier cooling rate by controlling electron-phonon interaction. Silicon doesn't possess phononic bandgap whereas Indium Nitride posses all the required properties but its use is limited by the availability of Indium. Binary compounds such as ZrN, GeC that posses higher molar mass ratio are being studied as potential absorber materials in realizing hot carrier solar cells.
ME6430: Engine Systems and Performance (Jan - May 17)| Instructor : Dr. A Ramesh * Report Only
Predicting or detecting knock is achieved by measuring pressure signals. However, the existing pressure sensors can only detect the knock once it occurs and is not suggestible. On the other hand, ion current sensors have the ability to predict the knock from the change in pressure differential. They have a high signal to noise ratio and are cheap. Ion current signal exhibits the linear relationship with the in-cylinder pressure signal. Once ion-current is processed and calibrated for different knock levels; ECU will be good at controlling knocking.
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