Droplet resonance - internal flow

- In the resonant frequency, they have an infinite energy theoretically in spite of very low input energy

- Droplet dynamic behavior generates mode shape and internal flow

- Resonance effect can repin the contact triple line.

The effect of vibration and viscous solution on surface treatment is shown.

- The functional surface is widely using in the industries fields. Surface treatment using vibration is one of the produce method.

- The experiment shows the effect of various vibration factors (frequency, voltage, etc..) and solution factors (viscosity, thickness, etc..).

Vibration analysis using ANSYS in various fields.

- Vibration analysis for development of semiconductor wafer backgrinding system

- Vibration analysis of Electro-Optical Targeting System(EOTS)

- Vibration analysis of Close-In Weapon System(CIWS)

- Gun Firing Shock and Vibration Analysis

Cable Driven Parallel Robot (CDPR)

- Control the end-effector with 8 cables

- limitations on moving system (The entire system must be moved)

Mobile robot

- Detect / avoid obstacles and arrived at destination

Mobile CDPR

- Mobile-Free CDPR with mobile robot

- Can be used in various industries such as architecture, space, etc

RUL test bed construction

- Slewing bearings can rotate at low and high speeds

- Accelerated life testing under extreme load conditions

Data analysis : Bearing fault modes

- Implementation of representative failure modes using SKF reports

- STFT is better for failure mode analysis than the traditional EEMD

Remaining useful life(RUL) estimaion algorithm

- Establishment of an LSTM-attention based model to predict RUL of entirely different systems using system HI

Vital signs measurement device

- Extracting factors highly correlated with vital signs from pulse signals

- The model with deep learning can measure high-accuracy vital signs with pulse signals only

Backgrinding experiment setup

- Online tilting control possible through self-produced back grinding setup

- 3D wafer shape measurement using LDV

- Measuring the distribution of force applied to the wafer using a force sensor

Tilting control algorithm for TTV

- Algorithm for calculating tilting angle compensation based on the shape of the wafer