Core Members

Ian F. Akyildiz, Truva Inc. USA, ian@ianakyildiz.com
Mohamed-Slim Alouini, King Abdullah University of Science and Technology, Saudi Arabia, slim.alouini@kaust.edu.sa
Angeliki Alexiou, University of Piraeus, Greece, aalexiou@ieee.org
Zhi Chen, University of Electronic Science and Technology, China, chenzhi@uestc.edu.cn
Ke Guan, Beijing Jiao Tong University, China, kguan@bjtu.edu.cn
Tetsuya Kawanishi, Waseda University, Japan, kawanishi@waseda.jp
Daniel Mittleman, Brown University, USA, daniel_mittleman@brown.edu
Thomas Kurner, Technische Universität Braunschweig, Germany, t.kuerner@tu-bs.de
Jose Siles, NASA JPL, USA, jose.v.siles@jpl.nasa.gov
Iwao Hosako, NICT, Japan, hosako@nict.go.jp

Sergi Abadal, Universitat Politècnica de Catalunya (UPC), Spain, abadal@ac.upc.edu
Xianbin Yu, Zhejiang University, China, xyu@zju.edu.cn
Vitaly Petrov, Nokia, vit.petrov@gmail.com
Guillaume Ducournau, Université des Sciences et Technologies de Lille 1, France, guillaume.ducournau@univ-lille.fr
Shuai Nie, University of Nebraska Lincoln, USA, shuainie@gatech.edu
Linglong Dai, Tsinghua University, China, daill@tsinghua.edu.cn
Ho Jin Song, Pohang University of Science and Technology, South Korea, hojin.song@postech.ac.kr
Tahsin Akalin, Lille University, France, Tahsin.Akalin@univ-lille.fr

Wolfgang Gerstacker, Friedrich-Alexander University Erlangen-Nürnberg, Germany, wolfgang.gerstacker@fau.de
Markku Juntti, University of Oulu, Finland, markku.juntti@oulu.fi
Sasitharan Balasubramaniam, WIT, Ireland, sasi.bala@waltoninstitute.ie
Dmitry N. Chigrin, RWTH Aachen University, Germany, chigrin@dwi.rwth-aachen.de
William Deal, Northrup Grumman, USA, william.deal@ngc.com
Yasaman Ghasempour, Princeton University, USA, ghasempour@princeton.edu

Jeongho Jeon, Samsung Research America, USA, jeongho.j@samsung.com
Jiamo Jiang, China Academy of Information and Communications Technology, China, jiangjiamo@caict.ac.cn
Edward Knightly, Rice University, USA, knightly@rice.edu
Filip Lemic, imec, Belgium, filip.lemic@uantwerpen.be
Lingxiang Li, University of Electronic Science and Technology, China, lingxiang.li@uestc.edu.cn
Xuyang Lu, Shanghai Jiao Tong University, China, xuyang.lu@sjtu.edu.cn
Imran Mehdi, JPL, USA, imran.mehdi@jpl.nasa.gov
Thomas Merkel, Fraunhofer Institute, Germany, thomas.merkle@iaf.fraunhofer.de
Andy Molisch, University of Southern California, USA, molisch@usc.edu
Tadao Nagatsuma, Osaka University, Japan, nagatuma@ee.es.osaka-u.ac.jp
Ullrich Pfeiffer, Bergische Universität Wuppertal, Germany, ullrich.pfeiffer@uni-wuppertal.de
Kaushik Sengupta, Princeton University, USA, kaushiks@princeton.edu

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