Paper

(International)

1. Haeseong Hwang, Seungho Han, Hyunseop Lee, "Pressure distribution and Wear of Grinding Wheel in Ultra-Thinning Process of LiTaO3 Wafer," International Journal of Precision Engineering and Manufacturing, 2024

2. Haeseong Hwang, Seungho Han, Hyunseop Lee, "An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation," Lubricants, 11(7), 297, 2023

3. Hyunseop Lee, "Tribological Study on Photocatalysis-Assisted Chemical Mechanical Polishing of SiC,"  Lubricants, 11(5), 229, 2023

4. Hyunseop Lee, "Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes,"  Micromachines, 14, 272, 2023

5. Hyunseop Lee, Hyoungjae Kim, Haedo Jeong, "Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review," International Journal of Precision Engineering and Manufacturing-Green Technology, Vol. 9, 349-367, 2022

6. Seonghyun Park and Hyunseop Lee, "Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper," Applied Sciences, 11, 7232, 2021

7. Jungyu Son, Hyunseop Lee, "Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime," Applied Sciences, 11, 3521, 2021

8. Hoseong Jo, Da Sol Lee, Seon Ho Jeong, Hyun Seop Lee, Hae Do Jeong, " Hybrid CMP Slurry Supply System Using Ionization and Atomization," Applied Sciences, 11, 2217, 2021

9. Jungyu Son, Hyunseop Lee,"Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction," Micromachines, 11, 843, 2020

10. Taekyoung Kim, Hyunseop Lee, "Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)," Micromachines, 11, 705, 2020

11. Taekyoung Kim, Hyunseop Lee, "Simulation and experimental analysis of abrasive fluidized bed machining process," Journal of Mechanical Science and Technology, 34(5), 2153-2160, 2020

12. Hyunseop Lee, "Semi‑empirical Material Removal Model with Modified Real Contact Area for CMP," International Journal of Precision Engineering and Manufacturing, 20, 1325-1332, 2019

13. Dasol Lee, Hyunseop Lee, Seonho Jeong, Minjong Yuh, Haedo Jeong, "Surface Activation by Electrolytically Ionized Slurry during Cu CMP," ECS Journal of Solid State Science and Technology, 8(5), P3053-P3057, 2019

14. Hyunseop Lee, Sangjik Lee, "Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal," Precision Engineering, 49, 85-91, 2017

15. Hyunseop Lee, Taekyung Lee, "Material Removal Model of Lap Grinding for Sapphire Substrate Based on Roughness Parameters," Materials Science Forum, 890, 384-387, 2017

16. Dasol Lee,  Hyunseop Lee, "Estimating the mechanical properties of polyurethane-impregnated felt pads," Journal of Mechanical Science and Technology, 31(12), 5705-5710, 2017

17. Dasol Lee, Hyunjin Kim, Byeongjun Pak, Doyeon Kim, Haedo Jeong, Hyunseop Lee, "Electrochemical Analysis of the Slurry Composition for Chemical Mechanical Polishing of Flexible Stainless-Steel Substrates," Journal of Friction and Wear, 38, 6, 482–489, 2017

18. Hyunseop Lee, "Environmental Impact of Concentration of Slurry Components in Thick Copper CMP," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 4, 1, 13-18, 2017

19. Dasol Lee, Hyunseop Lee, Haedo Jeong, "Slurry Components in Metal Chemical Mechanical Planarization (CMP) Process: A Review," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 17,12, 1751-1762, 2016

20. Hyunseop Lee, Dasol Lee, Haedo Jeong, "Mechanical Aspects of the Chemical Mechanical Polishing Process: A Review," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 17, 4, 525-536, 2016

21. Hyunseop Lee, "Mathematical Modeling of Material Removal Rate in Roll-Type Linear CMP (Roll-CMP) Process: Effect of Polishing Pad," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 17,4, 495-501, 2016

22. Hyunseop Lee, "Effect of Citric Acid in Chemical Mechanical Polishing (CMP) for Lithium Tantalate (LiTaO3) Wafer," Advanced Materials Research, 1136, 305-310, 2016

23. Dasol Lee, Hyunseop Lee, Haedo Jeong, "The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption," Journal of Mechanical Science and Technology, 29 (12), 5057-5062, 2015

24. Minjong Yuh, Soocheon Jang, Hyoungjae Kim, Hyunseop Lee, Haedo Jeong, "Development of Green CMP by Slurry Reduction through Controlling Platen Coolant Temperature," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 2, 4, 339-344, 2015

25. Sun-Joon Park, Hyun-Seop Lee, Haedo Jeong, "Signal Analysis of CMP Process based on AE Monitoring System," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 2, 1, 15-19, 2015

26. Hyunseop Lee, Han Wang, Jaehong Park, Haedo Jeong, "Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system," Precision Engineering, 38, 928–934, 2014

27. Hyunseop Lee, David Alan Dornfeld, Haedo Jeong, "Mathematical Model-Based Evaluation Methodology for Environmental Burden of Chemical Mechanical Planarization Process," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 1, 1, 11-15, 2014

28. Hyunseop Lee, Yeongbong Park, Sangjik Lee, Haedo Jeong, "Preliminary Study on the Effect of Spray Slurry Nozzle in CMP for Environmental Sustainability," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 15, 6, 995-1000, 2014

29. H.S. Lee, H.D. Jeong, D.A. Dornfeld, "Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes," Precision Engineering, 37, 483-490, 2013

30. Hyunseop Lee, Sunjoon Park, Haedo Jeong, "Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing," Journal of Mechanical Science and Technology, 27 (2), 511-518, 2013

31. Hyunseop Lee,, Yeongbong Park, Sangjik Lee, Haedo Jeong, "Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film," Journal of Mechanical Science and Technology, 27 (10), 2911-2916, 2013

32. Yeongbong Park, Hyunseop Lee, Youngkyun Lee, Sunjoon Park, Haedo Jeong, "Effect of Contact Angle between Retaining Ring and Polishing Pad on Material Removal Uniformity in CMP Process," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 14, 9, 1513-1518, 2013

33. Yeongbong Park, Youngkyun Lee, Hyunseop Lee, Haedo Jeong, "Effect of Heat According to Wafer Size on the Removal Rate and Profile in CMP Process," Electron. Mater. Lett.,9, 6, 755-758, 2013

34. Hyunseop Lee, Hojun Lee, Hobin Jeong, Sungha Choi, Youngkyun Lee, Moonki Jeong, Haedo Jeong, "Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer," Journal of Nanoscience and Nanotechnology, 12, 1256–1259, 2012

35. Joonho An, Hyunseop Lee, Hyoungjae Kim, Haedo Jeong, "Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning," Japanese Journal of Applied Physics, 51, 026501, 2012

36. Hobin JEONG, Hyunseop LEE, Sungha CHOI, Youngkyun LEE, Haedo JEONG, "Prediction of Real Contact Area from Microtopography on CMP Pad," Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 1, 113-120, 2012

37. Yongchang Guo, Hyunseop Lee, Youngkyun Lee, Haedo Jeong, "Effect of Pad Groove Geometry on Material Removal Characteristics in Chemical Mechanical Polishing," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 13, 2, 303-306, 2012

38. Hyunseop Lee, Yongchang Guo, Haedo Jeong, "Temperature Distribution in Polishing Pad during CMP Process: Effect of Retaining Ring," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 13, 1, 25-31, 2012

39. Hyunseop Lee, Haedo Jeong, "A wafer-scale material removal rate profile model for copper chemical mechanical planarization," International Journal of Machine Tools & Manufacture, 51, 395–403, 2011

40. MoonKi Jeong, SeungJae Jo, HyunSeop Lee, AhReum Lee, ChungYun Kang, JinWon Choi, JinHo Kim, HaeDo Jeong, "Chemical Mechanical Planarization of Copper Bumps on Printed Circuit Board," INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 12, 1, 149-152, 2011

41. Hyunseop Lee, Hiroshi Kasuga, Hitoshi Ohmori, Hojun Lee, Haedo Jeong, "Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes," Journal of Crystal Growth, 326, 140–146, 2011

42. Yongchang Guo, Youngkyun Lee, Hyunseop Lee, Haedo Jeong, "Research on CMP Characteristics Attribute to Groove Size," Advanced Materials Research, 189-193, 4112-4115, 2011

43. Sukhoon Jeong, Jaehyun Bae, Hyunseop Lee, Hojun Lee, Youngkyun Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong, "Effect of mechanical factor in uniformity for electrochemical mechanical planarization," Sensors and Actuators A, 163, 433–439, 2010

44. Hyunseop Lee, Doo-In Kim, Haedo Jeong, Kwang Ho Kim, "Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure," Journal of the Korean Physical Society, 57, 4, 845-849, 2010

45. H.S. Lee, D.I. Kim, J.H. An, H.J. Lee, K.H. Kim, H. Jeong, "Hybrid polishingmechanismof single crystal SiC usingmixed abrasive slurry(MAS)," CIRP Annals - Manufacturing Technology, 59, 333–336, 2010

46. Sukhoon Jeong, Hyunseop Lee, Hanchul Cho, Sangjik Lee, Hyoungjae Kim, Sungryul Kim, Jaehong Park, Haedo Jeong, "Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization," Applied Surface Science, 256, 1683–1688, 2010

47. Hanchul Cho, Youngmin Kim, Hyunseop Lee, Sukbae Joo, Haedo Jeong, "The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection," Solid State Phenomena, 145-146, 367-370, 2009

48. Hyunseop Lee, Boumyoung Park, Haedo Jeong, "Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization," Journal of Materials Processing Technology, 209, 1729–1735, 2009

49. Hyunseop Lee, Sukbae Joo, Haedo Jeong, "Mechanical effect of colloidal silica in copper chemical mechanical planarization," Journal of Materials Processing Technology, 209, 6134–6139, 2009

50. Boumyoung Park, Sukhoon Jeong, Hyunseop Lee, Hyoungjae Kim, Haedo Jeong, David A. Dornfeld, "Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing," Japanese Journal of Applied Physics, 48, 116505, 2009

51. H.S. Lee, H.D. Jeong, "Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces," CIRP Annals - Manufacturing Technology, 58, 485–490, 2009

52. Hojun Lee, Beomyoung Park, Hyunseop Lee, Sukhoon Jeong, Heondeok Seo, Sukbae Joo, Haedo Jeong, Hyoungjae Kim, "The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate," Materials Science Forum, 569, 133-136, 2008

53. Hyunseop Lee, Boumyoung Park, Haedo Jeong, "Influence of slurry components on uniformity in copper chemical mechanical planarization," Microelectronic Engineering, 85, 689–696, 2008

54. Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong, "Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry," Journal of Materials Processing Technology, 203,  287–292, 2008

55. Boumyoung PARK, Hyunseop LEE, Youngjin KIM, Hyoungjae KIM, Haedo JEONG, "Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing," Japanese Journal of Applied Physics, 47, 12, 8771–8778, 2008

56. Hyunseop LEE, Sukbae JOO, Hyoungjae KIM, and Haedo JEONG, "Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits," Japanese Journal of Applied Physics, 47, 7, 5708–5711, 2008

57. H.S. Lee, B.Y. Park, S.M. Park, H.J. Kim, H.D. Jeong, "The Characteristics of Frictional Behavior in CMP Using An Integrated Monitoring System," Key Engineering Materials, 339, 152-157, 2007

(Domestic)

1. 박병훈, 황해성, 이현섭, "CMP 패드 컨디셔닝에서 딥러닝을 활용한 컨디셔너 스윙에 따른 패드 마모 프로파일에 관한 연구," Tribol. Lubr., 40, 2, 67-70, 2024

2. 조연상, 이현섭, "무윤활 상태에서 3D 프린팅용 PLA 및 PETG 소재의 마모 현상에 관한 연구," 한국정밀공학회지, 41, 2, 145-151, 2024

3. 이현섭, "SiO2/TiO2 혼합입자 슬러리 SiC CMP의 재료제거율 모델링," Tribol. Lubr., 39, 2, 72-75, 2023

4. 이현섭, "자외선 광을 활용하는 화학기계적 연마에 관한 연구 동향," Tribol. Lubr., 38, 6, 247-254, 2022

5. 박병훈, 이현섭, "인공신경망을 활용한 CMP 컨디셔닝 시스템 설계 변수에 다른 컨디셔닝 밀도의 불균일도 분석,"  Tribol. Lubr., 38, 4, 152-161, 2022

6. 박병훈, 박범영, 전언찬, 이현섭, "패드 마모 균일성 향상을 위한 CMP 컨디셔닝 시스템 설계 변수 연구," Tribol. Lubr., 38, 1, 1-7, 2022

7. 박성현, 이현섭, "전해 이온화와 자외선광을 이용한 사파이어 화학기계적 연마의 재료제거 효율 향상에 관한 기초 연구," Tribol. Lubr., 37,6, 208-212, 2021

8. 이현섭, 김지훈, 박성민, 추동엽, "전기화학-기계적 평탄화에 관한 연구 동향 분석," Tribol. Lubr., 37,6, 213-223, 2021

9. 박성형, 손준규, 우성웅, 류의진, 이현섭, "실리콘 오일 점도에 따른 ABS-like 레진의 트라이볼로지 특성," Tribol. Lubr., 36,6, 365-370, 2020

10. 손준규, 이현섭, " ABS 유사 수지의 연마에서 마찰 특성이 표면 거칠기 및 광택도에 미치는 영향," 한국정밀공학회지, 37, 11, 797-802, 2020

11. 조영상, 이현섭, "무윤활 상태에서 3D 프린팅용 ABS-like 레진의 마찰 및 마모 특성에 관한 연구," 한국정밀공학회지, 36, 12, 1117-1124, 2019

12. 서준영, 이현섭, "랩그라인딩 후 사파이어 웨이퍼의 표면거칠기가 화학기계적 연마에 미치는 영향," Tribol. Lubr., 35, 6, 323-329, 2019

13. 이현섭, 성인하, "화학기계적 연마기술 연구개발 동향: 입자 거동과 기판소재를 중심으로," Tribol. Lubr., 35, 5, 274-285, 2019

14. 이현섭, "화학기계적 연마(CMP) 공정에서의 트라이볼로지 연구 동향," Tribol. Lubr., 34, 3, 115-122, 2018

15. Junyoung Seo, Taekyoung Kim, Hyunseop Lee, "Effect of Free Abrasives on Material Removal in Lap Grinding of Sapphire Substrate," Tribol. Lubr., 34, 6, 209-216, 2018

16. Hyunseop Lee, "Effect of Citric Acid in Cu Chemical Mechanical Planarization Slurry on Frictional Characteristics and Step Height Reduction of Cu Pattern," Tribol. Lubr., 34, 6, 226-234, 2018

17. 정진엽, 이현섭, 이다솔, 정해도, "Al CMP에서 과산화수소와 옥살산이 재료제거에 미치는 영향," 한국정밀공학회지,  34, 5, 307-310, 2017

18. 장양제, 김태경, 황현덕, 서준영, 이다솔, 이현섭, "폴리아세탈의 입자유동베드 가공에서 회전속도와 공기 유량이 재료제거 특성에 미치는 영향," J. Korean Soc. Tribol. Lubr. Eng., 33, 5, 214-219, 2017

19. Sunjoon Park, Seokyeon Im, Hyunseop Lee, "Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer," J. Korean Soc. Tribol. Lubr. Eng., 33, 6, 282-287, 2017

20. 김동균, 김종윤, 이현섭, "냉각수 유량에 따른 양면 랩그라인딩 정반의 전열특성," J. Korean Soc. Tribol. Lubr. Eng.,32, 2, 50~55, 2016

21. 박은정, 이현섭, 정호빈, 정해도, "구리 ECMP에서 전류밀도가 재료제거에 미치는 영향," J. Korean Soc. Tribol. Lubr. Eng.,31, 3, 79-85, 2015

22. 왕 함, 이현섭, 정해도, "선형 Roll-CMP에서 공정변수에 관한 통계적 분석," J. Korean Soc. Tribol. Lubr. Eng., 30,3, 139-145, 2014

23. 박선준, 이현섭, 정해도, "CMP 공정중 박막 종류에 따른 AE 신호 분석," Trans. Korean Soc. Mech. Eng. A, 38, 8, 863-867, 2014

24. 신운기, 박선준, 이현섭, 정문기, 이영균, 이호준, 김영민, 조한철, 주석배, 정해도, "구리 CMP 후 버핑 공정을 이용한 연마 입자 제거," J. KIEEME, 24, 1, 17-21, 2011

25. 배재현, 이현섭, 박재홍, 니시자와 히데키, 키노시타 마사하루, 정해도, "산화막 CMP에서 패드 두께가 연마율과 연마 불균일도에 미치는 영향," J. KIEEME, 23, 5, 358-363, 2010

26. 오지헌, 이상직, 이호준, 조한철, 이현섭, 김형재, 정해도, "스윙 암 컨디셔너의 기구학적 해석을 통한 CMP 패드 프로파일 변화에 관한 연구," J. KIEEME, 21, 11, 963-967, 2018

27. 정석훈, 김영진, 이현섭, 정해도, "화학기계적 연마에 의한 리튬니오베이트의 광학 특성에 관한 연구," 대한기계학회논문집 A권, 33, 3, 196-200, 2009