A hybrid integrated circuit (HIC) is a full electronic circuit built on an insulating substrate with a range of device technologies. The substrate serves as the circuit's carrier and also includes interconnecting tracks between components placed on it using multilayer methods. Individual devices, such as chip diodes, transistors, integrated circuits, thick-film resistors, and capacitors, are mounted to the substrate and linked together using previously specified interconnecting tracks.
Individual components are connected to a Ceramic substrate in a Hybrid Integrated Circuit. Metallization patterns or bonding wires are used to link these components. On the chip, the active and passive components are dispersed. Hybrid ICs enhance circuit performance by allowing passive components to be trimmed to accuracy at higher levels. This technique is mostly utilized for low-volume customized circuits.
Hybrid Integrated Circuits: Classification
Hybrid Integrated Circuits (ICs) are classified into two categories based on the technology utilized to create the passive components and related interconnections on the substrate: Thick Film and Thin Film ICs.
Film thickness on Thin Film ICs ranges from 50 to 20000 Armstrong units. Vacuum evaporation, a plating method, sputtering, and screening are all techniques used to deposit thin films. These ICs feature a high component packing density as well as a high-frequency packaging density. Resistors may be trimmed to precise values using this technology. Thin-film ICs are suited for ladder-type Digital to Analog Converters because of this characteristic.
The film thickness of Thick Film ICs ranges from 125000 to 625000 Armstrong units. This method allows for the low-cost production of high-density circuits using passive components. Thick film deposition is accomplished using methods such as screen printing and substrate burning. These ICs are utilized in applications where high frequency and small size are critical, such as car electronic circuits, digital watches, and electronic toys.
Advantages
• They are smaller and hence more portable.
• They are less affected by changes in physical factors.
• The operation speed is high due to the lack of parasitic capacitance.
• They have a low power consumption and may thus be powered by batteries.
• The ICs are more reliable since there are no soldered connections.
• A more straightforward design and standard packing.
Disadvantages
The power dissipation of the ICs is poor due to their tiny size. As a result of the increased current, the IC would be destroyed due to the generation of a huge quantity of heat.
Hybrid circuit manufacturer Circuits are hybrid integrated circuits that execute logical tasks utilizing binary inputs. Monolithic technology is used to make the majority of digital ICs. Thick and thin-film technologies are utilized for various purposes. Digital integrated circuits (ICs) have played a crucial role in the development of electronic systems. A digital IC's basic building blocks are logic gates. Flip-Flops, Counters, Shift Registers, and other similar devices are common examples.