Multilayer & Double Sided PCB Manufacturer

The dry film of double sided & multilayer printed circuit board is flat and uniform in thickness, with no gaps in the film, moderate exposure and sufficient development, the number of China multilayer PCB board’s layers is up to 28, the line width and line spacing are 3/3mil. HUIHE CIRCUITS’ double sided pcb manufacturer, double sided pcb factory has passed ISO9001/ISO13485/IATF16949/UL/RoHS/REACH certification. Contact HUIHE Circuits 2 layer pcb manufacturer for competitive multilayer PCB price.

Multilayer PCB China Benefits

Multilayer PCB board China have high assembly density and smaller size.

During multilayer custom PCB China manufacturing, Multilayer circuit board laying is convenient and the laying length is shortened.

The wiring between the electronic components of the multi-layer PCB circuit board is reduced, and the data signal transmission rate is improved during PCB manufacturing service, such as multilayer PCB prototype and multilayer PCB fabrication.

For electronic products with higher heat dissipation requirements, a metal core heat dissipation layer can be set on the multilayer circuit board to facilitate the requirements for special functions such as shielding and heat dissipation.

Double Sided PCB

Double sided printed circuit board only has one dielectric(for example, glass fiber) between two copper foil, all traces are located on two copper layer. China Multi-layer PCB board is multi double sided circuit board, every two layer has dielectric, and the dielectric is thinner. China Multi-layer PCB board has at least three conducting layers, two of them are on the outer surface, and the remaining layer is integrated into the insulating board.The electrical connection between them is achieved through plated through holes on the cross section of the circuit board.

Multi-layer board is better than single-sided and double sided printed circuit boards on function, but the more layers, the higher the production cost. The longer the processing time, and the more complicated the quality inspection. However, under the cost comparison of the same area, although the cost of Multi-layer circuit boards is higher than that of Single-layer and China double layer PCB, the cost difference between the two is not obvious when considering a variety of factors. With the advancement of technology, PCB printed circuit board have more than 100 layers in PCB industry, which are mainly used for precision aerospace instruments and medical equipment.If you want to know more about double sided pcb fabrication, China double layer PCB, multilayer PCB price, please do not hesitate to contact HUIHE Circuits 2 layer pcb manufacturer.

The Difference of Multi-layer Circuit Board and Double Layer PCB China

1. A multilayer circuit board is a type of printed circuit board that comprises alternating conductive pattern layers and insulating materials, which are laminated and bonded together. Unlike double-sided PCBs, multilayer circuit boards have more than three conductive pattern layers, and the electrical interconnection between layers is achieved through metalized holes.

2. Compared to double-sided PCBs, multilayer circuit boards require additional process steps such as inner layer imaging, blackening, lamination, hatchback, and de-drilling during production.

3. Multilayer PCBs have more stringent requirements in certain process parameters, equipment accuracy, and complexity when compared to double-sided boards. For instance, multilayer boards have stricter quality requirements on hole walls than double-layer boards, leading to higher drilling requirements.

4. The number of stacks, drilling speed, and feed rate of drill bits for multilayer flex PCBA boards differ from those used for double-sided PCBs.

5. The inspection process for finished and semi-finished multilayer circuit boards is much more rigorous and complicated than that for double-sided boards.

6. Given the complex structure of multilayer electronic pcba boards, they adopt the glycerin hot-melt process with uniform temperature, avoiding the use of the infrared hot-melt process that may cause local temperature rise.