2 Layer Rogers ENIG rf PCB

Huihe high frequency PCB is a trusted name in RF PCB manufacturing, delivering high-performance solutions for demanding high-frequency applications. Discover our extensive capabilities and reliable RF PCBs tailored to ensure efficient signal transmission and precision in electronic designs.

Number of layers: 2

size: 96.45*87.73mm

Surface finish: ENIG

Base material: Rogers 4350B

Min. hole diameter: 0.5mm

Minimum Line Width：/mm

Minimum Line Space：0.139mm

Thickness: 0.35mm

What are the considerations of high frequency rf circuit board?

There are several key considerations when designing a high-frequency RF PCB:

Material Selection:

The materials used for the PCB itself and the surface finish can significantly impact performance. Here’s what to consider:

Dielectric constant: This determines the speed of the signal traveling through the board. For high frequencies, a low and stable dielectric constant is crucial.

Loss tangent: This indicates how much signal strength is lost due to the material. Lower loss tangent materials are better for high-frequency applications.

Copper roughness: Rougher copper surfaces can introduce signal loss. Opt for a smoother copper finish.

Solder mask: The material and thickness of the solder mask can also affect signal integrity. Choose a low-loss material for the solder mask.

Signal Integrity:

This refers to maintaining the strength and quality of the signal as it travels through the PCB. Here’s how to optimize it:

Impedance matching: This ensures minimal signal reflection and loss. Impedance is controlled by trace width, spacing, and the dielectric constant of the material.

Trace routing: Minimize the length of signal traces and avoid sharp bends. Aim for smooth, continuous traces.

Vias: Vias introduce capacitance and inductance, which can disrupt signal flow. Minimize the number of vias and use smaller vias when possible.

EMI control:

High-frequency signals can radiate electromagnetic interference (EMI) which can disrupt other devices. To mitigate EMI:

Grounding: A good grounding strategy is essential. Use a continuous ground plane and connect all components to the ground plane properly.

Shielding: In some cases, shielding enclosures may be necessary to contain EMI.

Manufacturing and Testing:

High-frequency PCBs often require special manufacturing considerations, such as controlled impedance etching and via plating. Additionally, proper testing equipment is necessary to ensure the board meets performance specifications.

By carefully considering these factors, you can design high-frequency RF PCBs that function effectively and meet your performance requirements.

Advantages Of 2 Layer Rogers ENIG rf PCB

Own lamination process to convenient production for Multilayer PCB and shorten the lead time.

Jiangxi facility is environmental-friendly approved by the government .

Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin.

Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.

Engineers with more than 15 years of experience

Customers located in more than 20 countries, the common choice of 500 high-end companies.

High staff stability, low mobility.

UL/ISO9001/SGS/IATF16949/ROHS/ISO1400 certificated.

Sales office in Shenzhen and own 12,000sqm factory in Jiangxi.

Establish an e-commerce system to reduce transaction costs and increase market response speed.

Packing And Delivery Of 6 Layer ENIG Impedance Control PCB

If you are looking for a reliable rf pcb manufacturer, please contact us.

As a professional circuit board factory, hhcircuits has high-quality pcb boards for sale. Welcome to contact us if needed.